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Preparation method of fluorine-containing resin mixture film and copper-clad plate

A technology for preparing fluorine-containing resins and films, which is applied in the field of communication materials, can solve the problems of poor mechanical properties, unstable dielectric constant, and low fracture strength of copper clad laminates, and achieve improved dispersion, stable dielectric constant, and interaction force enhanced effect

Active Publication Date: 2019-06-14
久耀电子科技(江苏)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The invention provides a preparation method of a fluorine-containing resin mixture film and a copper-clad laminate, which solves the problem that PTFE with poor performance is difficult to be used, and that the copper-clad laminate prepared by using it has poor mechanical properties, low fracture strength and unstable dielectric constant. The problem of poor adhesion

Method used

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  • Preparation method of fluorine-containing resin mixture film and copper-clad plate
  • Preparation method of fluorine-containing resin mixture film and copper-clad plate
  • Preparation method of fluorine-containing resin mixture film and copper-clad plate

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Effect test

Embodiment 1

[0032] The number of prepregs used is 5, the models of the prepregs used are prepreg 2116 and prepreg 7628, and the number of copper foils is 2. The combination sequence from top to bottom is copper foil, PTFE fluorine-containing resin mixture film, Prepreg 2116, PTFE fluorine-containing resin mixture film, prepreg 7628, prepreg 2116, prepreg 7628, PTFE fluorine-containing resin mixture film, prepreg 2116, PTFE fluorine-containing resin mixture film, copper foil. The pressing temperature is 150°C and the pressure is 150kg / cm 2 , The pressing time is 52h.

[0033] The fluorine-containing resin mixture includes the following raw materials in parts by weight: 30 parts of fluorine-containing resin emulsion, 70 parts of inorganic filler, 15 parts of coupling agent, and 15 parts of improver.

[0034] Preparation of modification reagent: mix pyromellitic dianhydride and nano-silica, stir mechanically for a certain period of time, weigh a certain amount of 4,4′-diaminodiphenyl ether,...

Embodiment 2

[0038] The number of prepregs used is 5 sheets, the models of prepregs used are prepreg 2116 and prepreg 7628, the number of copper foil sheets is 2 sheets, and the order of combination is copper foil and PTFE fluorine-containing resin mixture film from top to bottom. , Prepreg 2116, Prepreg 7628, Prepreg 2116, Prepreg 7628, Prepreg 2116, PTFE fluorine-containing resin mixture film, copper foil. The pressing temperature is 150°C, the pressure is 150kg / cm2, and the pressing time is 52h.

[0039] The fluorine-containing resin mixture includes the following raw materials in parts by weight: 60 parts of fluorine-containing resin emulsion, 80 parts of inorganic filler, 10 parts of coupling agent, and 5 parts of improver.

[0040] Preparation of modification reagent: mix pyromellitic dianhydride and nano-silica, stir mechanically for a certain period of time, weigh a certain amount of 4,4′-diaminodiphenyl ether, divide it into 3 equal parts, and store it in a helium-protected enviro...

Embodiment 3

[0044] The number of sheets of prepreg used is 5 sheets, the number of sheets of copper foil is 2 sheets, the type of prepreg used is prepreg 106, prepreg 7628, the number of sheets of copper foil is 2 sheets, and the order of combination is copper from top to bottom. Foil, PTFE fluororesin mixture film, prepreg 106, PTFE fluorine resin mixture film, prepreg 7628, prepreg 106, prepreg 7628, PTFE fluorine resin mixture film, prepreg 2116, PTFE fluorine resin mixture film, copper foil. The pressing temperature is 430°C, the pressure is 100kg / cm2, and the pressing time is 24h.

[0045] The fluorine-containing resin mixture includes the following raw materials in parts by weight: 40 parts of fluorine-containing resin emulsion, 90 parts of inorganic filler, 12 parts of coupling agent, and 10 parts of improver.

[0046] Preparation of modification reagent: mix pyromellitic dianhydride and nano-silica, stir mechanically for a certain period of time, weigh a certain amount of 4,4′-di...

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Abstract

The invention discloses a preparation method of a fluorine-containing resin mixture film and a copper-clad plate. The preparation method comprises the following steps: preparing a uniform dispersion solution of a fluorine-containing resin mixture; and uniformly dispersing the fluorine-containing resin mixture solution on PTFE (polytetrafluoroethylene), and performing baking and drying to obtain the fluorine-containing resin mixture film of PTFE; then preparing the copper-clad plate by using the fluorine-containing resin mixture film of the PTFE; the method of invention aims to utilize PTFE with poorer performance, a unique film preparation technology is adopted, the problems of poor thermal stability, poor mechanical properties, poor cohesiveness, poor strength and the like of the copper-clad plate caused by the problems of PTFE are solved, the finally obtained copper-clad plate has low hygroscopicity, stable dielectric constant and low transmission loss, the peel strength and the adhesiveness of the product are both at a high level, meanwhile, resource utilization is achieved, and waste is avoided.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a preparation method of a fluorine-containing resin mixture film and a copper-clad board. Background technique [0002] Nowadays, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. As one of the key materials in the information electronics industry, copper clad laminates are widely used in communication base stations, satellites, vending machines, computers, mobile phones, wearable devices, driverless cars, drones, intelligent robots and other fields. [0003] The substrate material will be the main key to the high frequency of circuit signal transmission, especially the copper clad substrate material technology. The DK and Df of the existing copper clad laminate are relatively high. Even if the circuit design is improved, it cannot fully meet all high frequency req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08F8/00C08F14/26C08L27/18C08L27/12C08K13/06B32B15/082B32B15/20B32B27/32B32B37/06B32B37/10
Inventor 詹浩赵莉民
Owner 久耀电子科技(江苏)有限公司
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