Circuit board and preparation method thereof

Abstract

The invention discloses a preparation method for a circuit board. The preparation method comprises the following steps: a, performing chemical splitting treatment on fiberglass cloth; b, mixing epoxy resin adhesives A and B, and adding a metal compound for uniform stirring; c, placing the fiberglass cloth into the mixture obtained by uniform stirring in the step b for impregnation, and heating, pressing and shaping the fiberglass cloth into a substrate; d, performing high-temperature laser sintering on the substrate in the step c to convert the metal compound exposed from the surface of the substrate into metal ions, wherein multiple layers of substrates can be stacked after laser drilling on the substrate; e, carrying out a chemical plating process on the substrate subjected to high-temperature laser sintering in the step d to form a circuit on the substrate to conduct the front and back surfaces of the substrate. According to the preparation method, environment friendliness is achieved, machining time is shortened, and efficiency is improved; moreover, the metal compound is added during epoxy resin modulation, so that the resistance value and dielectric constant of the circuit board are more stable.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board and a preparation method thereof. Background technique [0002] Ordinary printed circuit boards are mostly manufactured by this method: impregnating a thermosetting resin such as epoxy resin into a base material such as glass fiber cloth, drying it to make a prepreg, and dispensing a single sheet of the prepreg as required After overlapping the copper foil, heat and press to form a laminate, or after overlapping multiple prepregs and overlapping copper foil as needed, heat and form it to form a laminate, and then use photolithography and etching or plating. A circuit pattern made of copper foil was formed on this laminated board. [0003] In the traditional circuit board manufacturing process, the etching process is used to form a circuit pattern composed of copper foil, which not only increases environmental pollution, is not conducive to environmental pr...

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Problems solved by technology

[0004] The invention proposes a circuit board and its preparation method to solve the technical problems of large environmental pollution, long processing time and low efficiency in the current traditional circuit board production process, and the resistance value and dielectric constant of the produced circuit board are not stable enough

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