Three-dimensional integration method for tile TR component subarray element

A three-dimensional integrated, tiled technology, applied in the direction of electrical components, antenna components, electrical components to assemble printed circuits, etc., can solve problems such as the impact of chip reliability, and achieve good electromagnetic shielding effect, thin body and light weight. Effect

Inactive Publication Date: 2018-11-06
10TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The choice of grounding connection material and assembly temperature for the outer conductor of the RF printed board has great limitations. If the temperature is too high, it will have a certain impact on the reliability of the chip.

Method used

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  • Three-dimensional integration method for tile TR component subarray element
  • Three-dimensional integration method for tile TR component subarray element
  • Three-dimensional integration method for tile TR component subarray element

Examples

Experimental program
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Effect test

Embodiment Construction

[0020] refer to figure 1 , figure 2 . According to the present invention, prepare an embedded tooling base 1 consistent with the shape of the radio frequency TR printed board 3, which is used to fix the radio frequency TR printed board 3 and the 8-piece printed board of the radiating surface, and place the radio frequency TR printed board 3 The low-frequency and wave control unit 2 is embedded in the tooling base 1, and the RF TR printed board 3 is fixed to the tooling base 1 with screws 12, so that it does not affect the assembly of the MMIC chip 4 on the RF side of the RF TR printed board 3; Assemble the MMIC chip 4 into the T-shaped cavity on the RF TR printed board 3, and then use gold wire bonding to electrically interconnect the MMIC chip 4 and the microstrip circuit to make it electrically conductive; The adhesive film 6 is pasted on the outer conductor of the printed board 8 on the radiating surface, so that it is closely attached to the outer conductor of the print...

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Abstract

The invention provides a three-dimensional integration method for a tile TR component subarray element and aims at providing a three-dimensional integration method for a subarray element which is thinin body and light in weight and is capable of effectively improving the assembly efficiency and quality. The three-dimensional integration method is implemented through the following technical schemeof producing a tool base consistent with a radio-frequency T/R printed board in shape and a tool pressing plate, producing opposite and symmetric electroplated metallization steps on the upper and lower surfaces of the radio-frequency T/R printed board and a radiation surface printed board, making the radio-frequency T/R printed board vertically aligned at the radiation surface printed board andshielding and sealing the peripheries of work cavities of T-type MMIC chips; and burying fuzz buttons into circular holes in the radiation surface printed board and then fastening the radio-frequencyT/R printed board and the radiation surface printed board between the steps of the tool pressing plate and a TR low-frequency and wave-controlled circuit board and vertically interconnecting and fastening the radiation surface printed board and the radio-frequency T/R printed board together to achieve interconnection of radio-frequency inner and outer conductors and inner and outer conductors of an antenna board. Radio-frequency assembly of the subarray element of a chip phased-array antenna is achieved through integral integration.

Description

technical field [0001] The invention relates to a high-density integrated multifunctional substrate and three-dimensional assembly that can be widely used in the fields of communication, navigation, identification, measurement and control, early warning detection, precision tracking, electronic countermeasures, broadcasting and television, remote sensing and telemetry, and radio astronomy. The integration process of two-dimensional active phased array antenna array microsystem structure and function modules, especially the vertical interconnection and assembly process between the three-dimensional boards of the integrated package radio frequency T / R printed board and the radiating surface printed board. Background technique [0002] The two-dimensional active phased array antenna array structure involves the electrical performance and structural layout of the radiating unit, array synthesis, TR components, power distribution network, beam steering, and DC power supply. Accor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/22H05K3/30
CPCH01Q1/2283H05K3/305
Inventor 李颖凡张剑周太富林佳星王文川欧姗姗肖超
Owner 10TH RES INST OF CETC
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