Solder bump interconnect for improved mechanical and thermo mechanical performance

A technology of bump structure and metal under bump, which is applied in the direction of semiconductor/solid-state device components, semiconductor devices, electrical components, etc., and can solve problems such as overlap
CN101636831AActive Publication Date: 2010-01-27HUATIAN TECH KUNSHAN ELECTRONICS
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
HUATIAN TECH KUNSHAN ELECTRONICS
Publication Date
2010-01-27

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Abstract

An apparatus and method for a semiconductor package including a bump on input-output (IO) structure are disclosed involving a device pad, an under bump metai pad (UBM), a polymer, and a passivation layer. The shortest distance from the center of the device pad to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.5:1 to 0.95:1. Also, the shortest distance from the center of the polymer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.85:1. Additionally, the shortest distance from the center of the passivation layer to its outer edge, and the shortest distance from the center of the UBM to its outer edge are in a ratio from 0.35:1 to 0.80:1.
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Description

[0001] related application

[0002] This application claims priority and benefit to U.S. Provisional Application Serial No. 60 / 913,337, filed April 23, 2007, and U.S. nonprovisional Application Serial No. 12 / 107,009, filed April 21, 2008, by reference The full text of the two is combined here. US Provisional Application Serial No. 60 / 913,337 is related to PCT Patent Application Serial No. PCT / US05 / 39008 filed October 28, 2005, which is hereby incorporated by reference in its entirety. PCT / U505 / 39008 relates to and claims the benefit of US Provisional Patent Application Serial No. 60 / 623,200, filed October 28, 2004, which is hereby incorporated by reference in its entirety.

[0003] This application includes material that is subject to copyright protection. The copyright owner has no objection to the facsimile reproduction by anyone of the patent disclosure document as it appears in the Patent and Trademark Office files or records, but otherwise reserves all copyright rights wh...

Claims

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