Preparation method of pressure-sensitive conductive membrane

A technology of conductive film and conductive particles, which is used in cable/conductor manufacturing, conductors, circuits, etc., can solve the problems of single conductive effect, can not meet the anisotropic conduction of special electronic devices, etc., and achieves a simple and fast preparation method and is convenient for large-scale Production, the effect of good electrical conductivity

Active Publication Date: 2013-06-12
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The conductive films currently studied are all directly coated with a layer of conductive material on the substrate to make it have isotropic planar conductive effec

Method used

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  • Preparation method of pressure-sensitive conductive membrane
  • Preparation method of pressure-sensitive conductive membrane
  • Preparation method of pressure-sensitive conductive membrane

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Select a silicon wafer, and use a conventional etching method to etch a regular array of micron-scale columns with a diameter of 1 μm and a height of 20 μm on the surface of the silicon wafer (such as figure 1 shown); the polydimethylsiloxane (PDMS) prepolymer and the curing agent for curing the polydimethylsiloxane prepolymer (the polydimethylsiloxane prepolymer used and the curing agent for the prepolymer The curing agent of the polymer is SYLGARD184 silicone rubber product of Dow Corning Company in the United States) according to the mass ratio of PDMS prepolymer: curing agent is 10:1, and the mixture obtained after mixing the PDMS prepolymer and curing agent is mixed with toluene according to the mass ratio Mix 1:1 to obtain a mixed solution with a mass concentration of 50%, and drop-coat the obtained mixed solution onto a silicon wafer with a regularly arranged cylindrical array on the surface, and then put the silicon wafer into an oven at a temperature of 120°C. ...

Embodiment 2

[0031] Select a glass sheet, and use a conventional etching method to etch a regular array of micron-sized columns with a diameter of 5 μm and a height of 20 μm on the surface of the glass sheet; dissolve polyethylene glycol (PEG) in ethanol to prepare a mass A polyethylene glycol solution with a content of 5%, and the obtained polyethylene glycol solution is drip-coated on a glass sheet with a regularly arranged cylindrical array on the surface, and then the glass sheet is placed in an oven at a temperature of 80°C for 3 hours. ; The cured polyethylene glycol film is separated from the glass sheet to obtain a pressure-sensitive elastic polyethylene glycol film with a porous structure with a pore size of 5 μm. Conductive gold particles with a particle size of about 10nm (electron micrographs such as Figure 4 Shown) and isopropanol preparation of conductive gold particles with a mass content of 10% of the suspension was filled in the pores of the prepared pressure-sensitive el...

Embodiment 3

[0033]Select a quartz plate, and use a conventional etching method to etch a micron-scale regularly arranged cylindrical array with a diameter of 20 μm and a height of 20 μm on the surface of the quartz plate; dissolve polyvinyl alcohol (PVA) in ethylene glycol to prepare A polyvinyl alcohol solution with a mass content of 50%, the obtained polyvinyl alcohol solution is drip-coated on a quartz plate with a regularly arranged cylindrical array on the surface, and then the quartz plate is placed in an oven with a temperature of 80°C for curing for 1 hour; The cured polyvinyl alcohol film is separated from the quartz plate to obtain a pressure-sensitive elastic polyvinyl alcohol film with a porous structure with a pore diameter of 20 μm. Fill the suspension with a mass content of 50% conductive copper particles prepared from conductive copper particles with a particle size of about 1 μm and ethanol into the pores of the prepared pressure-sensitive elastic polyvinyl alcohol film wi...

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Abstract

The invention relates to a preparation method of a pressure-sensitive conductive membrane. The preparation method of the pressure-sensitive conductive membrane comprises the following steps: by sculpturing a rigid substrate, obtaining an array structure with neat arrangement on the surface of the substrate, using the substrate of the array structure with the neat arrangement as a template, selecting high molecular materials which can be made into a membrane with a function of sensitivity, by constructing the template, preparing the pressure-sensitive elastic membrane with a porous structure, filling conductive particles into holes of the pressure-sensitive elastic membrane with the porous structure, and therefore the pressure-sensitive conductive membrane is obtained. The pressure-sensitive conductive membrane has the advantages of not only having high conductivity of a metal membrane, but also having good flexibility and high transparency of a high molecular membrane. The pressure-sensitive conductive membrane can achieve anisotropic conductivity in a vertical direction and improves conductive efficiency. The preparation method of the pressure-sensitive conductive membrane is simple and quick, strong in controllable property, low in cost and suitable for mass production.

Description

technical field [0001] The invention relates to a method for preparing a pressure-sensitive conductive film, in particular to preparing a pressure-sensitive elastic film with a regularly arranged porous structure by using a template method, and filling conductive particles in the pores of the pressure-sensitive elastic film with a porous structure to obtain a pressure-sensitive film. A method for preparing a pressure-sensitive conductive film with a sensitive effect. Background technique [0002] With the gradual development of electronic devices in the direction of touch response, smart, and ultra-thin, the demand for conductive films is also increasing. Traditional conductive film materials mainly include: metal film, metal oxide film, polymer film and composite film. The conductive films currently studied are all directly coated with a layer of conductive material on the substrate to make it have isotropic planar conductive effect. A single conductive effect is far from ...

Claims

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Application Information

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IPC IPC(8): H01B13/00H01B5/16
Inventor 张聪张兴业聂宜文宋延林
Owner INST OF CHEM CHINESE ACAD OF SCI
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