71 results about "Anisotropic conductivity" patented technology

The invention discloses a transparent conducting film with anisotropic conductivity. The transparent conducting film is suitable for a touch screen, and comprises a first transparent conducing film and a second transparent conducting film, wherein the first transparent conducting film and the second transparent conducting film are embedded metal grid transparent conducting films; in the first transparent conducting film, the probability density of grid metal lines the line slopes of which are close to X axis is larger than the probability density of grid metal lines the line slopes of which are close to Y axis; and in the second transparent conducting film, the probability density of grid metal lines the line slopes of which are close to Y axis is larger than the probability density of grid metal lines the line slopes of which are close to X axis. The transparent conducting film module can ensure constant conductivity while increasing the light transmittance.

An emitter includes an electron source and a cathode. The cathode has an emissive surface. The emitter further includes a continuous anisotropic conductivity layer disposed between the electron source and the emissive surface of the cathode. The anisotropic conductivity layer has an anisotropic sheet resistivity profile and provides for substantially uniform emissions over the emissive surface of the emitter.

In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.

Disclosed herein are an anisotropically conductive connector that conductivity of all conductive parts for connection is good, and insulating property between adjacent conductive parts for connection is surely achieved even when the pitch of electrodes as objects of connection is small, and good conductivity is retained over a long period of time even when it is used repeatedly under a high-temperature environment, and applications thereof. The above anisotropically conductive connector is a connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed, wherein supposing that the shortest width of each of the conductive parts for connection is W, and the number average particle diameter of the conductive particles is Dn, a value of a ratio W / Dn of the shortest width of the conductive part for connection to the number average particle diameter of the conductive particles falls within a range of 3 to 8, and a coefficient of variation of particle diameter of the conductive particles is at most 50%.

The present invention relates to an anisotropic conductive adhesive comprising an anisotropic conductive adhesive combined with a crystalline polymer to realize anisotropic conductivity and PTC (Positive Temperature Coefficient) characteristics at the same time. The anisotropic conductive adhesive having PTC characteristics according to the present invention comprises an insulating adhesive component and a plurality of conductive particles dispersed in adhesive component, in which the insulating adhesive component comprises a crystalline polymer. Since the anisotropic conductive adhesive according to the present invention includes a crystalline polymer, when temperature rises and the volume expands, electrical resistance is rapidly increased, whereby current flow is intercepted resulting in blocking current, providing PTC characteristics acting as a switch. Thus, it shows circuit protection function as well. Accordingly, it is possible to intercept a circuit upon occurrence of excess current without using a separate element for circuit protection such as PTC thermistor.

The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1 / (Sw·ρ)]×[N / (1−N)], wherein Sw is a BET specific surface area (m2 / kg) of the core particles, ρ is a specific gravity (kg / m3) of the high-conductive metal, and N is (mass of the high-conductive metal / total mass of the conductive particles).

System for visualizing conductivity and current density distributions including a plurality of current injecting devices (100) for injecting currents into a measuring object; a measuring unit (200) for measuring a magnetic flux density due to the currents injected into a measuring object; an operating unit (300) for selecting one pair of the current injecting devices in succession so as to inject currents of different directions into the measuring object, and calculating directional components of an anisotropic conductivity inside of the measuring object on the basis of the measured magnetic flux density; and displaying means for visualizing an inside of the measuring object by using the calculated directional components of the anisotropic conductivity.

A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate.

A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

The invention relates to a preparation method of a pressure-sensitive conductive membrane. The preparation method of the pressure-sensitive conductive membrane comprises the following steps: by sculpturing a rigid substrate, obtaining an array structure with neat arrangement on the surface of the substrate, using the substrate of the array structure with the neat arrangement as a template, selecting high molecular materials which can be made into a membrane with a function of sensitivity, by constructing the template, preparing the pressure-sensitive elastic membrane with a porous structure, filling conductive particles into holes of the pressure-sensitive elastic membrane with the porous structure, and therefore the pressure-sensitive conductive membrane is obtained. The pressure-sensitive conductive membrane has the advantages of not only having high conductivity of a metal membrane, but also having good flexibility and high transparency of a high molecular membrane. The pressure-sensitive conductive membrane can achieve anisotropic conductivity in a vertical direction and improves conductive efficiency. The preparation method of the pressure-sensitive conductive membrane is simple and quick, strong in controllable property, low in cost and suitable for mass production.

Compositions consisting of a mixture of filamentary nickel powder(s) and a thermosetting epoxy resin form the basis of anisotropic conductive materials. The filamentary nickel powder has a three-dimensional chain-like network structure. When such filamentary nickel powder is dispersed in a polymer thin film, such as an epoxy resin, it exhibits anisotropic conductivity.

A liquid crystal display screen is provided. The liquid crystal display screen includes a capacitance type touch panel, an upper board, a liquid crystal layer, and a lower board. The capacitance type touch panel includes a substrate and a transparent conductive layer located on the substrate. The upper board includes an upper substrate, an upper electrode, and an upper alignment layer. The transparent conductive layer is configured to be an upper optical polarizer. The transparent conductive layer is a carbon nanotube layer having an anisotropic conductivity. The upper substrate is the substrate of the capacitance type touch panel.

A layer of the mixture that contains polymer and conductive particles is applied over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity.

A liquid crystal display screen is provided. The liquid crystal display screen includes a capacitance type touch panel, an upper board, a liquid crystal layer, and a lower board. The capacitance type touch panel includes a substrate and a transparent conductive layer located on the substrate. The upper board includes an upper substrate, an upper electrode, and an upper alignment layer. The transparent conductive layer is configured to be an upper optical polarizer. The transparent conductive layer is a carbon nanotube layer having an anisotropic conductivity. The upper substrate is the substrate of the capacitance type touch panel.

The invention is achieved by applying a layer of the mixture that contains polymer and conductive particles over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity that can be used in the manufacture of ESD devices.

A conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure, and a method of producing a fine metal component having good characteristics. A conductive paste is such that metal powder in the form of many fine metal particles being linked in a chain form is blended. A conductive film is such that chain-form metal powder having paramagnetism is oriented in a constant direction by applying a magnetic field to a coating formed by the application of conductive paste. A plating method grows a plated coating by electroplating on a conductive film formed from a conductive paste. A method of producing a fine metal component which selectively grows a plated coating (4') on a conductive film (1) exposed at fine pass-hole pattern portions in a mold (3) to produce a fine metal component.

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1 / (Sw·ρ)]×[N / (1−N)], wherein Sw is a BET specific surface area (m2 / kg) of the core particles, ρ is a specific gravity (kg / m3) of the high-conductive metal, and N is (mass of the high-conductive metal / total mass of the conductive particles).

The present invention relates to an anisotropic conductive sheet, which is interposed between a circuit board such as a substrate and various circuit parts to render conductive paths and a manufacturing method thereof, providing the anisotropic conductive sheet securing a fine pitch anisotropic conductivity required by the recent highly integrated circuit boards and electronic parts yet keeping high durability of the conductive member. The anisotropic conductive sheet (10) is constituted by alternately arranging strip-like members (14) of a striped pattern having conductive pieces (24) and nonconductive pieces (22) alternately arranged, and nonconductive strip-like members (12).

A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate.

The invention provides an array substrate and a display device. The array substrate comprises a substrate base plate, a first conductive layer and a second conductive layer successively arranged on the substrate base plate, wherein at least two continuously formed passivation layers which are vertical to the direction of the substrate base plate are arranged between the first conductive layer and the second conductive layer. The continuously formed passivation layers are arranged, so that the better adhesive property between the second conductive layer and the passivation layers in contact with the second conductive layer can be achieved by adjusting the components of the passivation layers and the connection performance between the layer and the layer is more stable. The continuously formed passivation layers are arranged, so that grooves can be conveniently formed in the passivation layers so as to increase the height difference of ACF glue non-electric connection area, the anisotropic conductive adhesive in the grooves is deformed or broken so as to increase the anisotropic conductivity of the anisotropic conductive adhesive and reduce the short circuit and / or open circuit of the display screen. Thus, the stability, reliability and dependability of the array substrate can be promoted.

A driving method and apparatus of a touch panel are provided. The touch panel includes a conductive layer with anisotropic conductivity. The method includes the following steps. An electrode pair is selected one by one in a plurality of electrode pairs. Each of the electrode pairs includes a first electrode and a second electrode. The first electrodes are disposed on a first side of the conductive layer, and the second electrodes are disposed on a second side of the conductive layer. When an electrode pair of the electrode pairs is selected, the first electrode and the second electrode of the selected electrode pair are driven one by one.

Compositions consisting of a mixture of filamentary nickel powder(s) and a thermosetting epoxy resin form the basis of anisotropic conductive materials. The filamentary nickel powder has a three-dimensional chain-like network structure. When such filamentary nickel powder is dispersed in a polymer thin film, such as an epoxy resin, it exhibits anisotropic conductivity.

A positioning method and a driving apparatus of a touch panel are provided. The touch panel includes a conductive layer with anisotropic conductivity, a plurality of first electrodes and a plurality of second electrodes. The first electrodes and the second electrodes are respectively disposed on a first side and a second side of the conductive layer. The first electrodes and the second electrodes are sensed to obtain a plurality of sensing values. A first relative extreme portion at least having a relative extreme is defined among the first electrodes. A second relative extreme portion at least having a relative extreme is defined among the second electrodes. A ratio of sensing values is calculated according to the first relative extreme portion and the second relative extreme portion. A position of a touch point on the touch panel in a first axial direction is calculated with the ratio of sensing values.

The invention is achieved by applying a layer of the mixture that contains polymer and conductive particles over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilize the layer. This leads to a stable layer with enhanced and anisotropic conductivity that can be used in the manufacture of ESD devices.

The invention relates to the field of transcranial magnetic stimulation head model modeling, in particular to an anisotropic conductivity head model modeling method and device combined with cortical excitability. The method includes: establishing an anisotropic conductivity head model based on MRI and DTI images; obtaining an individual cortical excitability comprehensive index through an array target TMS experiment; and constructing an anisotropic conductivity head model containing the cortical excitability according to the anisotropic conductivity head model and the individual cortical excitability comprehensive index. The transcranial magnetic stimulation head model modeling method is combined with functional information on the basis of structural information, reflects the cortical excitability of an individual, is close to a real brain, can further improve the authenticity and reliability of the TMS modeling simulation, has important research significance in simulating the effect of TMS, optimizing TMS coils and stimulation parameters, and has good development and application prospect.