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Low-temperature co-fired ceramic material highly matched with high-temperature conductive silver paste and preparation method of low-temperature co-fired ceramic material

A low-temperature co-fired ceramic and conductive silver paste technology, applied in the field of electronic devices and LTCC substrates, can solve the problems of poor matching and poor consistency of high-temperature conductive silver paste, and achieve stable dielectric constant and loss, good matching, and substrates. Good flatness effect

Active Publication Date: 2018-01-19
昆明云基新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The sintering temperature of the low-temperature co-fired ceramic material in the examples is sintered at 880°C, while the melting point of the high-temperature conductive silver paste is at 900°C, which is poorly compatible with the high-temperature conductive silver paste and has poor consistency.

Method used

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  • Low-temperature co-fired ceramic material highly matched with high-temperature conductive silver paste and preparation method of low-temperature co-fired ceramic material
  • Low-temperature co-fired ceramic material highly matched with high-temperature conductive silver paste and preparation method of low-temperature co-fired ceramic material
  • Low-temperature co-fired ceramic material highly matched with high-temperature conductive silver paste and preparation method of low-temperature co-fired ceramic material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～ Embodiment 2

[0035] The following examples are carried out according to the following steps:

[0036] S1: the raw materials CaO, B 2 o 3 , SiO 2 , La 2 o 3 Weigh analytically pure CaO, B according to the formula in Table 1 2 o 3 , SiO 2 , La 2 o 3 , the mixed powder is dry-mixed in a vibrating ball mill for 6 hours, and the weight ratio of material: agate ball in the ball milling mixing step is 1:4, and after mixing evenly, pass through a 60-mesh sieve;

[0037] S2: Pour the mixed powder sieved in step S1 into a platinum crucible, and then keep it warm at 1350-1500°C for 1-3 hours to completely melt and homogenize it;

[0038] S3: Quenching the melt in the crucible in step S2 into deionized water to obtain transparent cullet;

[0039] S4: Crushing the cullet through a pulverizer to obtain finer vitreous bodies;

[0040] S5: Perform wet ball milling on the finer glass body in step S4, the weight ratio of material: ball: water is 1:4:1.5, the ball milling time is 8 hours, the spee...

Embodiment 3

[0053] On the basis of Example 1-2, uniformly coat conductive silver paste on the surface of the green body described in step S7, and carry out debinding. The heating rate is increased to 850° C. for sintering, and after 15-30 minutes of heat preservation, the furnace is naturally cooled to room temperature to obtain the low-temperature co-fired ceramic substrate.

[0054] The low-temperature co-fired ceramic material shrinkage rate that embodiment 1-2 makes is 14%, and the shrinkage rate scope of high-temperature (830 ℃~860 ℃) conductive silver paste is 12~15%, and the shrinkage rate of low-temperature co-fired ceramic material and silver paste The rate range is basically the same, and the overall performance of the material prepared in Example 1-2 is better, so the matching degree of the low-temperature co-fired ceramic material and the high-temperature conductive silver paste is very high after co-firing. The effect diagram of the substrate obtained after co-firing is shown...

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Abstract

The invention discloses a low-temperature co-fired ceramic material highly matched with high-temperature conductive silver paste and a preparation method of the low-temperature co-fired ceramic material. The low-temperature co-fired ceramic material is prepared by sintering the following components in percentage by mass (100% in total): 35%-50% of CaO, 30%-45% of B2O3 and 15%-25% of SiO2. The prepared low-temperature co-fired ceramic material contains a large quantity of microfine crystal grains (CaSiO3) and a small amount of glass and is typical microcrystalline glass ceramic; and the low-temperature co-fired ceramic material is low in dielectric constant and extremely low in loss, good in matching rate with high-temperature conductive silver paste, good in panel flatness and good in comprehensive property, and the dielectric constant and the loss in multiple frequency bands are stable.

Description

technical field [0001] The invention relates to the technical field of electronic devices and LTCC (low temperature co-fired ceramics) substrates, in particular to a low-temperature co-fired ceramic material highly matched with high-temperature conductive silver paste and a preparation method thereof. Background technique [0002] LTCC technology is a new type of material developed by Hughes in 1982. This technology is to make low-temperature sintered ceramic powder into a thick, precise and dense green ceramic belt, and use laser drilling, micro-hole grouting, and precision conductors on the green ceramic belt. Paste printing and other processes produce the required circuit patterns, and multiple passive components (such as capacitors, resistors, filters, impedance converters, couplers, etc.) are embedded in multilayer ceramic substrates, and then laminated together. Silver, copper, gold and other metals can be used for the inner and outer poles, and sintered at 900°C to ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/057C04B35/653C03C10/06
Inventor 吴双袁俊武
Owner 昆明云基新材料有限公司
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