14results about How to "Solve warping" patented technology

The utility model provides an electronic paper point screen crimping device which comprises at least one group of crimping modules and specifically comprises a driving module which comprises an X-direction driving mechanism and a Y-direction driving mechanism, and the Y-direction driving mechanism is arranged on the X-direction driving mechanism; the crimping module is installed on the Y-direction driving mechanism and comprises an opening-closing type driving mechanism, an upper crimping assembly and a lower crimping assembly, the upper crimping assembly and the lower crimping assembly are symmetrically arranged in the vertical direction, and the opening-closing type driving mechanism drives the upper crimping assembly and the lower crimping assembly to move oppositely or reversely; each of the upper crimping assembly and the lower crimping assembly comprises a fixed part, a floating part and a buffer structure connected with the fixed part, a probe is arranged in the fixed part, and the floating part is provided with a through hole for the probe to pass through; when the distance L1 between the upper crimping assembly and the lower crimping assembly is reduced to L2, the floating part pre-flattens the crimping end of the to-be-crimped product and completes correction and alignment; the buffer structure deforms, so that the floating part stops moving and the fixed part continuously moves until the upper probe and the lower probe are in contact with the surface of the product; and the visual unit is arranged above the crimping module. And the crimping precision and accuracy are improved.

The utility model provides a crimping module, comprising an opening and closing type driving mechanism which comprises a first driving end and a second driving end, and the first driving end and the second driving end are configured to synchronously drive so as to move towards each other or in opposite directions; the upper crimping assembly and the lower crimping assembly are symmetrically arranged in the vertical direction and are respectively mounted on the first driving end and the second driving end, each of the upper crimping assembly and the lower crimping assembly comprises a fixed part, a floating part and a buffer structure connected with the fixed part and the floating part, a probe is arranged in the fixed part, and the floating part is provided with a through hole for the probe to pass through; when the upper floating part and the lower floating part are in contact with the product to be crimped, compression continues to enable the buffer structure to generate elastic deformation, the floating parts stop moving, and the fixing part continues moving until the upper probe and the lower probe penetrate through the through holes to be in contact with the surface of the product. Through the innovative design of the fixing part, the floating part and the buffer structure, the electronic paper can be pre-flattened before crimping operation, so that the problem of inaccurate crimping alignment caused by bending and warping of the electronic paper is effectively solved.

The utility model relates to a high stability temperature compensation quartz crystal oscillator, including the crystal base and the lower ceramic base of upper and lower stacking, the crystal base lower part has an upper recess, and the compensation chip is installed in this upper recess, the lower ceramic base upper part has a lower recess, and the quartz chip is installed in this lower recess, and the upper recess and the lower recess butt joint and splice to form an inner chamber, and the quartz chip includes quartz wafer, the quartz wafer is composed of fixed section wafer and turning section wafer, and one end of the fixed section wafer is provided with the bending turning section wafer. The utility model can reduce the difference between the temperature perceived by the compensation chip and the environmental temperature of the quartz wafer, provide accurate temperature compensation frequency, achieve the high stability of the frequency when temperature transient, and the quartz wafer with corner structure is designed, and under the double action of the corner structure and the partition through -hole, the stability of the quartz wafer work can be effectively improved.

The invention provides a chip-to-wafer bonding structure with a chip supporting function and a preparation method of the chip-to-wafer bonding structure. According to the method, a polysilazane solution is adopted as a precursor, chip gaps are selectively filled through a spin-coating process, and then the polysilazane solution is converted into a silicon dioxide supporting structure. And the warping problem caused by high temperature and thick film deposition is avoided by utilizing the characteristics of high efficiency and normal-temperature treatment of the spin-coating process. The height of the supporting layer can be accurately controlled by controlling spin-coating parameters, formation of redundant film layers on the top of the chip is avoided, and the subsequent process is simplified. The formed silicon dioxide supporting structure is completely compatible with a standard semiconductor process, chip splitting in the thinning process can be effectively prevented, and the process reliability and economical efficiency are improved. The problems of wafer warping, low process efficiency, high cost and the like caused by filling silicon dioxide through chemical vapor deposition in the prior art are solved.

This utility model discloses a photovoltaic-thermal module for an evaporator, including a photovoltaic module, a heat absorber plate, a heat absorption channel, and a frame. A junction box is provided inside the photovoltaic module. The heat absorber plate is fixedly connected to the back of the photovoltaic module, and the heat absorption channel is fixedly connected to the heat absorber plate. Refrigerant circulates within the heat absorption channel. The heat absorption channel includes a manifold and branch pipes. The manifold has a closed design at both ends and is connected to a connecting pipe. The branch pipes are internally threaded thin tubes with a diameter of 3-10 mm. Both ends of the branch pipes are connected to the manifold, and one or more semi-circular bends are provided along the length of the same branch pipe. Using this photovoltaic-thermal module significantly reduces the risk of photovoltaic panel deformation and microcracks in the solar cells, simplifies the manufacturing process, reduces costs, and optimizes heat exchange efficiency.

This application discloses a composite fixing structure for fixing a PCB, comprising: a carrier plate with multiple adsorption holes; a first abutment edge and a second abutment edge fixedly disposed on the periphery of the carrier plate; multiple pressure blocks disposed on the first abutment edge; a venting plate fixedly disposed below the carrier plate, the venting plate including a normally venting area and a first venting area; a first through hole in the first venting area selectively connected to or disconnected from a vacuum pump, and the first through hole in the first venting area opens or closes progressively from the side closer to the normally venting area to the side farther away from the normally venting area; and a pressure plate movably disposed above the carrier plate; the projection of the pressure plate on the carrier plate in a first direction is longer than the length of the carrier plate in the first direction, and the projection at least covers a portion of the first venting area. This composite fixing structure organically integrates vacuum adsorption and mechanical pressing, and can adaptively adjust the adsorption area and pressing position according to the PCB size, ensuring fixing reliability.

Steam chamber and semiconductor package module and power conversion device including the same. The steam chamber for a semiconductor package module according to an embodiment can include a lower metal plate, a hollow structure, and an upper metal plate sequentially disposed. The lower metal plate can include a first plate, a second plate, and a third plate sequentially disposed. A coefficient of thermal expansion of the second plate can be less than a coefficient of thermal expansion of the first plate or the third plate.

The utility model discloses a kind of pressing structure of banknote bundling machine, including shell, the shell one side is equipped with back cover, the shell outside is equipped with conveying device, the upper end of the shell is equipped with banknote inlet in conveying device, the upper end of banknote inlet is equipped with banknote pressing plate one in shell outside through adjusting part one, the position of banknote inlet is equipped with outer paper ring in shell, movable inner paper ring is equipped in outer paper ring, the lower end of inner paper ring and outer paper ring is respectively equipped with gap one and gap two, the position of gap one is fixedly equipped with fixed plate in shell, T-shaped extension plate is fixedly equipped on one side of fixed plate, banknote pressing plate two is equipped on T-shaped extension plate through adjusting part two in shell, one side in shell is equipped with paper moving structure, sealing structure is equipped in the lower end of fixed plate in shell;The utility model is equipped with the setting of banknote pressing structure, can realize effective banknote pressing in the process of banknote bundling, to make banknote bundling flat.

The utility model belongs to screening device technical field especially relates to a kind of high-throughput screening device, including magnetic stirring device, and the magnetic stirring device is provided with orifice plate body, bottom plate and top plate, the orifice plate body, bottom plate and top plate both sides are equipped with two groups of side sleeve, the orifice plate body and top plate both sides are provided with horizontal connecting rod. By being equipped with sleeve seat in magnetic stirring device top end both sides, and being equipped with first motor and second motor in sleeve seat top end, by first motor and second motor respectively driving first screw rod and first screw rod rotation, to let first threaded sleeve and second threaded sleeve drive two groups of horizontal connecting rod lifting, let two groups of horizontal connecting rod adjust the vertical position of the side sleeve outside top plate and orifice plate body, let two groups of side sleeve ensure that top plate and orifice plate body both sides are evenly stressed, effectively avoid the warping problem caused by single-point force, significantly improve the sealing between top plate and bottom plate and orifice plate body, prevent sample leakage.

The utility model discloses a multifunctional portable nursing board, including bridge board and connecting plate, one end of bridge board is equipped with first end plate, and the other end of bridge board is equipped with second end plate, the bottom of bridge board is equipped with two groups of plug -in board respectively in symmetrical mode, and four are evenly distributed to each group of plug -in board, the top of each group of plug -in board is all through one side of bridge board, and the end of each group of plug -in board is connected with an adapter plate, the utility model discloses, bridge board, first end plate and second end plate are connected through adapter plate, when fastening nut is in the loosening state, the included angle between bridge board, first end plate and second end plate can be adjusted quickly, and after adjusting, can be fixed quickly through the fastening nut, can adjust the modeling of nursing board according to the use demand, improves the scope of application, and the operation is simple, is easy to fold and is saved space, and it is convenient for single -person operation use, and the space demand is lower.

The invention discloses a laser cutting device with a clamping structure, and relates to the technical field of sheet metal machining. Comprising two parallel rack bases, each rack base is slidably connected with a moving table, a transverse moving support is erected above the two moving tables, a connecting support is slidably connected to the upper portion of the transverse moving support, a movable support is vertically slidably connected to the front side of the connecting support, and a laser cutting head is installed at the front end of the movable support. Rigid-flexible composite self-adaptive material clamping assemblies synchronously following the laser cutting head are mounted on the left side and the right side of the movable bracket; a mounting frame is arranged between the two rack bases, a temperature control adsorption workbench assembly is movably mounted at the upper end of the mounting frame, and a self-adaptive moving position compensation assembly and a positioning detection assembly are mounted on the mounting frame. Real-time detection and automatic adjustment of clamping force are achieved through the rigid-flexible composite self-adaptive material clamping assembly, and thermal deformation active compensation is achieved through cooperation of the temperature control adsorption workbench assembly and the self-adaptive moving position compensation assembly.

This invention relates to the field of optical precision inspection, and particularly to a sub-aperture stitching inspection method based on a frequency-domain and spatial-domain collaborative strategy. The method includes: acquiring discrete phase data of the sub-apertures; constructing a continuous physical field model; performing coarse alignment of adjacent sub-apertures using frequency-domain phase correlation technology to obtain integer pixel displacements between adjacent sub-apertures; performing sub-pixel fine alignment using a numerical gradient method based on the continuous physical field model and a normalized cross-correlation function with an embedded geometric error culling operator; constructing a global robust energy functional for global optimization; solving for the zero-curvature pose under a floating reference, and then performing Gaussian gradient weighted fusion and adaptive orthogonal base surface reconstruction to obtain the full-aperture surface shape of the large-aperture optical element. This invention solves the problems of strong initial value dependence, displacement-tilt degeneracy, cumulative error warping, and sensitivity to outliers in traditional sub-aperture stitching inspection methods, achieving ultra-high precision and high robustness in the sub-aperture stitching inspection of large-aperture optical elements.

The utility model relates to a bending device for aluminum veneer production, which belongs to the technical field of aluminum veneer production and comprises a bending machine, a lower die, an upper die and a hydraulic unit, a support structure and an aluminum veneer are arranged on the bending machine, and the support structure comprises a mounting frame. According to the bending device for aluminum veneer production, the supporting structure is arranged, the warping problem generated when a long plate is bent is effectively solved through dynamic angle adjustment and elastic supporting, the machining quality of precise parts such as curtain wall plates and decorative plates is greatly improved, the die changing time is shortened through the width self-adaptive adjustment function, and the production efficiency is improved. Single equipment can cover the size range of conventional aluminum veneers, the production efficiency is further improved, meanwhile, surface scratching caused by rigid contact is avoided through rubber roller supporting, elastic counter-acting force generated by springs is transmitted to a bracket through a connecting plate, flexible supporting is formed, impact force in the bending process is effectively buffered, surface damage of the veneers is prevented, and the service life of the veneers is prolonged. And the method is particularly suitable for processing pre-coated plates.

This utility model relates to the field of positioning mechanism technology, specifically a positioning mechanism for the hole spacing of a conductive busbar, including a worktable. A punching mechanism is fixedly mounted on the top surface of the worktable via bolts. The advantages of this utility model are: during operation, a first cylinder pushes a U-shaped frame downwards, causing a pressure plate to adhere to the top surface of the conductive busbar. Subsequently, a motor drives a gear to rotate, and through meshing gear plates, the pressure plate slides within the groove of the first positioning plate, thereby pressing the conductive busbar firmly onto the worktable. This top-pressing design can counteract the downward impact force of the drill bit in the punching mechanism, preventing the conductive busbar from warping upwards due to uneven force. The pressure plate is slidably connected to the connecting rod, ensuring a smooth pressing process, while the clearance groove provides space for the gear to move, ensuring smooth transmission. This structure achieves top constraint on the conductive busbar, and together with the side limiting of the first and second positioning plates, forms a three-dimensional positioning, significantly improving the stability during punching and ensuring hole position accuracy.