Benzoxazine resin composition, prepreg made from same, copper-clad laminate and circuit board

A technology of resin composition and benzoxazine, which is applied in the fields of copper clad laminates and circuit boards, prepregs, and benzoxazine resin compositions, and can solve the dielectric constant and dielectric loss of undisclosed circuit board substrate materials, etc. problem, to achieve the effect of maintaining stable temperature coefficient of dielectric constant, fast information transmission rate, and good transmission signal integrity

Active Publication Date: 2019-05-31
ZIBO KERRBEN POLYMER NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Cage-shaped dendritic silicone resins are generally used in LED encapsulation adhesives to improve the toughness and mechanical strength of the encapsulation adhesives. There is no disclosure in the prior art that cage-shaped dendritic silicone resins are used to reduce the dielectric constant and dielectric constant of circuit board substrate materials. lost technical solutions

Method used

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  • Benzoxazine resin composition, prepreg made from same, copper-clad laminate and circuit board
  • Benzoxazine resin composition, prepreg made from same, copper-clad laminate and circuit board

Examples

Experimental program
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manufacture example

[0045] This manufacturing example is a preparation example of cage-type dendritic silicone resin, including the following steps:

[0046] (1) Synthesis of cage silicone resin:

[0047] Put 60g of trimethoxysilane, 28.4g of water, 1.32g of potassium hydroxide, and 100ml of ethanol into a 500ml three-necked flask, and perform a hydrolysis reaction with magnetic stirring at 25°C for 24 hours. After the reaction, the isopropanol was removed by rotary evaporation under reduced pressure at 50° C., and the hydrolyzate was dissolved with toluene. Then wash the toluene solution with saturated brine until neutral, remove the water layer after liquid separation, add anhydrous magnesium sulfate to the oil layer to remove water, filter the magnesium sulfate, remove the toluene at 65°C to obtain the cage-type hydrolyzate without catalyst impurities Silicone.

[0048] (2) 0.01mol of cage-type silicone resin obtained by step (1), 0.078mol of single-end vinyl silicone oil with benzene ring c...

Embodiment 1-3 and comparative example 1-3

[0062] Mix benzoxazine resin, phenolic resin, cage-type dendritic silicone resin, flame retardant, and inorganic filler according to the mixing ratio shown in Table 1, and obtain a molded body of 80mm×80mm×1.5mm by hot pressing.

[0063] The dielectric constant and dielectric loss tangent of the molded body obtained were measured according to Test Method 1 above. In addition, the above-mentioned test method 2 was used to measure the dielectric constant at various temperatures, and the temperature coefficient of dielectric constant ɑ was obtained through conversion. The measurement results are shown in Table 2, respectively.

[0064] Table 1

[0065]

[0066] Table 2

[0067]

[0068] As can be seen from Table 2, compared with the benzoxazine resin composition without adding cage-type dendritic silicone resin, the dielectric constant and dielectric constant of the benzoxazine resin composition adding cage-type dendritic silicone resin The electrical loss tangent is low...

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Abstract

The invention discloses a benzoxazine resin composition, comprising, by weight, 100 parts of benzoxazine resin, 10-30 parts of phenolic resin, and 1-10 parts of cage-like dendric organosilicon resin.In addition, the invention also discloses prepreg made from the benzoxazine resin composition, a copper-clad laminate comprising the prepreg, and a circuit board made with the copper-clad laminate. The benzoxazine resin composition has stable and low dielectric constant and dielectric loss even at a high temperature; the circuit board with a substrate material made from the benzoxazine resin composition has high information transmission rate and good signal transmission completeness.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a benzoxazine resin composition, a prepreg, a copper clad board and a circuit board made of the same. Background technique [0002] Copper Clad Laminate (Copper Clad Laminate, full name copper clad laminate, English abbreviation CCL), is made of wood pulp paper or glass fiber cloth as a reinforcing material, impregnated in resin prepreg, and then covered with copper foil on one or both sides , a product made by hot pressing, is the basic material of the electronics industry, mainly used for processing and manufacturing printed circuit boards (PCB). At present, copper clad laminates are developing in the direction of high performance, environmental protection and multifunctionality. This high performance is mainly manifested in high heat resistance, excellent dielectric properties, flame retardant and environmental protection, good dimensional stability, blocking ultraviolet ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L61/34C08L61/06C08L83/05C08J5/24B32B15/20B32B15/14B32B17/06B32B17/12B32B27/04H05K1/03
Inventor 王凯李建刚武克伟
Owner ZIBO KERRBEN POLYMER NEW MATERIAL
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