The utility model discloses a
silicon material slice spraying device with a novel positioning structure, which relates to the technical field of
silicon material slice
processing and comprises a right-angle bent plate, a water inlet
pipe is arranged on the outer surface of one side of the right-angle bent plate, a
water diversion plate is arranged in the water inlet
pipe, and a water outlet groove is arranged on the outer surface of the bottom of the water inlet
pipe. A water inlet pipe connector is arranged on the outer surface of the water inlet pipe, a bent pipe connector is arranged at the
tail end of the water inlet pipe connector, a supporting flat plate is arranged at the top end of the water inlet pipe, and a first long bent plate is arranged on the lower side of the water inlet pipe. According to the novel
silicon material slice spraying device with the positioning structure,
water flow sprayed in the water inlet pipe can be controlled and adjusted through the arranged water distribution plate and the water outlet adjusting plate, so that a curtain-shaped
water curtain can be formed at the liquid outlet, the
water flow is uniform in size, continuous and consistent, and free of a flow cutoff phenomenon, and sufficient cooling of a
cutting line is ensured; and the risk of line breaking in the
wafer cutting process caused by non-uniform cooling is prevented, and the yield of output is improved.