521 results about "Thermo mechanical" patented technology

Embodiments of the present invention provide a cost effective electrostatic chuck assembly capable of operating over a wide temperature range in an ultra-high vacuum environment while minimizing thermo-mechanical stresses within the electrostatic chuck assembly. In one embodiment, the electrostatic chuck assembly includes a dielectric body having chucking electrodes which comprise a metal matrix composite material with a coefficient of thermal expansion (CTE) that is matched to the CTE of the dielectric body.

A transfer printing process that exploits the mismatch in mechanical or thermo-mechanical response at the interface of a printable micro- or nano-device and a transfer stamp to drive the release of the device from the stamp and its non-contact transfer to a receiving substrate are provided. The resulting facile, pick-and-place process is demonstrated with the assembling of 3-D microdevices and the printing of GAN light-emitting diodes onto silicon and glass substrates. High speed photography is used to provide experimental evidence of thermo-mechanically driven release.

Methods are provided for fabricating silicon carriers with conductive through-vias that allow high-yield manufacture of silicon carrier with, low defect density. In particular, methods are provided which enable fabrication of silicon, carries with via diameters such as 1 to 10 microns in diameter for a vertical thickness of less than 10 micrometers to greater than 300 micrometers, which are capable robust to thermal-mechanical stresses during production to significantly minimize the thermal mechanical movement at the via sidewall interface between the silicon, insulator, liner and conductor materials.

The present invention relates to a soft thermoplastic elastomer composition that is free of thermoplastic resin that can be utilized in manufacturing shoe sole inserts, seals, gaskets, wheels, and that can be overmolded on a hard substrate, such as a metal or a thermoplastic resin, for grips or handles on various household items. The present invention more specifically discloses a thermoplastic elastomer composition that is made by a process comprising: (1) mixing (A) a block copolymer comprising a first polymeric block that is comprised of repeat units that are derived from a vinyl aromatic monomer and a second block that is comprised of repeat units that are derived from a conjugated diolefin monomer, wherein the repeat units in the second block are hydrogenated, and wherein the repeat units in the second block are elastomeric in nature, (B) a crosslinkable elastomer, and (C) an oil, to produce an un-crosslinked three component blend; and (2) dynamically crosslinking the crosslinkable elastomer in the un-crosslinked three component blend during a thermo-mechanical mixing step; wherein the thermoplastic elastomer composition is void of thermoplastic resins.

A light fixture (10), having a circuit board (20) having first and second major surfaces (20a and 20b); at least one light emitting diode (25) mounted on the first major surface (20a) of the circuit board (20); an enclosure (30) formed of a material having two major surfaces (30a and 30b) and a thermo-mechanical design constant of at least 20 mm-W/m*K and shaped so as to define an opening (32) and a cavity (33), one of the major surfaces (30a) of the material defining the surface of the cavity (33) and the enclosure (30) positioned so as to enclose the second major surface (20b) of the circuit board (20); a heat spreader (40) having a surface area at least twice that of the circuit board and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader (40) positioned in thermal contact with both the circuit board (20) and the enclosure (30).

An inventive energy harvesting apparatus may include a ferromagnetic material and/or a shape memory alloys to convert thermal energy to mechanical energy to electrical energy. The apparatus is subjected to a thermal gradient to cause beams to bend thus creating stress/strain in a piezoelectric material, or creating magnetic flux in a magnetic path. The charges created in this process can be transferred to electrical batteries.

A thermal treatment process for improving thermo-mechanical properties of ceramic matrix composite materials such as silicon carbide (SiC) matrix composites is described. The treatment process removes excess silicon and/or other process-related defects from the SiC-based matrix as well as the fiber interfacial coating. This invention can be practiced with minimal strength loss for as-fabricated composites formed from high-strength continuous-length ceramic and carbon-based fibers that are functionally stable to 1600° C. and above. The invention provides a method for significantly improving composite thermal conductivity and creep resistance, and for reducing composite porosity. It has been demonstrated using state-of-the-art 2D woven SiC/SiC composites containing Sylramic-iBN SiC fibers, boron-nitride-based interfacial coatings, and hybrid matrices that are based on SIC formed by chemical vapor infiltration (CVI) and by a combination of CNI, SiC particulate infiltration, polymer infiltration and pyrolysis, and melt infiltration of silicon, silicon-based alloys, and silicides.

This invention discloses novel method and apparatus for producing vacuum glass. The method comprises: producing isolated supporting points between glass panels and airtight sealing layers at the edges of glass panels by screen printing process, sealing the edges, exhausting, sealing the exhaust mouth, baking, examining, and framing. The softening temperature and thermal and mechanical properties of the low-melting-point glass used for isolated supporting points and airtight sealing layers, and the thickness of isolated supporting points should precisely match the thickness of airtight sealing layers. The exhaust and sealing apparatus comprises: a sealed vacuum chamber for fixing the surface of the vacuum glass panel with exhaust holes downward onto the sealing table, and a movable ejection pin with an electric heating device below the exhaust holes; or a bell jar with a sealing ring, and movable ejection pin with an electric heating device below the exhaust holes. After exhausting, the ejection pin heats the metal plate sintered with low-melting-point glass to the sealing temperature of the low-melting-point glass, and seals by tip layering onto the exhaust holes.

A method of producing high strength nanophase metal alloy powder by cryomilling metal powder under conditions which cause the formation of intrinsic nitrides, and of producing high strength metal articles by subjecting the nitrided cryomilled powder to thermo-mechanical processing. The intrinsic nitrides present within the alloy significantly reduce grain growth during thermo-mechanical processing, resulting in formed metal products of high strength and improved ductility.

A flip-chip ball grid array integrated circuit package with improved thermo-mechanical properties is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. A semiconductor die is flip-chip mounted to the first surface of the substrate and electrically connected to ones of the conductive traces. An intermetallic heat spreader is fixed to a back side of the semiconductor die and a plurality of contact balls are disposed on the second surface of the substrate. The contact balls are in the form of a ball grid array and ones of the contact balls of the ball grid array are electrically connected to ones of the conductive traces.

There is an increasingly intense need to harness solar energy due to an ever growing shortage of conventional energy sources, The instant invention is concerned with method and apparatus for solar concentrator micro-mirrors on solar power satellites and the moon to focus and reflect large quantities of solar energy. Method and apparatus are taught for directly reflecting solar energy to the Earth; reflecting solar energy to a microwave converter in space which transmits microwave energy to the Earth; and reflecting solar energy to a laser radiation converter which beams laser radiation to the Earth. The concentrated energy received at the Earth may be converted directly to electricity or indirectly by thermo-mechanical means. The advantages and disadvantages of the different means of sending such concentrated energy to the Earth are discussed. A particularly important objective of this invention is the focussing of sunlight for solar power conversion and production. The instant invention can contribute to the goal of achieving environmentally clean solar energy on a large enough scale to be competitive with conventional energy sources.

The invention discloses low-yield ratio and high-strength steel for bridges and a manufacturing method thereof. The steel comprises the following chemical components by weight percent : 0.06-0.10 percent of C, 0.20-0.45 percent of Si, 1.20-1.50 percent of Mn, no more than 0.010 percent of P, no more than 0.0020 percent of S, 0.30-.060 percent of Ni, 0.20-0.50 percent of Cu, 0.15-0.50 percent of Mo, 0.025-0.060 percent of Nb, no more than 0.035 percent of Ti, 0.020-0.040 percent of Alt, and Fe and unavoidable impurities in balancing amount. According to the invention, through smelting, refining, performing a reasonable thermo-mechanical control process (TMCP) and optimizing tempering heat treatment production, the tensile strength of the steel is 700-780 MPa, the yield strength is 530-600MPa, the extensibility is greater than or equal to 18 percent, the yield ratio is less than or equal to 0.80, and 40 below zero DEG C low-temperature longitudinal impact is greater than or equal to 100 J, so that the steel is good in obdurability matching and low in the yield ratio, is provided with excellent performance of shock prevention, and is stable in production process and strong in operability.

The invention discloses an organic/inorganic composite porous isolating membrane, which comprises a porous substrate with holes, and an organic/inorganic composite layer arranged on at least one surface or a partial surface area of the porous substrate, wherein the organic/inorganic composite layer is a layer of a mixture of inorganic particles and adhesive polymer; the inorganic particles are interconnected and are fixed through the adhesive polymer; and gaps among the inorganic particles form holes. In the organic/inorganic composite layer of the organic/inorganic composite porous isolating membrane, a weight ratio of the inorganic particles with good thermol stability to the adhesive polymer is between 80 percent: 20 percent and 99.5 percent: 0.5 percent; and the organic/inorganic composite layer has good supporting function. Therefore, the organic/inorganic composite porous isolating membrane has high thermo-mechanical stability.

Thermal barrier coated RF radomes and a method for making the same are provided. In an embodiment of the disclosure, there is provided a method for making a thermal barrier coated radio frequency (RF) radome. The method comprises providing a radio frequency (RF) radome. The method further comprises applying a thermal barrier coating having a dielectric constant less than about 2.0 onto a surface of the radome to form a thermal barrier coated RF radome. The thermal barrier coating reduces a structure temperature of the radome by greater than 300 degrees Fahrenheit to enhance thermo-mechanical properties and performance of the RF radome.

A system and method for integrating sidecar liquid cooling components in-row with associated computer equipment enclosures is disclosed. It includes a fail-safe baffle to exhaust air, a transition frame and containment plenum. It uses standard hose configurations and includes a thermo-mechanical switch, not requiring power to open the component door.

Recrystallized lead and lead alloy positive current collectors and connectors such as straps and lugs for use e.g. in lead acid batteries and electrowinning anodes, having an increased percentage of special grain boundaries in at least part of the microstructure, which have been provided by a process comprising of (i) cold or hot rolling or cold or hot extrusion or (ii) steps of deforming the lead or lead alloy, and subsequently annealing the lead or lead alloy. Either a single cycle of working and annealing can be provided, or a plurality of such cycles can be provided. The amount of deformation, the recrystallization time and temperature, and the number of repetitions of such steps are selected to ensure that a substantial increase in the population of special grain boundaries is provided in the microstructure, to improve resistance to creep, intergranular corrosion and intergranular cracking of the current collectors and connectors during battery service, and result in extended battery life and the opportunity to reduce the size and weight of the battery.

Surface mount packages having pre-applied underfill thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.

The method relates to an 800 MPa-grade low-yield-ratio structural steel plate and a production method thereof. The steel comprises the chemical components in percentage by weight: 0.045 to 0.075 percent of C, 0.30 to 0.55 percent of Si, 1.55 to 1.95 percent of Mn, less than or equal to 0.01 percent of P, less than or equal to 0.0025 percent of S, 0.012 to 0.035 percent of Al, 0.15 to 0.25 percent of Cr, 0.15 to 0.3 percent of Mo, 0.2 to 0.4 percent of Cu, 0.2 to 0.4 percent of Ni, 0.008 to 0.04 percent of Nb, 0.008 to 0.04 percent of V, 0.008 to 0.03 percent of Ti, 0.0008 to 0.0015 percent of B, and the balance of Fe and inevitable impurities. The steel is subjected to RH vacuum treatment, ladle furnace (LF) external refining, full protection casting, a thermo mechanical control process (TMCP), and tempering heat treatment to form the steel plate with low yield ratio, high strength and high work hardening rate. The steel plate has the thickness specification of between 10 and 40 mm, the yield strength of more than or equal to 550MPa, the tensile strength of more than or equal to 800 MPa and the yield ratio of less than 0.70, and has excellent low temperature compact performance, cold forming performance and welding performance.

A drive actuator for a measurement instrument having a probe, the drive actuator including a heating element in a thermally conductive relationship with the probe such that application of electric current to the heating element modifies a characteristic of the probe. The probe device includes a probe including a cantilever having a lever made of a material having a selected thermal expansivity and a drive actuator in operable cooperation with the cantilever lever made of a material having a thermal expansivity different than the thermal expansivity of the material of which the cantilever lever is made.

Presented herein is a method of manufacturing a three-dimensional ophthalmic lens using additive manufacturing. The method includes constituting voxels of one or more compositions, wherein at least one of the compositions includes one or more pre-polymers or polymers, and inducing connectivity between the voxels, thereby creating one or more incremental elements, repeating the constitution steps, and performing a final post-treatment. Also presented herein is an ophthalmic lens obtained by this method. The lens has good homogeneity and optical clarity, reduced shrinkage, and improved geometric accuracy and thermo-mechanical properties.

In a semiconductor system (100) including a chip (101) and a workpiece (102), the chip has metal-filled vias (140) positioned between contact pads (120) and the respective edges (110). In addition, seals against microcracks (150) and thermo-mechanical stress (151) are located between the vias and the active components, and sometimes also between the vias and the respective nearest edge. Workpiece (102) may be another semiconductor chip or a substrate; it has contact pads (170) matching the locations of the vias (140). The chip is vertically stacked on the workpiece so that each contact pad (170) is aligned and in electrical contact with the corresponding via (140).