Three-dimensional integration method for tile TR component subarray element

Abstract

The invention provides a three-dimensional integration method for a tile TR component subarray element and aims at providing a three-dimensional integration method for a subarray element which is thinin body and light in weight and is capable of effectively improving the assembly efficiency and quality. The three-dimensional integration method is implemented through the following technical schemeof producing a tool base consistent with a radio-frequency T / R printed board in shape and a tool pressing plate, producing opposite and symmetric electroplated metallization steps on the upper and lower surfaces of the radio-frequency T / R printed board and a radiation surface printed board, making the radio-frequency T / R printed board vertically aligned at the radiation surface printed board andshielding and sealing the peripheries of work cavities of T-type MMIC chips; and burying fuzz buttons into circular holes in the radiation surface printed board and then fastening the radio-frequencyT / R printed board and the radiation surface printed board between the steps of the tool pressing plate and a TR low-frequency and wave-controlled circuit board and vertically interconnecting and fastening the radiation surface printed board and the radio-frequency T / R printed board together to achieve interconnection of radio-frequency inner and outer conductors and inner and outer conductors of an antenna board. Radio-frequency assembly of the subarray element of a chip phased-array antenna is achieved through integral integration.

Description

technical field [0001] The invention relates to a high-density integrated multifunctional substrate and three-dimensional assembly that can be widely used in the fields of communication, navigation, identification, measurement and control, early warning detection, precision tracking, electronic countermeasures, broadcasting and television, remote sensing and telemetry, and radio astronomy. The integration process of two-dimensional active phased array antenna array microsystem structure and function modules, especially the vertical interconnection and assembly process between the three-dimensional boards of the integrated package radio frequency T / R printed board and the radiating surface printed board. Background technique [0002] The two-dimensional active phased array antenna array structure involves the electrical performance and structural layout of the radiating unit, array synthesis, TR components, power distribution network, beam steering, and DC power supply. Accor...

AI Technical Summary

Problems solved by technology

The choice of grounding connection material and assembly temperature for the outer conductor of the RF printed board has great limitations. If the temperature is too high, it will have a certain impact on the reliability of the chip.

Images