69 results about "Anisotropic conductivity" patented technology

The invention discloses a transparent conducting film with anisotropic conductivity. The transparent conducting film is suitable for a touch screen, and comprises a first transparent conducing film and a second transparent conducting film, wherein the first transparent conducting film and the second transparent conducting film are embedded metal grid transparent conducting films; in the first transparent conducting film, the probability density of grid metal lines the line slopes of which are close to X axis is larger than the probability density of grid metal lines the line slopes of which are close to Y axis; and in the second transparent conducting film, the probability density of grid metal lines the line slopes of which are close to Y axis is larger than the probability density of grid metal lines the line slopes of which are close to X axis. The transparent conducting film module can ensure constant conductivity while increasing the light transmittance.

An emitter includes an electron source and a cathode. The cathode has an emissive surface. The emitter further includes a continuous anisotropic conductivity layer disposed between the electron source and the emissive surface of the cathode. The anisotropic conductivity layer has an anisotropic sheet resistivity profile and provides for substantially uniform emissions over the emissive surface of the emitter.

Disclosed herein are an anisotropically conductive connector that conductivity of all conductive parts for connection is good, and insulating property between adjacent conductive parts for connection is surely achieved even when the pitch of electrodes as objects of connection is small, and good conductivity is retained over a long period of time even when it is used repeatedly under a high-temperature environment, and applications thereof.The above anisotropically conductive connector is a connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed, wherein supposing that the shortest width of each of the conductive parts for connection is W, and the number average particle diameter of the conductive particles is Dn, a value of a ratio W / Dn of the shortest width of the conductive part for connection to the number average particle diameter of the conductive particles falls within a range of 3 to 8, and a coefficient of variation of particle diameter of the conductive particles is at most 50%.

The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards 10 and 20 electrically connects a plurality of first electrodes 12 and 13 provided to be adjacent to each other on a first board 11 with a plurality of second electrodes 22 and 23 provided to be adjacent to each other on a second board 21 through an adhesive 30 that contains conductive particles 31 and that has anisotropic conductivity. By heating and pressing the adhesive placed between the mutually facing first electrode 12 and second electrode 22 and between the mutually facing first electrode 13 and second electrode 23, an adhesive layer 30a is formed between the first board 11 and the second board 21 and in the adhesive layer 30a, a cavity portion 33 is formed between the first electrodes 12 and 13 and between the second electrodes 22 and 23.

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1 / (Sw·ρ)]×[N / (1−N)], wherein Sw is a BET specific surface area (m2 / kg) of the core particles, ρ is a specific gravity (kg / m3) of the high-conductive metal, and N is (mass of the high-conductive metal / total mass of the conductive particles).

Compositions consisting of a mixture of filamentary nickel powder(s) and a thermosetting epoxy resin form the basis of anisotropic conductive materials. The filamentary nickel powder has a three-dimensional chain-like network structure. When such filamentary nickel powder is dispersed in a polymer thin film, such as an epoxy resin, it exhibits anisotropic conductivity.

A layer of the mixture that contains polymer and conductive particles is applied over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity.

A liquid crystal display screen is provided. The liquid crystal display screen includes a capacitance type touch panel, an upper board, a liquid crystal layer, and a lower board. The capacitance type touch panel includes a substrate and a transparent conductive layer located on the substrate. The upper board includes an upper substrate, an upper electrode, and an upper alignment layer. The transparent conductive layer is configured to be an upper optical polarizer. The transparent conductive layer is a carbon nanotube layer having an anisotropic conductivity. The upper substrate is the substrate of the capacitance type touch panel.

The invention is achieved by applying a layer of the mixture that contains polymer and conductive particles over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilise the layer. This leads to a stable layer with enhanced and anisotropic conductivity that can be used in the manufacture of ESD devices.

A conductive paste capable of further reducing the electrical resistance of a conductive film or the like, a conductive film having an anisotropic conductivity, a plating method for forming a plated coating having a uniform crystal structure, and a method of producing a fine metal component having good characteristics. A conductive paste is such that metal powder in the form of many fine metal particles being linked in a chain form is blended. A conductive film is such that chain-form metal powder having paramagnetism is oriented in a constant direction by applying a magnetic field to a coating formed by the application of conductive paste. A plating method grows a plated coating by electroplating on a conductive film formed from a conductive paste. A method of producing a fine metal component which selectively grows a plated coating (4') on a conductive film (1) exposed at fine pass-hole pattern portions in a mold (3) to produce a fine metal component.

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1 / (Sw·ρ)]×[N / (1−N)], wherein Sw is a BET specific surface area (m2 / kg) of the core particles, ρ is a specific gravity (kg / m3) of the high-conductive metal, and N is (mass of the high-conductive metal / total mass of the conductive particles).

The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that is capable of raising a reliability of mounting on a wiring substrate. One feature of the present invention is to bond a semiconductor element formed on a substrate having isolation to a member that a conductive film is formed via a medium having an anisotropic conductivity.

A composite conductive film formed of a polymer-matrix and a plurality of conductive lines less than micro-sized and its fabricating method are provided. The conductive lines are arranged parallel and spaced apart from each other so as to provide anisotropic conductivity. The present conductive film can serve as an electrical connection between a fine-pitch chip and a substrate. Additionally, an adhesive layer is formed on two opposite sides of the conductive film along its conductive direction to increase adhesive areas. The strength and reliability of the package using the conductive film are thus enhanced.

In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer.

A composite conductive film and a semiconductor package using such film are provided. The composite conductive film is formed of a polymer-matrix and a plurality of nano-sized conductive lines is provided. The composite conductive film has low resistance, to connect between a fine-pitch chip and a chip in a low temperature and low pressure condition. The conductive lines are parally arranged and spaced apart from each other, to provide anisotropic conductivity. The present conductive film can be served as an electrical connection between a fine-pitch chip and a chip or a fine-pitch chip and a substrate.

A driving method and apparatus of a touch panel are provided. The touch panel includes a conductive layer with anisotropic conductivity. The method includes the following steps. An electrode pair is selected one by one in a plurality of electrode pairs. Each of the electrode pairs includes a first electrode and a second electrode. The first electrodes are disposed on a first side of the conductive layer, and the second electrodes are disposed on a second side of the conductive layer. When an electrode pair of the electrode pairs is selected, the first electrode and the second electrode of the selected electrode pair are driven one by one.

Compositions consisting of a mixture of filamentary nickel powder(s) and a thermosetting epoxy resin form the basis of anisotropic conductive materials. The filamentary nickel powder has a three-dimensional chain-like network structure. When such filamentary nickel powder is dispersed in a polymer thin film, such as an epoxy resin, it exhibits anisotropic conductivity.

A positioning method and a driving apparatus of a touch panel are provided. The touch panel includes a conductive layer with anisotropic conductivity, a plurality of first electrodes and a plurality of second electrodes. The first electrodes and the second electrodes are respectively disposed on a first side and a second side of the conductive layer. The first electrodes and the second electrodes are sensed to obtain a plurality of sensing values. A first relative extreme portion at least having a relative extreme is defined among the first electrodes. A second relative extreme portion at least having a relative extreme is defined among the second electrodes. A ratio of sensing values is calculated according to the first relative extreme portion and the second relative extreme portion. A position of a touch point on the touch panel in a first axial direction is calculated with the ratio of sensing values.

A connecting portion of the external side FPC board connected to a control circuit provided outside of a magnetic head assembly and connecting terminals of arm side FPC boards respectively connected to magnetic heads are overlapped with an anisotropic conductive tape having anisotropic conductivity in the direction of thickness in between. The anisotropic conductive tape is applied pressure between the connecting portion and the connecting terminals with heating to a temperature of, for example, 150° C. and is set. As a result, the connecting portion and the connecting terminals are connected. The anisotropic conductive tape has anisotropic conductivity only in the direction of thickness so that conduction of wirings adjacent each other is prevented although a plurality of wirings is formed on the connecting portion and the connecting terminals.