The invention discloses a MEMS device packaging method based on LCP multilayer stacking technology, which is characterized in that the MEMS device is obtained by sputtering, photolithography, etching, electroplating and other processes on a double-sided polished silicon substrate, and at the same time Form silicon grooves that are easy to lead out and have accurate alignment; based on the LCP multilayer stacking technology, on the multilayer LCP substrate, the cap part of the device package is obtained through laser scribing, alignment, lamination and other processes; the device and the cap Package without assistance, high-precision integration, and obtain MEMS devices with low loss and good airtightness. The MEMS device of the invention has the advantages of low loss, high isolation and good airtightness. This method can better provide packaging protection for MEMS devices with movable parts, and is especially suitable for miniaturization applications of microwave, millimeter wave communication, radar and other systems / subsystems, and belongs to the realization of miniaturization, high performance microwave communication, radar systems / The key technology of the subsystem.