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Fabrication method of covered-type flexible-rigid board by laser depth control

A soft-rigid combination board and production method technology, applied in the direction of multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit structural connection, etc., can solve problems such as poor grinding board, improve production efficiency, improve cutting efficiency, guarantee quality effect

Inactive Publication Date: 2018-10-02
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem of poor grinding of the existing soft-hard board after resin plugging holes, and provides a method for manufacturing a laser-controlled deep-cover uncovered soft-hard board. This method effectively protects the soft board area from being sprayed Erosion and mechanical abrasion

Method used

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Embodiment

[0024] This embodiment provides a method for manufacturing a laser-controlled depth-revealing type soft-rigid combination board. The production of hard bonded boards, the specific process is as follows:

[0025] (1) Cutting: According to the panel size of 520mm×620mm, the soft board core board and the hard board core board are cut out. The thickness of the soft board core board is 0.1mm, and the thickness of the outer copper foil is 0.5OZ. The soft board core board includes The soft board area and the soft-hard combination area; the thickness of the hard board core board is 0.18mm, and the thickness of the outer copper foil is 0.5OZ.

[0026] (2), inner layer circuit production (negative film process): inner layer graphics transfer, use vertical coating machine to coat photosensitive film, the film thickness of photosensitive film is controlled to 8μm, adopt automatic exposure machine, with 5-6 grid exposure ruler ( 21-grid exposure ruler) to complete the exposure of the inne...

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Abstract

The invention discloses a fabrication method of a covered-type flexible-rigid board by laser depth control. The fabrication method comprises the following steps of respectively fabricating inner-layercircuits of a flexible core board and a rigid core board, wherein the flexible core board comprises a flexible board region and a flexible-rigid region; attaching a coverage film onto the flexible board region on the flexible core board in an alignment way; laminating the flexible core plate and the rigid core board by non-flowing glue PP to form a generation plate, and forming a window in a position, corresponding to the flexible board region, on the non-flowing glue PP; sequentially fabricating an outer-layer circuit and a welding-resistant layer on the production plate, and performing surface processing; and performing depth-control cutting on a position, corresponding to the circumference of the flexible board region, on the production plate by employing a laser cutting mode, and removing a part, corresponding to the flexible board region, on the rigid core board after uncovering to fabricate the flexible-rigid board. With the adoption of the method, the flexible board region is effectively prevented from being bitten by a medium, and mechanical wear and scrap are effectively prevented.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing a laser-controlled depth-revealing type rigid-flex board. Background technique [0002] The rigid-flex board has both the characteristics of FPC and PCB. Therefore, it can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which saves the internal space of the product and reduces the The volume of the finished product is of great help to improve the performance of the product. The existing method of making soft-rigid boards generally adopts the method of opening windows, that is, the part of the hard board corresponding to the soft board area is directly cut off and then pressed together, so that the soft board area will be exposed outside after pressing. Problems such as mechanical scratches and alkaline potion erosion are prone to occur in the subsequent proce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/46H05K3/36H05K1/14
CPCH05K3/4691H05K1/147H05K3/361
Inventor 许娟娟彭卫红孙保玉翟青霞
Owner SHENZHEN SUNTAK MULTILAYER PCB
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