Packaging body capable of repeatedly stacking

Abstract

The invention relates to a package which can be repeatedly piled, comprising a substrate which has a plurality of first welding pads; a chip which is arranged on the substrate and exposes an active surface which is in electric connection with the substrate; a plurality of second welding pads which are arranged on the active surface of the chip; and a package colloid which is arranged on the substrate for covering part of the chip, wherein, the package colloid forms a groove on the active surfaces and exposes second welding pads on the active surface; a plurality of conductive balls are arranged on the second welding pads for electrically connecting first welding pads of another package which can be repeatedly piled. Two packages are piled with the mode of flip chip, the periphery of the substrate is protected by the package colloid, thereby reducing the use of wire leads and improving the warping problem of the two piled packages.

Description

technical field [0001] The invention relates to a stacked chip packaging structure, in particular to a repeatable stackable packaging body stacked in a flip chip manner. Background technique [0002] With the rapid improvement of the functions of products such as computers and network communications, semiconductor technology must have the requirements of diversification, portability, and miniaturization, so that the chip packaging industry must move towards high-precision products such as high power, high density, lightness, thinness, and miniaturization. system development. [0003] With increasing demands for miniaturization and high operating speed, multi-chip packaging structures are becoming more and more common in many electronic devices. Multi-chip configurations minimize system speed constraints by combining two or more chips in a single package. A common multi-chip packaging structure is side-by-side, in which two or more chips are mounted side by side on the same...

AI Technical Summary

Problems solved by technology

Among them, the solder balls 13 of the first package 10 and the solder pads 24 of the second package 20 may have alignment problems.

In addition, during the heating process, the warpage phenomenon and poor connection caused by the different thermal expansion coefficients between different materials are more likely to cause the popcorn phenomenon.

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