Production process of polytetrafluoroethylene glass fiber copper-coated laminated board

Abstract

The invention relates to the technical field of a circuit board, and particularly relates to a production process of a polytetrafluoroethylene glass fiber copper-coated laminated board. The production process comprises the steps of acquiring splicing sheets by virtue of glue preparation and glue application, then cutting and superimposing the splicing sheets, automatically combining the splicing sheets with a copper foil and a steel plate, automatically press fitting by virtue of a vacuum press under high temperature and high pressure condition, then autoamtically disassembling, and cutting the copper-foil-coated plate into the polytetrafluoroethylene glass fiber copper-coated laminated board. The production process overcomes the weaknesses that the traditional microwave circuit substrate material is difficult in hole metallization, the machinability is poor on the production line and the process is complicated and is easy for carrying out machining such as cutting, drilling and the like, the production process is also greatly simplified, the weaknesses of the existing domestic PTEE and glass cloth copper-coated plate are overcome, the current situation that the domestic high-frequency microwave substrate is mainly imported can be changed, and the demand of the highly informatization and high-speed development of the information processing in industries such as airspace, aviation, mobile phone receiving base station and the like can be satisfied.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a production process of polytetrafluoroethylene glass fiber copper-clad laminates. Background technique [0002] With the development of electronic products in the direction of miniaturization, high frequency, digitalization, and high reliability, epoxy resin boards are used as adhesive sheets in the processing of microwave high-frequency multilayer circuit boards, but their varieties are single and can be The solderability is low, and the dielectric loss is large, and the dielectric constant is high. When the circuit operating frequency is above 300MHz or even reaches 10GHz, the stability is extremely low. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a production process of polytetrafluoroethylene glass fiber copper-clad laminate to solve the problem that the substrate produced by the original process is no...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a production process of polytetrafluoroethylene glass fiber copper-clad laminate to solve the problem that the substrate produced by the original process is not stable in a wide frequency range and has a large dielectric loss. and other technical issues