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3541results about How to "Fast transmission" patented technology

Output method, system and server of recommendation information

The invention discloses an output method, system and server of recommendation information. The method comprises the following steps of: extracting user action data in a predetermined statistic period from a user action database; classifying the user action data according to commodity identifications to obtain a time sequence about interestingness of each commodity in the statistic period; computing a purchase peak probability of the commodity according to the time sequence about interestingness; when receiving a command of outputting the recommendation information, sorting the purchase peak probability according to an order from high to low, and outputting the recommendation information of the commodity according to a sorting result. The method provided by the invention automatically computes the purchase peak probability of the commodity on time dimension according to the user action data, thereby improving the recommendation accuracy of a recommendation system and reducing the transmission quantity of unnecessary data in the network; since the recommendation information is automatically modified and output by a server, and the computation capability of the server is sufficiently used, the information input quantity and computation resource of the recommendation system can be reduced when the recommendation information is adjusted according to the purchase peak probability.
Owner:ALIBABA GRP HLDG LTD

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and/or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Sparse sampling and signal compressive sensing reconstruction method

The invention discloses a sparse sampling and signal compressive sensing reconstruction method. The method comprises: establishing a signal sampling interval of each time, sampling point number, and the number of points recovering, establishing random sparse sampling lower than a Nyquist sampling theorem value; and designing a measurement matrix by random sampling timing sequence values, designing a transformation matrix of a sparse expression domain of signals, determining a compressive sensing matrix, and separated compressive sensing optimizing signal reconstruction in a nonlinear manner. The method is based on rationality of objective world rules, and makes full use of signal sparsity, uses transformation space to describe the signals, and establishes theoretical framework of new signal description and processing, so under the condition that information is not lost is ensured, signals are sampled by speed much lower than required speed of a Shannon's sampling theorem. Simultaneously, signals can be recovered completely, that is, sampling of signals is converted into sampling of information. The invention provides a whole set of complete method. The method can be used in one-dimensional and multidimensional signals, and can process audio frequency, videos, nuclear magnetic resonance, and other signals.
Owner:HUNAN INT ECONOMICS UNIV

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

A build-up structure for chip to chip interconnects and System-In-Package utilizing multi-angle vias for electrical and optical routing or bussing of electronic information and controlled CTE dielectrics including mesocomposites to achieve optimum electrical and optical performance of monolithic structures. Die, multiple die, Microelectromechanical Machines (MEMs) and / or other active or passive components such as transducers or capacitors can be accurately positioned on a substrate such as a copper heatsink and multi-angle stud bumps can be placed on the active sites of the components. A first dielectric layer is preferably placed on the components, thereby embedding the components in the structure. Through various processes of photolithography, laser machining, soft lithography or anisotropic conductive film bonding, escape routing and circuitry is formed on the first metal layer. Additional dielectric layers and metal circuitry are formed utilizing multi-angle vias to form escape routing from tight pitch bond pads on the die to other active and passive components. Multi-angle vias can carry electrical or optical information in the form of digital or analog electromagnetic current, or in the form of visible or non-visible optical bussing and interconnections.
Owner:CAPITALSOURCE FINANCE

Improved AHB-to-APB bus bridge and control method thereof

An improved APB bus bridge structurally comprises an AHB bus interface and an APB bus interface and further comprises an interface sequential conversion and control module, a control FIFO (First In First Out) module and a data FIFO module, wherein the interface sequential conversion and control module comprises a state machine, a data FIFO control logic unit and a control FIFO control logic unit and a register. A control method of the improved APB bus bridge comprises the following steps: generating a ready signal by the APB bus bridge; determining that the ready signal has a high level, and autonomously sending a transmission request by an AHB bus master; receiving and judging the transmission request by the APB bus bridge, wherein if the transmission request is effective, a control signal and data of the transmission request are stored in the corresponding FIFO modules respectively and the APB bus bridge does not distinguish read and write transmissions; and through state conversion and control of the state machine of the interface sequential conversion and control module, after finishing sequential matching conversion of the two buses, quickly carrying out reliable transmission operation. The improved APB bus bridge is applicable to sequential synchronous and asynchronous AHB-to-APB bus transmission and is compatible with a memory interface.
Owner:杭州中科微电子有限公司

A virtual network card communication device applied to terminals of different local area networks to communicate with each other

The utility model relates to a virtual network card communication device used for mutual communication between terminals of different local area networks, which belongs to the technical field of virtual network card communication in the field of computer communication. Including: the real network cards NICA and NICB on the two terminals, the function is to perform real network data receiving and forwarding work to the outside world, which is the basis for the work of the virtual network card; virtual network cards NIC_SIMA and NIC_SIMB, which provide virtual addresses for upper-layer applications, upper-layer applications When using the virtual address to communicate with the other party, the TCP / IP data packet flows through the virtual network card, and the virtual network card software converts the virtual address into a real communication address, and communicates with the other party through the real network card assigned the communication address; the address server S, As an intermediary for the communication between two virtual network cards, it coordinates the two virtual network cards to establish a communication process step by step; the real network card exists in the hardware device of the terminal as a real physical device of the terminal, and the virtual network card exists as a resident program on the terminal.
Owner:AUTOMATION RES & DESIGN INST OF METALLURGICAL IND

Water level-flow speed-flow rate monitoring integrated device, monitoring system and monitoring method

The invention discloses a water level-flow speed-flow rate monitoring integrated device, a water level-flow speed-flow rate monitoring system and a water level-flow speed-flow rate monitoring method. The device comprises a radar water level measuring module, a radar flow speed measuring module, a wind speed measuring module and a flow rate calculating module, wherein the radar water level measuring module, the radar flow speed measuring module and the wind speed measuring module are connected with the flow rate calculating module respectively; the radar water level measuring module is used for measuring the real-time water level data of a river course / channel in a non-contact form; the radar flow speed measuring module is used for measuring the real-time surface flow speed data of the river course / channel in the non-contact form; the wind speed measuring module is used for measuring real-time wind speed data to correct a flow speed of a water surface; the flow rate calculating module is used for calculating to obtain the size of the flow rate of a controlled section of the river course / channel at a current moment by combining with an input relevant parameter of the controlled section of the river course / channel according to the water level data, the flow speed data and the wind speed data. The device can be used for monitoring the water level and the flow speed of the river course / channel in real time, and moreover, can be used for realizing monitoring the flow rate in real time.
Owner:PEARL RIVER HYDRAULIC RES INST OF PEARL RIVER WATER RESOURCES COMMISSION

Binocular video camera and image processing method thereof

The invention provides a binocular video camera and an image processing method thereof. The video camera obtains image data of a target scene through two image collection sensors. The video camera comprises a shell and a lens; a front board, a rigid flexible board, a main board, a power board and a storage board are arranged in the shell. A sensor A and a sensor B are arranged on the front board. An A/D chip is welded to the front board. An FPGA and a DSP are welded to the main board. According to the binocular video camera, the multi-core framework is adopted, and the image sensors, the FPGA and the high-performance DSP are involved; the intelligent analysis algorithm and image processing algorithms for automatic exposure, automatic white balance adjustment and the like are embedded into the binocular video camera, meanwhile, the dual-sensor synchronous imaging technology is adopted, and the functions of moving object detection and snapshooting, object feature recognition and the like are achieved; on the basis of the target scene simultaneous imaging technology, the processes of image feature extracting, recognizing, matching and rebuilding are completed, a target object can be more efficiently and reliably recognized and positioned, and the binocular video camera has the advantages of being high in frame rate, low in power consumption and noise and the like.
Owner:BEIJING MINGTAIZHI SOFTWARE TECH DEV
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