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94results about How to "Improve warpage resistance" patented technology

Polyphenylether composite material, and preparation method and application thereof

InactiveCN103122136AImprove warpage resistanceEasy to operateImpellerReinforcement - action
The invention is applicable to the field of new materials, and provides a polyphenylether composite material, a preparation method and application thereof. The polyphenylether composite material provided by the invention is specifically used for an impeller or guide blades of a hot water pump. Usually, the maximum temperature in the hot water pump can be up to 150-170 DEG C, so that the impeller and guide blades thereof are commonly formed by metal processing; and buckling deformation can exist ordinarily in case of a general high molecular resin alloy material, followed by damage caused by a large amount of friction occurring between the impeller and the inside of a motor or even the breakdown of the whole water treatment system. According to the polyphenylether composite material provided by the invention, through the coordination and combination of being used with polyphenylether, polyethylene, elastomer, polyolefin, silicone master batches and the like, and under the reinforcement action of special glass fibers, the polyphenylether composite material has superhigh physical and mechanical properties; and the high-temperature buckling resistance of the polyphenylether composite material product can be obviously improved. Thus, the invention can be applicable to an impeller or guide blades of a hot water pump.
Owner:SHENZHEN WOTE ADVANCED MATERIALS

Reinforced flame-retardant low-warpage PBT alloy material and preparation method thereof

The invention discloses a reinforced flame-retardant low-warpage PBT alloy material and a preparation method thereof. The alloy material comprises the following components in parts by weight: 35-50 parts of polybutylene terephthalate, 5-15 parts of polycarbonate, 15-30 parts of glass fiber, 5-15 parts of an inorganic filler, 5-20 parts of a compound flame retardant, 5-10 parts of a toughening agent, 0.2-0.4 parts of a compound antioxidant, 0.1-0.3 parts of a lubricant, 0.1-0.3 parts of an ester exchange inhibitor, and 0.1-0.3 parts of an anti-dripping agent. The preparation method comprises the following steps: uniformly mixing all the materials except the glass fiber at a high speed, respectively feeding the mixed material and the glass fiber into a main feeding hole and a side feeding hole of a double-screw extruder, and finally forming the material. The amorphous polymer PC is introduced into the raw materials, so that the crystallinity of the system is reduced, the warping propertyof the PBT material is improved, and the PBT can be reinforced and toughened; and a compound flame retardant is introduced, so that the product has a flame-retardant characteristic. Finally, the PBT/PC alloy material has good mechanical properties, flame retardance and warping resistance, so that the application range of the PBT/PC alloy material in the fields of high-grade electrical components,household electrical shells and the like is expanded.
Owner:中广核瑞胜发(厦门)新材料有限公司

Pressure sensitive adhesive composition and product thereof

The invention relates to a pressure sensitive adhesive composition. The pressure sensitive adhesive composition comprises acrylate copolymer which is prepared from a first monomer mixture containing carboxyl-containing monomer and has side carboxy groups, wherein the content of the carboxyl-containing monomer ranges from, by weight, 0.1% to 10%, and provided that the total weight of the first monomer mixture which forms the acrylate copolymer having the side carboxy groups is 100%, the glass-transition temperature Tg of the acrylate copolymer having the side carboxy groups is equal to or greater than minus 55 DEG C and less than or equal to minus 30 DEGC. The pressure sensitive adhesive composition further comprises acrylate oligomer and terpenic tackifying resin, wherein the weight-average molecular weight of the acrylate oligomer is greater than or equal to 20, 000Da, the glass-transition temperature Tg of the acrylate oligomer is greater than or equal to 25 DEG C, and provided that the total weight of the acrylate copolymer having the side carboxy groups and the acrylate oligomer is 100%, the content of the acrylate oligomer ranges from 1%-25%, and the content of the terpenic tackifying resin ranges from 1% to 20%. The pressure sensitive adhesive composition achieves high peel strength at the room temperature and high cohesion at the high temperature simultaneously and excellent warping resistance and blistering resistance.
Owner:3M INNOVATIVE PROPERTIES CO

Process for producing semiconductor devices, and semiconductor device

InactiveCN105377980AImprove heat resistanceExcellent resistance to temperature cyclingEpoxySemiconductor chip
A process for semiconductor device production which comprises: a preparation step in which a substrate for element mounting (108) equipped with a plurality of package areas (114) separated by dicing regions (112) is prepared; a mounting step in which semiconductor chips (116) are mounted respectively on the package areas (114) of the substrate for element mounting (108); a molding step in which the semiconductor chips (116) are simultaneously encapsulated by molding with an encapsulating epoxy resin composition; and a chip formation step in which the resultant structure is diced along the dicing regions (112) to separate the individual encapsulated semiconductor chips (116). The encapsulating epoxy resin composition comprises (A) an epoxy resin, (B) a hardener, (C) a silicone resin, (D) an inorganic filler, and (E) a hardening accelerator, wherein the silicone resin (C) is a branched silicone resin that is a methylphenyl-type thermoplastic silicone resin and has repeating structural units represented by general formulae (a), (b), (c), and (d). (In the formulae, symbol * indicates a bond with the Si atom contained in a repeating structural unit of another or the same kind; and R1a, R1b, R1c, and R1d are each a methyl or phenyl group and may be the same as or different from one another. The content of Si-bonded phenyl groups is 50 mass% or higher of the molecule, and the content of Si-bonded OH groups is less than 0.5 mass% of the molecule.) The formulae is shown in the specification.
Owner:SUMITOMO BAKELITE CO LTD

Thermosetting anti-welding printing ink with low dielectric constant and dielectric loss and preparation method of thermosetting anti-welding printing ink

The invention provides thermosetting anti-welding printing ink with low dielectric constant and dielectric loss and a preparation method of thermosetting anti-welding printing ink. The preparation method comprises the steps of reacting by virtue of long-carbon-chain aliphatic diamine monomers, aromatic diamine monomers with acid groups, aromatic dianhydride monomers with the acid groups and mono-anhydride monomers with the acid groups, cyclizing polyamide acid to obtain modified polyimide, and finally crosslinking modified polyimide with a hardening agent, so as to prepare the thermosetting anti-welding printing ink, wherein the dielectric constant of the thermosetting anti-welding printing ink is less than 3, the dielectric loss of the thermosetting anti-welding printing ink is less than 0.01, and the thermosetting anti-welding printing ink is applicable to high-frequency electronic equipment. Besides, tests show that the thermosetting anti-welding printing ink prepared by virtue of the preparation method has the characteristics of good electrical property, rupture resistance, welding resistance, warping resistance, flame resistance, acid resistance, alkali resistance and organic solvent resistance, low moisture rate and the like.
Owner:TAIFLEX SCI

Continuous fiber enhanced PEEK (Polyether-Ether-Ketone) resin and forming method thereof

The invention provides continuous fiber enhanced PEEK (Polyether-Ether-Ketone) resin and a forming method thereof, and belongs to the field of the forming method of PEEK resin, and solves the problemsof an existing fiber enhanced PEEK forming method that continuous fiber cannot be prepared, and the mechanical performance of a prepared product is poor. The forming method comprises the following steps: firstly, mixing a dispersing agent with PEEK ultrafine powder, and then putting and dispersing the mixture in a high-speed dispersing machine, thus obtaining a premix; secondly, putting and dispersing purified water, the premix and a suspending agent in the high-speed dispersing machine, thus obtaining a dispersing solution; finally, putting the dispersing solution in an impregnating tank provided with ultrasonic dispersion, enabling the continuous fiber to pass through the impregnating tank, dispersing the continuous fiber under the action of ultrasonic waves, then extruding residual suspending solution through a smooth pair roller, drying, melting and rolling, thus obtaining the continuous fiber enhanced PEEK resin. The invention also provides the continuous fiber enhanced PEEK resin obtained through the forming method. The continuous fiber enhanced PEEK resin prepared through the forming method has excellent mechanical performance and excellent warping resistance.
Owner:JILIN ZHONGYAN HIGH PERFORMANCE PLASTIC

Flame-retardant glass fiber reinforced polyethylene terephthalate (PET)/ polytrimethylene terephthalate (PTT)/ polybutylene terephthalate (PBT) alloy material and preparation method thereof

The invention relates to a flame-retardant glass fiber reinforced polyethylene terephthalate (PET)/ polytrimethylene terephthalate (PTT)/ polybutylene terephthalate (PBT) alloy material and a preparation method thereof. The alloy material comprises the following raw materials in part by weight: 10 to 30 parts of PET, 10 to 30 parts of PTT, 20 to 40 parts of PBT, 3 to 10 parts of compatilizer, 5 to 20 parts of composite flame retardant, 0.1 to 0.5 part of antioxidant, 0.1 to 0.5 part of lubricating agent, and 10 to 30 parts of glass fibers. The preparation method comprises the following steps of: putting all the raw materials into an efficient mixer, mixing the raw materials for 5 to 10 minutes, and then discharging the uniformly mixed raw materials; and putting the uniformly mixed raw materials into a screw extruder, and performing extrusion and water cooling granulation. The produced PET/ PTT/ PBT alloy has the characteristics of excellent flame-retardant performance, high crystallization speed, good comprehensive physical and mechanical performance, low shrinkage rate, stable size, low warping, high surface glossiness, excellent processing performance and the like, and can be used for replacing a flame-retardant reinforced PBT material or bakelite under certain occasions.
Owner:SHANGHAI SUNNY
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