Lead-free conducting resin and manufacture method thereof

A manufacturing method and conductive adhesive technology, applied in the field of conductive adhesive, can solve the problems of loose packing factor of bulk density, unable to actually solve silicon chips, inspection specifications, etc., and achieve the effect of solving silicon chip warping

Inactive Publication Date: 2012-08-22
CHINA STEEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the existence of irregular aluminum powder, the bulk density after burning into the back electrode is relatively loose, and the fill factor (F.F. po

Method used

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  • Lead-free conducting resin and manufacture method thereof
  • Lead-free conducting resin and manufacture method thereof

Examples

Experimental program
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Effect test

experiment example 1

[0027] Based on the total weight of the glass powder to be made as 100wt%, weigh 2wt% aluminum oxide, 9wt% silicon dioxide, 13% zinc oxide, 8wt% boron trioxide, 1wt% barium oxide , and a balanced amount of bismuth trioxide, mixed evenly with a mixer, poured into a platinum crucible and placed in a high-temperature furnace at 950°C, and kept at the temperature for 10 minutes after all the oxides were completely melted to ensure the formation of a homogeneous glass Melt the soup, then pour the glass melt into water to carry out the water quenching process, after making the glass, grind the glass into glass powder below 10 microns.

[0028] Based on the total weight of the silicon-aluminum alloy powder to be produced as 100wt%, in the silicon block and aluminum block with a purity of 99.99% or more, weigh 75wt% silicon and 25wt% aluminum, and put it into the crucible of the vacuum induction melting furnace and evacuate to 10 -3 Above torr, raise the temperature of the vacuum ind...

experiment example 2

[0035] Based on the total weight of the glass powder to be made as 100wt%, weigh 1wt% aluminum oxide, 4wt% silicon dioxide, 14% zinc oxide, 9wt% boron trioxide, 2wt% barium oxide , and a balanced amount of bismuth trioxide, mixed evenly with a mixer, poured into a platinum crucible and placed in a high-temperature furnace at 1000°C, and kept at the temperature for 10 minutes after all the oxides were completely melted to ensure the formation of a homogeneous glass The molten soup is then poured into water for a water quenching process. After the glass is made, the glass is ground to below 10 microns.

[0036] Based on the total weight of the silicon-aluminum alloy powder to be produced as 100wt%, with a silicon block and an aluminum block with a purity of more than 99.99%, weigh 55wt% silicon and 45wt% aluminum, and put them into the crucible of the vacuum induction melting furnace and evacuated to 10 -3 Above torr, raise the temperature of the vacuum induction furnace to 160...

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Abstract

The invention discloses lead-free conducting resin which comprises 2-3wt percent of glass powder, 2-4wt percent of silicon-aluminum alloy powder, 21-23wt percent of organic adhesive, 0.2-0.5wt percent of zinc stearate and the balance of aluminum powder, wherein the glass powder comprises aluminium oxide, silica, zinc oxide, diboron trioxide, barium monoxide and bismuth trioxide. The lead-free conducting resin for a solar cell, provided by the invention, can be stably attached and bound with a silicon chip when being burnt into a back electrode by adding the silicon-aluminum alloy powder, thus warping of the silicon chip is avoided. The invention also provides a manufacture method of the lead-free conducting resin.

Description

technical field [0001] The invention relates to a conductive glue, in particular to a lead-free conductive glue used in solar cells to form a back electrode by burning. Background technique [0002] The current solar cells, especially the back electrodes of polycrystalline silicon solar cells, are mostly formed by screen printing conductive glue, aluminum glue, or silver glue and then fired. Because the shrinkage rate of the conductive glue is different from that of silicon chips, aluminum, or silver. In addition, the sintering after screen printing is a high-temperature process, so when it is fired with aluminum glue or silver glue to form the back electrode, it will cause the problem of warping of the silicon chip. [0003] The Chinese patent No. CN1877864A proposes a technical solution of doping glass oxide into aluminum glue, so as to reduce the warping degree of the silicon chip after burning to form the back electrode. However, since the composition of the glass oxide...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00H01L31/0224
Inventor 陈荣志钟宏硕黄钦麟李至隆陈淑华张瑞东
Owner CHINA STEEL
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