High-frequency double-sided copper-clad dielectric board and preparation method thereof

A double-sided copper-clad, dielectric board technology, applied in the direction of chemical instruments and methods, lamination, layered products, etc., can solve the problems of high power and signal loss in the circuit system, achieve good consistency, simple preparation process, and low production cost low effect

Inactive Publication Date: 2019-09-27
宁波瑞法新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The higher the Df, the higher the power and signal loss of the circuit system

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A high-frequency double-sided copper-clad dielectric board provided in this embodiment includes two layers of copper foil and an insulating dielectric layer between the two layers of copper foil. The insulating dielectric layer includes 60 parts by weight of resin material and glass 5 parts of fiber material, wherein the resin material includes 40 parts of polytetrafluoroethylene resin, 20 parts of fluorinated polyethylene, 10 parts of thermosetting cyanate resin, 2 parts of polyphenylene ether resin, 1 part of epoxy resin, 5 parts by weight lubricant, 1 part curing agent.

[0020] The glass fiber material includes 50 parts of silicon dioxide, 20 parts of mica, 5 parts of silicon carbide, 15 parts of zinc oxide, 8 parts of magnesium oxide, 5 parts of aluminum oxide, 6 parts of boron nitride and 30 parts of zirconium oxide in parts by weight.

[0021] The preparation method of the above-mentioned high-frequency double-sided copper-clad dielectric board includes the follo...

Embodiment 2

[0028] A high-frequency double-sided copper-clad dielectric board provided in this embodiment includes two layers of copper foil and an insulating dielectric layer between the two layers of copper foil. The insulating dielectric layer includes 70 parts by weight of resin material and glass 10 parts of fiber material, wherein the resin material includes 50 parts of polytetrafluoroethylene resin, 30 parts of fluorinated polyethylene, 15 parts of thermosetting cyanate resin, 5 parts of polyphenylene ether resin, 5 parts of epoxy resin, 10 parts lubricant, 3 parts curing agent.

[0029] The glass fiber material includes 60 parts of silicon dioxide, 30 parts of mica, 15 parts of silicon carbide, 25 parts of zinc oxide, 10 parts of magnesium oxide, 10 parts of aluminum oxide, 10 parts of boron nitride and 40 parts of zirconium oxide in parts by weight.

[0030] The dielectric constant of the high-frequency double-sided copper-clad dielectric board obtained in this embodiment is 2.2,...

Embodiment 3

[0032] A high-frequency double-sided copper-clad dielectric board provided in this embodiment includes two layers of copper foil and an insulating dielectric layer between the two layers of copper foil. The insulating dielectric layer includes 65 parts by weight of resin material and glass 10 parts of fiber material, wherein the resin material includes 45 parts of polytetrafluoroethylene resin, 25 parts of fluorinated polyethylene, 12 parts of thermosetting cyanate resin, 4 parts of polyphenylene ether resin, 2 parts of epoxy resin, 8 parts lubricant, 2 parts curing agent.

[0033] The glass fiber material includes 55 parts of silicon dioxide, 25 parts of mica, 8 parts of silicon carbide, 18 parts of zinc oxide, 10 parts of magnesium oxide, 8 parts of aluminum oxide, 8 parts of boron nitride and 35 parts of zirconia in parts by weight.

[0034] The dielectric constant of the high-frequency double-sided copper-clad dielectric board obtained in this embodiment is 2.2, and the lo...

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PUM

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Abstract

The invention discloses a high-frequency double-sided copper-clad dielectric board. The high-frequency double-sided copper-clad dielectric board comprises two layers of copper foil and an insulating medium layer located between the two layers of copper foil; the insulating medium layer comprises, by weight, 60-70 parts of a resin material and 5-10 parts of a glass fiber material, wherein the resin material comprises, by weight, 40-50 parts of polytetrafluoroethylene resin, 20-30 parts of fluoropolyethylene, 10-15 parts of thermosetting cyanate resin, 2-5 parts of polyphenyl ether resin, 1-5 parts of epoxy resin, 5-10 parts of a lubricant and 1-3 parts of a curing agent. According to the high-frequency double-sided copper-clad dielectric board and a preparation method thereof, the preparation process is simple, the production cost is low, the dielectric constant during batch production is stable, and the consistency is good; the high-frequency double-sided copper-clad dielectric board has the advantages that high temperature resistance, aging resistance and radiation resistance are obtained, and the dielectric constant is precise. Finally, the dielectric constant of the obtained high-frequency double-sided copper-clad dielectric board is 2.2, and the loss tangent is 0.0009.

Description

technical field [0001] The invention relates to a copper-clad dielectric board, in particular to a high-frequency double-sided copper-clad dielectric board and a preparation method thereof. Background technique [0002] Copper-clad dielectric boards are the core basic materials of high-frequency circuit boards such as radars, 5G base stations, and satellite positioning, accounting for more than 37% of the total cost. However, at present, all domestic products rely on imports, and overseas manufacturers impose a technical blockade on my country. [0003] Circuit boards are currently the largest field of application of high-frequency double-sided copper-clad dielectric boards, and their stability requirements are extremely high. High-frequency and high-speed circuit boards need to have three characteristics: 1. Low transmission loss; 2. Low transmission delay; 3. High-precision control of characteristic impedance. Printed circuit boards that meet the requirements of high-fre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B15/14B32B15/20B32B17/06B32B33/00B32B37/06B32B37/10B32B38/16
CPCB32B5/02B32B15/14B32B15/20B32B17/061B32B33/00B32B37/06B32B37/10B32B38/164B32B2260/021B32B2260/046B32B2262/101B32B2307/206B32B2307/212B32B2307/552
Inventor 李想
Owner 宁波瑞法新材料有限公司
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