The invention relates to the technical field of PCBA packaging, discloses a PCBA packaging method and equipment based on a fixed glue spraying
assembly, and aims to solve the technical problems of complex wiring, high mechanical loss and inconvenience in maintenance in a mobile packaging scheme of an existing glue spraying
assembly. The PCBA packaging method comprises the steps that a glue spraying
assembly sprays a UV glue solution to a target glue spraying area of a PCBA, and a curing
irradiation assembly irradiates the PCBA to cure the UV glue solution to form a packaging layer; wherein the glue spraying assembly comprises a plurality of rows of independently-controlled piezoelectric spraying holes, the positions of the piezoelectric spraying holes are fixed in the whole spraying process, and
full coverage of a target glue spraying area is achieved only by driving the PCBA to move. The PCBA packaging equipment comprises a support, a conveying mechanism, a fixedly-arranged glue spraying assembly and a curing
irradiation assembly, the conveying mechanism drives a PCBA to move along a preset path, and it is ensured that a target glue spraying area is exposed under the glue spraying assembly in sequence or repeatedly. According to the invention, the wiring structure of the glue spraying assembly is simplified, the
mechanical wear is reduced, the equipment reliability and maintenance convenience are improved, the precision and efficiency of PCBA packaging are ensured through synchronous curing and precise
movement control, and the method is especially suitable for selective protection packaging of a low-height PCBA board with the maximum height of an
electronic component smaller than 1cm.