Mixture containing fluororesin and prepreg prepared from same, and copper clad laminate

A technology of fluorine-containing resin and prepreg, which is applied in the field of communication materials, can solve the problems of high processing temperature of PTFE system, unfavorable continuous industrial production, and unsuitable for sustainable development, and achieve high peel strength of copper foil, good industrial production basis, Ease of mass production and large-scale production

Active Publication Date: 2017-06-16
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the release operation adds additional process steps, which is not conducive to continuous industrial production; the PTFE system has high processing temperature, difficult processing, and high energy consumption, which does not meet the fundamental requirements of sustainable development

Method used

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  • Mixture containing fluororesin and prepreg prepared from same, and copper clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Weigh 50 parts of polytetrafluoroethylene emulsion (DuPont Teflon ® PTFE DISP30, solid content 60%), 120 parts tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion (DuPont Teflon ®PFAD 335D, solid content 60%), 30 parts of silicon oxide (Xinyi Hongrun), 10 parts of aluminum oxide (Zibo Hengbang) and 3 parts of coupling agent KH550 (Nanjing Shuguang Chemical General Factory) were stirred and mixed to obtain a uniform Dispersion liquid; diluent acetone is added so that the solid content of the dispersion liquid is controlled at about 60wt / v%. Using 1080 glass fiber cloth, dipping in the uniform dispersion of the above-mentioned fluorine-containing resin mixture, and then baking to obtain a prepreg. The first stage baking temperature is 100 o C, the time is 3min, the second stage baking temperature is 250 o C, the time is 5min; take 8 pieces of prepreg and 4 pieces of DuPont Kapton ® XP film and 3 sheets of DuPont Kapton ® The 6051 laminated film is pu...

Embodiment 2

[0028] Weigh 60 parts of polytetrafluoroethylene emulsion (DuPont Teflon ® PTFE DISP30, solid content 60%), 110 parts perfluoroethylene propylene emulsion (DuPont Teflon ® FEPD121, solid content 54%), 35 parts of silicon oxide (Xinyi Hongrun), 15 parts of alumina (Zibo Hengbang) and 3 parts of coupling agent KH550 (Nanjing Shuguang Chemical General Factory), and get uniform dispersion by mixing liquid; add diluent acetone so that the solid content of the dispersion is controlled at about 60wt / v%. Using 1080 glass fiber cloth, dipping in the uniform dispersion of the above-mentioned fluorine-containing resin mixture, and then baking to obtain a prepreg. The first stage baking temperature is 100 o C, the time is 3min, the second stage baking temperature is 210 o C, the time is 8min; take 8 pieces of prepreg and 7 pieces of DuPont Kapton ® The F film is stacked together, and the two sides are respectively attached with loz copper foil, and the pressure is 60~100kg / cm 2 , ...

Embodiment 3

[0030] Weigh 50 parts of polytetrafluoroethylene emulsion (DuPont Teflon ® PTFE DISP30, solid content 60%), 60 parts tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion (DuPont Teflon ® PFAD 335D, solid content 60%), 50 parts perfluoroethylene propylene (DuPont Teflon ® FEPD121, solid content 54%), 35 parts of titanium oxide (Tianjin Zhongzheng Huamei Technology), 10 parts of aluminum oxide (Zibo Hengbang) and 3 parts of coupling agent KH550 (Nanjing Shuguang Chemical General Factory), uniformly dispersed by stirring and mixing liquid; add diluent acetone so that the solid content of the dispersion is controlled at about 20wt / v%. Using 1080 glass fiber cloth, dipping in the uniform dispersion of the above-mentioned fluorine-containing resin mixture, and then baking to obtain a prepreg. The first stage baking temperature is 100 o C, the time is 3min, the second stage baking temperature is 230 o C, the time is 7min; take 8 pieces of prepreg and 4 pieces of ...

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Abstract

The invention specifically relates to a mixture containing fluororesin and a preparation method thereof, belonging to the field of communication materials. A prepreg prepared by impregnating a glass fabric in dispersion liquid of the mixture containing fluororesin and then carrying out drying and the like has uniform glue content, good impregnation quality, strong resin adhesion, smooth surface and appropriate toughness and viscosity. The invention also relates to a high-frequency copper clad laminate prepared from the prepreg, or a film or copper foil made of the mixture containing fluororesin. The prepared copper clad laminate has good thermal-mechanical properties, excellent dielectric properties and high copper foil strength, and can meet requirements on the comprehensive properties of substrate materials in the field of high-frequency communication. According to the invention, the processing properties of traditional fluororesin are greatly improved by using fluorine-containing resin with a low melting point; and a coupling agent is cooperatively used, so interaction between an inorganic filling material and glass fabric and a resin matrix is improved, dispersibility of the inorganic filling material, processing aids and the like in the fluororesin is enhanced, and the overall performance of the copper clad laminate is made more stable.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a fluorine-containing resin mixture with low dielectric constant and low dielectric loss and a preparation method thereof, and also relates to a prepreg prepared from the fluorine-containing resin mixture, and further relates to a prepreg made of the fluorine-containing resin mixture. The prepared high frequency copper clad laminate. Background technique [0002] Nowadays, the information electronics industry is in a stage of rapid development and is gradually becoming one of the pillar industries of various countries. As one of the key materials in the information electronics industry, copper clad laminates are widely used in communication base stations, satellites, vending machines, computers, mobile phones, and even emerging wearable devices, driverless cars, drones, and intelligent robots. [0003] Due to its unique chemical structure, polytetrafluoroethyle...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K13/04C08K7/14C08K3/22C08K3/36C08K5/544C08J5/24B32B17/02B32B27/04B32B17/10B32B17/06B32B25/14B32B15/20B32B27/32B32B27/34B32B27/28B32B27/38B32B27/36B32B27/40B32B27/42B32B27/30
CPCB32B5/02B32B15/14B32B15/20B32B25/10B32B27/12B32B27/28B32B27/30B32B27/32B32B27/34B32B27/36B32B27/38B32B27/40B32B27/42B32B2260/021B32B2260/046B32B2262/101C08J5/24C08J2327/18C08J2427/18C08L27/18C08L2205/025C08L2205/03C08K13/04C08K7/14C08K2003/2227C08K3/36C08K5/544C08K2003/2241
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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