Circuit board and preparation method thereof

A technology of circuit boards and substrates, which is applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of insufficient stability of circuit board resistance and dielectric constant, large environmental pollution, long processing time, etc., and achieve shortened processing time, reduce environmental pollution, and improve efficiency

Active Publication Date: 2015-04-29
深圳市铭新科技有限公司
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

[0004] The invention proposes a circuit board and its preparation method to solve the technical problems of large environmental pollution, long processing time and low efficiency in the current traditional circuit board production process, and the resistance value and dielectric constant of the produced circuit board are not stable enough

Method used

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  • Circuit board and preparation method thereof
  • Circuit board and preparation method thereof

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Embodiment Construction

[0024] Please refer to figure 1 Shown is a flow chart of the method for preparing the circuit board of the present invention.

[0025] The invention proposes a circuit board and its preparation method, which not only solves the technical problems of large environmental pollution, long processing time and low efficiency in the current traditional circuit board production process, but also the resistance value and dielectric constant of the produced circuit board are not stable enough, Moreover, a circuit board with more stable resistance value and dielectric constant is provided.

[0026] Wherein, the present invention provides a kind of preparation method of circuit board, wherein, this preparation method comprises the following steps:

[0027] Step 101: performing chemical fiber opening treatment on the glass fiber cloth;

[0028] Step 102: After mixing the epoxy resin glue A and glue B, add the metal compound and stir evenly; Step 103: Put the glass fiber cloth into the mi...

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Abstract

The invention discloses a preparation method for a circuit board. The preparation method comprises the following steps: a, performing chemical splitting treatment on fiberglass cloth; b, mixing epoxy resin adhesives A and B, and adding a metal compound for uniform stirring; c, placing the fiberglass cloth into the mixture obtained by uniform stirring in the step b for impregnation, and heating, pressing and shaping the fiberglass cloth into a substrate; d, performing high-temperature laser sintering on the substrate in the step c to convert the metal compound exposed from the surface of the substrate into metal ions, wherein multiple layers of substrates can be stacked after laser drilling on the substrate; e, carrying out a chemical plating process on the substrate subjected to high-temperature laser sintering in the step d to form a circuit on the substrate to conduct the front and back surfaces of the substrate. According to the preparation method, environment friendliness is achieved, machining time is shortened, and efficiency is improved; moreover, the metal compound is added during epoxy resin modulation, so that the resistance value and dielectric constant of the circuit board are more stable.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a circuit board and a preparation method thereof. Background technique [0002] Ordinary printed circuit boards are mostly manufactured by this method: impregnating a thermosetting resin such as epoxy resin into a base material such as glass fiber cloth, drying it to make a prepreg, and dispensing a single sheet of the prepreg as required After overlapping the copper foil, heat and press to form a laminate, or after overlapping multiple prepregs and overlapping copper foil as needed, heat and form it to form a laminate, and then use photolithography and etching or plating. A circuit pattern made of copper foil was formed on this laminated board. [0003] In the traditional circuit board manufacturing process, the etching process is used to form a circuit pattern composed of copper foil, which not only increases environmental pollution, is not conducive to environmental pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/03
CPCH05K3/0011H05K2203/107
Inventor 陈鹏陈永泽
Owner 深圳市铭新科技有限公司
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