Chip-scale package and fabrication method thereof

Abstract

The invention discloses a chip-scale package and a fabrication method thereof. The chip-scale package comprises a packaging colloid, conductive bumps, a chip, a dielectric layer, a circuit layer, conductive blind holes and a soldering-resistant layer, the packaging colloid is provided with a first surface and a second surface which are opposite from each other, the conductive bumps are arranged in the packaging colloid and exposed out of the first and the second surfaces of the packaging colloid, the chip is embedded in the packaging colloid and exposed out of the first surface of the packaging colloid, the dielectric layer is arranged on the first surface of the packaging colloid, the conductive bumps and the chip, the circuit layer is arranged on the dielectric layer, the conductive blind holes are arranged in the dielectric layer and electrically connected with the circuit layer, electrode pads and the conductive bumps, and the soldering-resistant layer is arranged on the dielectric layer and the circuit layer. Consequently, the conductive bumps can be directly connected with other external electronic devices, so that a stack structure can be formed, and the fabrication process is effectively simplified.

Description

technical field [0001] The present invention relates to a package and its manufacturing method, in particular to a chip size package and its manufacturing method. Background technique [0002] With the evolution of semiconductor technology, different packaging product types have been developed for semiconductor products. In order to pursue thinner, thinner and smaller semiconductor packages, a chip scale package (CSP) has been developed, which is characterized in that Chip-scale packages are only equal to or slightly larger than the chip size. [0003] U.S. Patent Nos. 5,892,179, 6,103,552, 6,287,893, 6,350,668, and 6,433,427 disclose a traditional CSP structure, which is to directly form a build-up layer on a chip without using chip carriers such as substrates or lead frames, and uses redistribution layers. , RDL) technology to reconfigure the electrode pads on the chip to the desired position. [0004] However, the disadvantage of the above-mentioned CSP structure is tha...

AI Technical Summary

Problems solved by technology

However, the manufacturing process through the encapsulant 13 is difficult, and the conductive material 100 needs to be filled when forming the conductive via 10, so that the manufacturing time is increased and the cost is increased.

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