69results about How to "Solve warping" patented technology

The invention belongs to the technical field of integrated circuit packaging, and particularly relates to a resin-based gallium arsenide radio frequency chip fan-out packaging method. Comprising the following steps: using a temporary bonding support plate as a slide glass; coating photolysis temporary bonding glue on the slide glass in a spin coating mode, curing the photolysis temporary bonding glue, and then protecting the temporary bonding glue on the front surface by using a metal protection layer; bonding the back surfaces of the two heterogeneous gallium arsenide radio frequency chips to the front surface of the metal protection layer through a bonding layer; using a wafer-level plastic packaging process to package and wrap the two heterogeneous gallium arsenide radio frequency chips so as to form a first plastic packaging layer; performing laser or mechanical punching on the first plastic package layer to expose the metal protection layer so as to form a first plastic package through hole; and filling the first plastic package through hole to form a filler. According to the invention, the manufacturing cost of the chip is reduced, the miniaturization of the size of the chip is realized, the heat dissipation of the chip can be effectively enhanced by the high-heat-dissipation conductive layer on the back surface, and the performance of a system is improved.

The invention provides a packaging substrate structure and a preparation method thereof. The preparation method comprises the following steps: providing a core plate layer; forming a multilayer substrate adding layer covering two opposite surfaces of the core plate layer and electrically connected with the core plate layer; providing an interconnection structure layer which comprises a bottom circuit layer, a bottom dielectric layer and a middle interconnection layer; pressing the interconnection structure layer in a preset area of the substrate adding layer in an inverted manner to obtain a required substrate structure layer; solder mask layers are formed on the two opposite faces of the substrate structure layer, contact holes are formed in the preset positions of the solder mask layers, and at least one contact hole exposes the conductive part of the interconnection structure layer. According to the invention, packaging with finer lines, lighter and lighter weight and higher line density can be realized, and signal transmission loss can be substantially reduced at the same time. Besides, the packaging substrate structure has high design flexibility, and the thickness and the circuit density of the interconnection structure layer can be accurately controlled by adjusting the thickness, the number of layers and the circuit design of each dielectric layer and each circuit layer so as to meet specific packaging requirements.

The utility model relates to the technical field of brazing clamps, and provides a brazing clamp for a copper-clad plate, the brazing clamp comprises a plurality of clamping plates and a plurality of locking pieces, at least one of every two adjacent clamping plates is provided with a limiting groove with an opening facing the other clamping plate, and the limiting grooves are used for containing copper foil of the copper-clad plate so as to limit the copper foil; and the plurality of locking pieces are used for locking and fixing the plurality of clamping plates and the copper-clad plate together. According to the brazing clamp for the copper-clad plate, the limiting grooves are formed in the clamping plates, so that the periphery of the copper foil is limited through the limiting grooves in the brazing process, thermal expansion of the copper foil is hindered, and after brazing is finished, the shrinkage degree of the copper foil is close to that of the ceramic substrate; the residual stress caused by large thermal expansion difference between the copper foil and the ceramic substrate is greatly eliminated, and the problem of warping of the ceramic substrate is solved.

The embodiment of the invention relates to the field of photovoltaic technology, and provides a photovoltaic module, which comprises a solar cell and a solder strip, N first grid lines extending along a first direction are arranged on a first surface of the solar cell, and second grid lines are arranged on a second surface of the solar cell; through lines are arranged on the first face of the solar cell and comprise the first through line and the second through line, and the first through line is connected to the first grid line to the Ath first grid line which are arranged in the second direction. The second through line is connected to the Nth first grid line to the (N-B) th first grid line which are arranged in the second direction; one end of the welding strip is connected to the Cth first grid line to the N-Dth first grid line which are arranged in the second direction, and the other end of the welding strip is connected to the second grid line of the other solar cell. The photovoltaic module provided by the embodiment of the invention is at least beneficial to reducing the warping problem of the battery pieces in the photovoltaic module.

The utility model provides an electronic paper point screen crimping device which comprises at least one group of crimping modules and specifically comprises a driving module which comprises an X-direction driving mechanism and a Y-direction driving mechanism, and the Y-direction driving mechanism is arranged on the X-direction driving mechanism; the crimping module is installed on the Y-direction driving mechanism and comprises an opening-closing type driving mechanism, an upper crimping assembly and a lower crimping assembly, the upper crimping assembly and the lower crimping assembly are symmetrically arranged in the vertical direction, and the opening-closing type driving mechanism drives the upper crimping assembly and the lower crimping assembly to move oppositely or reversely; each of the upper crimping assembly and the lower crimping assembly comprises a fixed part, a floating part and a buffer structure connected with the fixed part, a probe is arranged in the fixed part, and the floating part is provided with a through hole for the probe to pass through; when the distance L1 between the upper crimping assembly and the lower crimping assembly is reduced to L2, the floating part pre-flattens the crimping end of the to-be-crimped product and completes correction and alignment; the buffer structure deforms, so that the floating part stops moving and the fixed part continuously moves until the upper probe and the lower probe are in contact with the surface of the product; and the visual unit is arranged above the crimping module. And the crimping precision and accuracy are improved.

The present invention discloses a preparation method of a COB integrated board, including: S1, mounting a driver IC: mounting a driver IC on the first surface of a PCB substrate, and passing through a reflow soldering furnace; S2, vacuum pretreatment: vacuum pretreatment is performed on the PCB substrate obtained in step S1 to make its warped surface flat; S3, mounting a light-emitting chip: mounting the light-emitting chip on the second surface of the PCB substrate, and passing through a reflow soldering furnace to obtain a COB integrated board. The present invention mounts the driver IC first, and then mounts the LED light-emitting chip. The LED light-emitting chip only needs to pass through a reflow soldering furnace once. Compared with the LED light-emitting chip passing through a reflow soldering furnace twice in the prior art, its dark light rate, dead light rate, and wrong light rate are greatly reduced, and its service life and reliability are greatly improved; and vacuum adsorption flattens the warped PCB board, further improving the mounting accuracy of the LED light-emitting chip. The present invention also provides an LED light board, including a COB integrated board and a potting glue. The present invention also provides a COB display module, including an LED light board, a box, a power supply, a hub board, and a bottom shell, which has high reliability and stable use.

A composite cover plate and a display device are provided, the composite cover plate has a visible area and a peripheral area located on at least one side of the visible area, and the composite cover plate comprises a plastic substrate, a decorative layer, a supporting layer and a shielding layer. The plastic substrate has a haze in the range of 10% to 30%, and has a thickness in the range of 50 [mu] m to 250 [mu] m. The decorative layer is attached to the surface of the plastic substrate, has a thickness in the range of 16 [mu] m to 24 [mu] m, and has an optical density in the range of 1.5 to 2.5. The peripheral area of the composite cover plate is defined by the vertical projection of the decorative layer. The supporting layer is provided with an upper layer surface and a lower layer surface. The upper layer surface is bonded to the plastic substrate and the decorative layer. The masking layer is attached to the lower layer surface and has an optical density in the range of 5.0 to 6.2. The L * of the CIELAB color space of the peripheral region of the composite cover plate measured by the plastic substrate is in the range of 90 to 96. Therefore, the decorative layer can achieve a sufficient decorative effect, and the peripheral area of the composite cover plate can achieve sufficient brightness.

The utility model provides a crimping module, comprising an opening and closing type driving mechanism which comprises a first driving end and a second driving end, and the first driving end and the second driving end are configured to synchronously drive so as to move towards each other or in opposite directions; the upper crimping assembly and the lower crimping assembly are symmetrically arranged in the vertical direction and are respectively mounted on the first driving end and the second driving end, each of the upper crimping assembly and the lower crimping assembly comprises a fixed part, a floating part and a buffer structure connected with the fixed part and the floating part, a probe is arranged in the fixed part, and the floating part is provided with a through hole for the probe to pass through; when the upper floating part and the lower floating part are in contact with the product to be crimped, compression continues to enable the buffer structure to generate elastic deformation, the floating parts stop moving, and the fixing part continues moving until the upper probe and the lower probe penetrate through the through holes to be in contact with the surface of the product. Through the innovative design of the fixing part, the floating part and the buffer structure, the electronic paper can be pre-flattened before crimping operation, so that the problem of inaccurate crimping alignment caused by bending and warping of the electronic paper is effectively solved.

The invention relates to a cylindrical battery top cover assembly and an assembling method thereof, and a battery cell comprising the top cover assembly. The top cover assembly comprises a T-shaped pole terminal, an upper plastic part, a top cover sheet, an inclined plane sealing ring, a lower plastic part, a compression ring and a confluence disc, the disc part provides a wide welding surface, the cylinder is used for connecting the compression ring and the confluence disc, and the welding reliability and stability are enhanced. And the compression ring and the confluence plate are sleeved on the cylinder of the pole terminal and are firmly connected with the pole terminal in a laser welding manner. The design of the inclined plane sealing ring enables the sealing ring to distribute stress more uniformly when the sealing ring is stressed, sealing failure is avoided, the assembly method comprises the steps of stacking the assemblies, applying pressure to the confluence plate to compress the sealing ring, and welding the compression ring, the confluence plate and the pole terminal in the state that the sealing ring is compressed, so that efficient and stable connection among the assemblies is realized, and the assembly efficiency is improved. Therefore, the sealing performance, the electrical connection reliability and the long-term stability of the battery are improved.

According to the chip, the preparation method thereof and the electronic equipment, the first oxide layer can be used for blocking electric leakage transmitted from the grid electrode to the first doped cap layer, the electric leakage of the grid electrode is prevented from being further transmitted to the source electrode and the drain electrode, and therefore the reliability of a TDGB grid is improved, and the performance of a transistor is improved. The chip comprises a transistor, and the transistor comprises a channel layer, a first doped cap layer and a grid electrode which are sequentially arranged on a substrate. The transistor further comprises a first oxide layer, and the first oxide layer is located on the periphery of the first doped cap layer and surrounds the first doped cap layer. The material of the first oxide layer and the material of the first doped cap layer have at least two identical elements.

The invention relates to a manufacturing process of a PU square carpet, and belongs to the technical field of flame-retardant carpets. The manufacturing process comprises the following steps: firstly, preparing a flame-retardant ultraviolet absorbent, mixing the ultraviolet absorbent with nylon slices, carrying out melt spinning, then preparing a carpet surface blank layer by using the flame-retardant nylon yarns, and finally, carrying out thermocuring treatment at different temperatures to solve the warping problem in the carpet manufacturing process. The finally prepared carpet has good ultraviolet ray absorption capability and flame retardant capability; the flame-retardant ultraviolet absorbent used in the PU square carpet manufacturing process has good ultraviolet absorption capacity and good stability and is insoluble in water, so that the flame-retardant ultraviolet absorbent can take effect for a long time, and the effect cannot be weakened due to maintenance and cleaning; besides, environment-friendly materials which are nontoxic and harmless to human bodies are adopted in the preparation process of the PU square carpet, internal flame-retardant components cannot volatilize, harmful gas is not generated during combustion, and the PU square carpet is harmless to the human bodies.

The utility model discloses corrugated paper production cutting equipment, which belongs to the technical field of corrugated paper production and comprises a workbench, a support is fixedly connected to the top of the workbench, a pair of second electric push rods is fixedly connected to the top of the workbench, and the second electric push rods on the two sides are distributed on the two sides of the support. Meanwhile, the output end of the second electric push rod is fixedly connected with an upper pressing plate, and the inner side wall is fixedly connected with the upper pressing plate. According to the corrugated paper production cutting equipment, through cooperation of the sliding grooves, the supporting columns, the positioning rings, inner holes, plug pins and limiting rings, the effect of positioning corrugated paper with different widths is achieved, and through cooperation of a second electric push rod, a connecting plate, an upper pressing plate, a lower pressing plate, a spring, a fixing rod and a roller, the corrugated paper with different widths can be cut off through the cooperation of the second electric push rod, the connecting plate, the upper pressing plate, the lower pressing plate, the spring, the fixing rod and the roller. And the effect of leveling the corrugated paper before and after cutting is achieved, the problem that due to the fact that the corrugated paper is different in size, deviation occurs in the conveying process, and cutting errors are caused is solved, and meanwhile the problem that edge warping occurs in the cutting process is solved.

The utility model relates to a high stability temperature compensation quartz crystal oscillator, including the crystal base and the lower ceramic base of upper and lower stacking, the crystal base lower part has an upper recess, and the compensation chip is installed in this upper recess, the lower ceramic base upper part has a lower recess, and the quartz chip is installed in this lower recess, and the upper recess and the lower recess butt joint and splice to form an inner chamber, and the quartz chip includes quartz wafer, the quartz wafer is composed of fixed section wafer and turning section wafer, and one end of the fixed section wafer is provided with the bending turning section wafer. The utility model can reduce the difference between the temperature perceived by the compensation chip and the environmental temperature of the quartz wafer, provide accurate temperature compensation frequency, achieve the high stability of the frequency when temperature transient, and the quartz wafer with corner structure is designed, and under the double action of the corner structure and the partition through -hole, the stability of the quartz wafer work can be effectively improved.

The present application provides a PCB structure, including a first core board, an adhesive layer, and a second core board that are stacked, the second core board and the first core board are bonded by the adhesive layer, the thermal expansion coefficient of the second core board is smaller than the thermal expansion coefficient of the first core board, a circuit layer is provided on the surface of the first core board, and there is no circuit layer between the adhesive layer and the second core board. The present application changes the thermal expansion coefficient of the entire PCB structure by providing at least one second core board with a smaller expansion coefficient than the first core board among the multiple first core boards, so as to improve the overall rigidity of the PCB structure and solve the warping problem of the PCB structure during the reflow soldering process. At the same time, the present application also provides a method for manufacturing a PCB structure and an electronic device.

The present invention discloses an auxiliary installation device for a bushing-type electronic transformer for a ring network cabinet, wherein a main box is installed on one side of the transformer body, a sliding plug is symmetrically and slidably installed inside the main box, a pull rod is installed in the middle of the side end face of the sliding plug, and the pull rod is slidably connected to the main box, a frame rod is slidably installed on the end of the pull rod, one end of the frame rod is rotatably installed with a limited seat, and the other end of the frame rod is rotatably installed with a base. The present invention improves the stability of various orientation bolts installed on the transformer body, improves the balance of load force provided by each bolt, effectively solves the warping and misalignment phenomena, indirectly improves the stability of the transformer body in later use, and can make the torsional force borne by the bolts during installation more compatible and matched with the compressive performance of the ring network cabinet and the transformer body, effectively avoids the thread slippage phenomenon, and improves the flexibility, efficiency, convenience, reliability and efficiency of the bolt assembly work.

An exemplary method of packaging a substrate may include rotationally aligning a substrate to a predetermined angular position. A method may include transferring a substrate to a metering station. A method may include measuring a topology of a substrate at a metering station. The method may include applying a first suction force to the substrate to flatten the substrate. A method may include generating a mapping of a die pattern on an exposed surface of a substrate. The method may include transferring a substrate to a printing station. The method may include applying a second suction force to the substrate to flatten the substrate against a surface of the printing station. The method may include adjusting a printing pattern based on a mapping of die patterns. The method may include printing a printing pattern on an exposed surface of a substrate.

The embodiment of the utility model belongs to the technical field of display modules. The utility model further relates to a TP display module which comprises a backlight metal frame, the backlight metal frame is provided with a main screen FPC and a touch control FPC body located on one side of the main screen FPC, the touch control FPC body is provided with a copper foil conductive area, and the copper foil conductive area and the touch control FPC body are both connected with the backlight metal frame. Through the arrangement of the copper foil conductive area, the connection stability and strength of the touch FPC main body and the backlight metal frame are improved, the problem that the touch FPC main body may be torn off or warped when being stressed is effectively avoided, the improvement enables the module to be more reliable in the transportation, installation and use process, defective products are reduced, the production efficiency is improved, and the production cost is reduced. The whole quality of the product is improved, the copper foil conductive area is made of copper foil, the copper foil is used as a metal conductive material, the surface of the copper foil generally has good adhesion, and the copper foil is used in cooperation with the conductive double-sided tape.

The invention discloses a production process and device of composite paper with excellent warping degree, for a process from a PET base film to a PET laser aluminized film part, a chemical layer coating and low-temperature drying process is added after mold pressing so as to prevent the composite paper from warping; the chemical layer is a waterborne polyurethane compound; when the chemical layer is coated, the temperature of the coating box is 40-60 DEG C, so that the laser information weakening caused by the influence of the temperature on the laser layer can be avoided. According to the invention, the process from the PET base film to the PET laser aluminum laminated film is mainly improved, and a chemical layer coating process and a low-temperature drying process are added after mold pressing, so as to prevent the composite paper from warping. The chemical layer is made of a waterborne polyurethane compound, and the drying temperature of the chemical layer is 40-60 DEG C. Under the temperature zone, after the chemical layer is dried, the influence on laser information on the PET mould pressing laser film is small, and the phenomenon that the laser layer is influenced by the temperature to cause'extinction 'is prevented.

The invention provides a chip-to-wafer bonding structure with a chip supporting function and a preparation method of the chip-to-wafer bonding structure. According to the method, a polysilazane solution is adopted as a precursor, chip gaps are selectively filled through a spin-coating process, and then the polysilazane solution is converted into a silicon dioxide supporting structure. And the warping problem caused by high temperature and thick film deposition is avoided by utilizing the characteristics of high efficiency and normal-temperature treatment of the spin-coating process. The height of the supporting layer can be accurately controlled by controlling spin-coating parameters, formation of redundant film layers on the top of the chip is avoided, and the subsequent process is simplified. The formed silicon dioxide supporting structure is completely compatible with a standard semiconductor process, chip splitting in the thinning process can be effectively prevented, and the process reliability and economical efficiency are improved. The problems of wafer warping, low process efficiency, high cost and the like caused by filling silicon dioxide through chemical vapor deposition in the prior art are solved.

This utility model discloses a photovoltaic-thermal module for an evaporator, including a photovoltaic module, a heat absorber plate, a heat absorption channel, and a frame. A junction box is provided inside the photovoltaic module. The heat absorber plate is fixedly connected to the back of the photovoltaic module, and the heat absorption channel is fixedly connected to the heat absorber plate. Refrigerant circulates within the heat absorption channel. The heat absorption channel includes a manifold and branch pipes. The manifold has a closed design at both ends and is connected to a connecting pipe. The branch pipes are internally threaded thin tubes with a diameter of 3-10 mm. Both ends of the branch pipes are connected to the manifold, and one or more semi-circular bends are provided along the length of the same branch pipe. Using this photovoltaic-thermal module significantly reduces the risk of photovoltaic panel deformation and microcracks in the solar cells, simplifies the manufacturing process, reduces costs, and optimizes heat exchange efficiency.

This application discloses a composite fixing structure for fixing a PCB, comprising: a carrier plate with multiple adsorption holes; a first abutment edge and a second abutment edge fixedly disposed on the periphery of the carrier plate; multiple pressure blocks disposed on the first abutment edge; a venting plate fixedly disposed below the carrier plate, the venting plate including a normally venting area and a first venting area; a first through hole in the first venting area selectively connected to or disconnected from a vacuum pump, and the first through hole in the first venting area opens or closes progressively from the side closer to the normally venting area to the side farther away from the normally venting area; and a pressure plate movably disposed above the carrier plate; the projection of the pressure plate on the carrier plate in a first direction is longer than the length of the carrier plate in the first direction, and the projection at least covers a portion of the first venting area. This composite fixing structure organically integrates vacuum adsorption and mechanical pressing, and can adaptively adjust the adsorption area and pressing position according to the PCB size, ensuring fixing reliability.

Steam chamber and semiconductor package module and power conversion device including the same. The steam chamber for a semiconductor package module according to an embodiment can include a lower metal plate, a hollow structure, and an upper metal plate sequentially disposed. The lower metal plate can include a first plate, a second plate, and a third plate sequentially disposed. A coefficient of thermal expansion of the second plate can be less than a coefficient of thermal expansion of the first plate or the third plate.

The invention provides a manufacturing method of a packaging structure, the packaging structure and electronic equipment, and relates to the technical field of semiconductors. The method comprises the steps that a first substrate structure is provided, the first substrate structure comprises a first surface and a second surface, a first packaging layer is formed on the first surface, and a first carrier plate is arranged on the second surface; a second substrate structure is provided, the second substrate structure comprises a third surface and a fourth surface, a second packaging layer is formed on the third surface, and a second carrier plate is arranged on the fourth surface; bonding the first packaging layer and the second packaging layer; removing the first support plate and the second support plate, forming a first stacking layer on the second surface of the first substrate structure, and forming a second stacking layer on the fourth surface of the second substrate structure; the first packaging layer and the second packaging layer are de-bonded, so that the first stacking layer and the second stacking layer can be manufactured at the same time, the first packaging structure and the second packaging structure are obtained, the processing efficiency is improved, and the warping problem caused by an asymmetric structure is solved.

The utility model belongs to the technical field of glass production, and particularly discloses a warping wheel device for glass production. The problem that the detection of the ISRA defect detector is influenced by the warping phenomenon of the glass plate is solved. The warping wheel device is located on a glass conveying roller way on the upstream of the ISRA defect detector and comprises a supporting support, a pressure adjusting support used for adjusting the height of the warping wheel and the warping wheel used for making contact with the upper surface of glass, the supporting support is fixedly connected with a glass conveying roller way support, the top end of the pressure adjusting support is connected with the supporting support, and the top end of the pressure adjusting support is connected with the warping wheel. The warping wheel is rotationally connected with the bottom end of the pressure regulating bracket through a rotating shaft, and the rotating direction of the warping wheel is opposite to that of the glass conveying roller. The device has a simple structure, is convenient to operate, is beneficial to keeping the glass flat, and solves the warping problem of thin glass, so that the light source curve of the ISRA defect detector is kept stable. The method has important significance for improving the production quality of the thin glass.

The invention relates to chemical-resistant silver plating paste for low-temperature co-fired ceramic and a preparation method thereof, and belongs to the technical field of electronic materials, the chemical-resistant silver plating paste comprises the following raw materials: silver powder, glass frit, a nano additive, a binder and a solvent. According to the invention, barium titanate, titanium dioxide and zinc oxide are compounded as a nano additive, so that the problems of micro-cracks and warping caused by different shrinkage rates among materials in the sintering process are solved; besides, the components of the frit prepared under the specific raw material composition and proportion can mutually generate a synergistic effect, the low-temperature co-fired ceramic process conditions are met, and meanwhile, the prepared silver paste finished product can have excellent chemical resistance.

The utility model discloses a kind of pressing structure of banknote bundling machine, including shell, the shell one side is equipped with back cover, the shell outside is equipped with conveying device, the upper end of the shell is equipped with banknote inlet in conveying device, the upper end of banknote inlet is equipped with banknote pressing plate one in shell outside through adjusting part one, the position of banknote inlet is equipped with outer paper ring in shell, movable inner paper ring is equipped in outer paper ring, the lower end of inner paper ring and outer paper ring is respectively equipped with gap one and gap two, the position of gap one is fixedly equipped with fixed plate in shell, T-shaped extension plate is fixedly equipped on one side of fixed plate, banknote pressing plate two is equipped on T-shaped extension plate through adjusting part two in shell, one side in shell is equipped with paper moving structure, sealing structure is equipped in the lower end of fixed plate in shell;The utility model is equipped with the setting of banknote pressing structure, can realize effective banknote pressing in the process of banknote bundling, to make banknote bundling flat.

The invention discloses a high-stability environment-friendly plywood base material cabinet door plate and a preparation method thereof, the preparation method comprises the processes of single plate carbonization, MDI glue bonding, single plate finishing, staggered joint assembly, plate blank continuous hot pressing and the like, a continuous plate is formed, and the continuous plate can be accurately cut according to the required size. The overall performance of the product is improved, the loss of the carbonized veneer is remarkably reduced, the production process flow is simplified, and the problems that an existing cabinet door plate is poor in stability and prone to deformation are effectively solved.

The utility model relates to the technical field of breathable film storage, and discloses a film body storage device for breathable film processing, which comprises a static electricity removing structure, a moving structure and a supporting structure, the moving structure is positioned in the static electricity removing structure, and the supporting structure is positioned on the outer wall of the static electricity removing structure; and the static electricity removing structure comprises a sleeve, the inner wall of the sleeve is fixedly connected with a protection pad, the right end of the sleeve is fixedly connected with a rotating motor, the left end of the rotating motor is rotationally connected with a sleeve rod, the outer wall of the sleeve rod is sleeved with a breathable film body, and one side of the rotating motor is fixedly connected with a static electricity eliminator. By arranging the mute eliminator, the processed breathable film main body is rolled into the sleeve through the rotating motor, the protective pad protects the surface of the breathable film main body from being abraded and scratched, and the static eliminator can generate a large amount of airflow with positive and negative charges, so that charges on the breathable film main body can be neutralized; the purpose of eliminating static electricity is achieved.

The utility model belongs to screening device technical field especially relates to a kind of high-throughput screening device, including magnetic stirring device, and the magnetic stirring device is provided with orifice plate body, bottom plate and top plate, the orifice plate body, bottom plate and top plate both sides are equipped with two groups of side sleeve, the orifice plate body and top plate both sides are provided with horizontal connecting rod. By being equipped with sleeve seat in magnetic stirring device top end both sides, and being equipped with first motor and second motor in sleeve seat top end, by first motor and second motor respectively driving first screw rod and first screw rod rotation, to let first threaded sleeve and second threaded sleeve drive two groups of horizontal connecting rod lifting, let two groups of horizontal connecting rod adjust the vertical position of the side sleeve outside top plate and orifice plate body, let two groups of side sleeve ensure that top plate and orifice plate body both sides are evenly stressed, effectively avoid the warping problem caused by single-point force, significantly improve the sealing between top plate and bottom plate and orifice plate body, prevent sample leakage.

The utility model relates to a production line for assembling microfibers on a protective shell. Comprising a feeding table, a hot pressing assembly, a cold pressing assembly and a bristle marking assembly which surround a six-axis mechanical arm, a containing groove is formed in a positioning jig, and a matching hole is formed in the side face of the positioning jig; the six-axis mechanical arm is rotatably connected with a clamping jaw, the clamping jaw is formed by connecting two clamping assemblies in parallel, each clamping assembly comprises a pushing motor and two clamping heads, the output end of each pushing motor is connected with the corresponding clamping head, the two clamping heads correspond to each other, and the clamping heads are matched with the matching holes. According to the production line, the protective shell is sleeved with the positioning jig and placed on the feeding table, the clamping head on the six-axis mechanical arm clamps the positioning jig, hot pressing, cold pressing, brushing and laser marking machining of microfibers in the protective shell can be conducted on the clamped positioning jig in sequence through the production line, only one person is needed in the whole production process, and the production efficiency is greatly improved. And the labor amount is reduced, and the production efficiency is improved.