226results about "Elastomeric connecting elements apparatus" patented technology

An elastomeric device for interconnecting two or more electrical components, comprising, an elastomeric matrix having one or more outer surfaces; one or more electrically conductive pathways through the matrix; and one or more electrically conductive contact pads, wherein at least a portion of one or more of the pads is flush with or extends outward from one or more of the outer surfaces of the matrix, and wherein at least a portion of the pad is in at least intimate contact with one or more of the pathways; and methods for making same.

A separable electrical connector for separably, electrically interconnecting the conductors of one multi-conductor cable to the conductors of a second electrical device that may be an electrical device such as a chip, or a second multi-conductor cable, or a flexible or rigid printed circuit board. The connector includes a layer of anisotropic conductive elastomer (ACE) in electrical contact with the conductors of the cable and the conductors of the second electrical device. A clamp or another type of mechanical device compresses the ACE, to provide electrical signal paths between the conductors of the cable and the second electrical device, through the ACE.

This invention involves unique electroplated items comprising electrically conductive polymers. In addition, continuous production of electrically treated items is facilitated using electrically conductive resins. Many embodiments employ directly electroplateable resins for particular advantage. Unique methods of establishing electroplated electrical connections are taught.

This invention involves unique electroplated items comprising electrically conductive polymers. In addition, novel processing is taught to facilitate continuous production of electrically treated items. Many embodiments employ directly electroplateable resins for particular advantage. Unique methods of establishing electroplated electrical connections are taught.

A system for batch forming a sheet of spring elements in three dimensions includes a top spacer layer. A plurality of ball bearings is arranged in a predetermined pattern on the top spacer layer. A spring element sheet containing the spring elements defined in two dimensions is positioned on the top spacer layer and the plurality of ball bearings. A top spacer layer is positioned on the spring element sheet. The top spacer layer and the bottom support layer are adapted to have a force applied thereto to push the plurality of ball bearings against the spring element sheet, such that the spring elements extend above the plane of the spring element sheet, thereby forming the spring elements in three dimensions.

An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.

A method for forming a connector including an array of contact elements includes forming a support layer on a substrate, patterning the support layer to define an array of support elements, isotropically etching the support elements to form rounded corners on the top of each support element, forming and patterning a metal layer to define an array of contact elements where each contact element includes a first metal portion on the substrate and a second metal portion extending from the first metal portion and partially across the top of a respective support element, and removing the support elements. The contact elements thus formed each includes a base portion attached to the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to have a concave curvature with respect to the surface of the substrate.

A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.

An anisotropically conductive connector, not causing permanent deformation by contact of target electrodes to be connected with pressure and deformation by abrasion even if the target electrodes are projected, and achieving stable conductivity over a long time period even when pressed repeatedly, a production process thereof, and an inspection circuit board equipped with the connector. The connector includes (1) anisotropically conductive film, with plural conductive path-forming parts each extending in a thickness-wise direction of the film arranged insulated by insulating parts and including at least 2 elastic layers, which are each formed by an insulating elastic polymeric substance, and (2) conductive particles exhibiting magnetism in portions of the respective elastic layers, at which conductive path-forming parts are formed. The connector satisfies H1≧30, and H1 / H2≧1.1, H1, H2 being durometer hardnesses of the elastic polymeric substance of one of elastic layers forming surfaces of the film, and of the elastic polymeric substance of the other, respectively.

A printed circuit board includes a dielectric layer and an area array of contact elements extending above a first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of a land grid array module for providing electrical connection to the land grid array module. The land grid array module can include a land grid array package or a second printed circuit board. In one embodiment, the contact elements are selected from the group of contact types including metal springs, bundled wires, metal in polymer, and solid metal tabs. In another embodiment, a contact element in the area array includes a base portion of conductive material and an elastic portion of conductive material formed integrally with the base portion whereby the elastic portion extends from the base portion and protrudes above the first surface of the dielectric layer.

A connector for electrically connecting to pads formed on a semiconductor device includes a substrate and an array of contact elements of conductive material formed on the substrate. Each contact element includes a base portion attached to the top surface of the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to curve away from a plane of contact and has a curvature disposed to provide a controlled wiping action when engaging a respective pad of the semiconductor device.

A microelectronic spring contact for making electrical contact between a device and a mating substrate and method of making the same are disclosed. The spring contact has a compliant pad adhered to a substrate of the device and spaced apart from a terminal of the device. The compliant pad has a base adhered to the substrate, and side surfaces extending away from the substrate and tapering to a smaller end area distal from the substrate. A trace extends from the terminal of the device over the compliant pad to its end area. At least a portion of the compliant pad end area is covered by the trace, and a portion of the trace that is over the compliant pad is supported by the compliant pad. A horizontal microelectronic spring contact and method of making the same are also disclosed. The horizontal spring contact has a rigid trace attached at a first end to a terminal of a substrate. The trace is free from attachment at its second end, and extends from the terminal in a direction substantially parallel to a surface of the substrate to the second end. At least a distal portion of the trace extending to the second end is spaced apart from the surface of the substrate. The spaced-apart distal portion is flexible in a plane parallel to the substrate.

An anisotropic film is disclosed in which a line-shaped nanostructure is disposed inside a resin film. Also disclosed is a method of producing an anisotropic film that includes: forming a metal nanostructure on a substrate, forming a resin film that embeds the metal nanostructure, and detaching the resin film from the substrate, wherein the step of forming the metal nanostructure on the substrate includes: at least, forming a coating film on the surface of a template provided on the substrate, the coating film including a metal layer formed by electroless plating; and removing a portion or all of the template while retaining a portion or all of the coating film, or removing a portion of the coating film. Also disclosed is an anisotropic film produced using the method of producing an anisotropic film.

An Anisotropic Conductive Elastomer (ACE)—based electrical connector that interconnects two or more electrical circuit elements. The connector includes at least two layers of ACE separated by alternate interconnection elements that include conductive elements. The conductive elements provide void space for the ACE elastomer to move to during the interconnection process.

An anisotropic conductive adhesive is provided that includes an epoxy resin, a phenoxy resin, a curing agent, an inorganic filler, and conducting particles as components. The phenoxy resin is controlled to have a glass-transition temperature (Tg) in a range of 66° C. to 100° C., so that the anisotropic conductive adhesive has an excellent fluidity in a mounting process, satisfactory electric conductive / insulation performances, and sufficient adhesiveness. Since the properties of the anisotropic conductive adhesive are almost invariant even if the adhesive is used for a long time under a high-temperature- and high-humidity condition, the anisotropic conductive adhesive can be used for applications where a high reliability is required.

A separable electrical connector for separably, electrically interconnecting the conductors of one multi-conductor cable to the conductors of a second electrical device that may be an electrical device such as a chip, or a second multi-conductor cable, or a flexible or rigid printed circuit board. The connector includes a layer of anisotropic conductive elastomer (ACE) in electrical contact with the conductors of the cable and the conductors of the second electrical device. A clamp or another type of mechanical device compresses the ACE, to provide electrical signal paths between the conductors of the cable and the second electrical device, through the ACE.

A novel, low profile connector element is disclosed for the purpose of electrically and mechanically interconnecting circuit elements in electronic devices, said circuit elements including but not limited to printed circuit boards, flexible printed circuits, rigid flex circuits, semiconductors, semiconductor package substrates, ground shields, and batteries, whereby the connector includes electrical contacts which have a unitary structure consisting of at least a distal end, a proximal end, and a middle section between the distal and proximal ends. The contacts of the present invention exhibit a contact diametric true position with respect to one another in an array of less than 0.2 millimeters. The electrical contacts are created in batch form from a high conductivity sheet of spring material such as a copper alloy. At least one end of the contact is elastic and emanates from one surface of the connector housing to enable formation of a separable, low resistance and reliable electrical connection to a terminal on a mating circuit element. A second end of the contact may also be elastic, or may be designed to permanently mount on a terminal on a second mating circuit element using attachment means such as solder. Contacts can be made by batch stamping and forming in reel to reel processing, and may remain integral to the contact strip or sheet during all connector fabrication processes including contact stamping, contact forming, contact plating, integration into the connector housing such as by over-molding, and through all other processing until singulation of the individual contacts and the whole of the connector′ from the contact sheet, and, as needed to provide proper connector function, from one another.

A cable is provided, the cable includes: a conductor configured to propagate a signal; an elastomeric layer surrounding the center conductor; and a conductive topcoat layer surrounding and bonded to the elastomeric layer. The conductive topcoat layer includes a suspension of conductive particles. The conductive topcoat layer is formed by curing a topcoat and conductive paste mixture applied to the elastomeric layer.

An anisotropically conductive connector, not causing permanent deformation by contact of target electrodes to be connected with pressure and deformation by abrasion even if the target electrodes are projected, and achieving stable conductivity over a long time period even when pressed repeatedly, a production process thereof, and an inspection circuit board equipped with the connector. The connector includes (1) anisotropically conductive film, with plural conductive path-forming parts each extending in a thickness-wise direction of the film arranged insulated by insulating parts and including at least 2 elastic layers, which are each formed by an insulating elastic polymeric substance, and (2) conductive particles exhibiting magnetism in portions of the respective elastic layers, at which conductive path-forming parts are formed. The connector satisfies H1≧30, and H1 / H2≧1.1, H1, H2 being durometer hardnesses of the elastic polymeric substance of one of elastic layers forming surfaces of the film, and of the elastic polymeric substance of the other, respectively, the resulting connector includes one harder elastic layer to limit permanent deformation and one softer layer for compliance.

An anisotropically conductive connector device including a first anisotropically conductive sheet and a second anisotropically conductive sheet. A plurality of conductive path-forming parts each extending in a thickness-wise direction of each sheet are arranged in a state mutually insulated by an insulating part. The conductive path-forming parts in the second anisotropically conductive sheet each have a diameter smaller than a diameter of each of the conductive path-forming parts in the first anisotropically conductive sheet.

An anisotropic conductive connector includes: a plurality of conducting paths to be brought into contact with a first object of connection provided in an electronic apparatus and with a second object of connection separate from the first object of connection to effect conductive connection between the objects of connection; and a metal portion to be brought into contact with the conducting paths to effect conductive connection between the plurality of conducting paths.

Disclosed is an anisotropically conductive sheet which can retain required conductivity over a long time even when used repeatedly, or used under a high-temperature environment, and has a long service life owing to its high durability and thermal durability, a production process thereof, and applied products thereof. The anisotropically conductive sheet contains conductive particles exhibiting magnetism in a state. oriented in a thickness-wise direction in an elastic polymeric substance having durometer hardness of 20 to 90, and a lubricant or parting agent is coated on the particles.

The present invention is directed to an anisotropic conductive film and manufacturing methods thereof, in which an electrically insulative porous film made of synthetic resin is used as a base film and in which conductive parts capable of being provided with conductiveness in the film thickness direction are formed independently at plural positions of the base film by adhering conductive metal to resinous parts of porous structure in such a manner as piercing through from a first surface to a second surface.

In an electrical connecting member for electrical connection with a connection object, the electrical connecting member includes an elastic body having a pair of protruding portions protruding in directions opposite to each other. An insulating film extends along the elastic body to cover the protruding portions. A conductor portion is formed along the film and extending between portions corresponding to the protruding portions. It is preferable that each of the protruding portions has a plurality of projections, adjacent ones of which is separated by a groove from one another. In this case, the conductor portions are formed in correspondence to the projections.

A conductive layer that can be easily handled having good electric conductivity and an anisotropic conductive sheet obtained by adhering the conductive layer to a base member made of a conductive member. A flexible good conductive layer comprises a plurality of layers and is adhered to the base member so will not to be broken even when the base member is distorted due to the handling. The flexible good conductive layer (25) can be adhered to a base member (24) made of a flexible material, and is constituted by at least a set of a layer (e.g., 254) of a flexible material, and a layer (e.g., 256) of a material having good conductivity and is electrically contacted to the layer (e.g., 254) made of the flexible material. The flexible good conductive layer (25) is adhered to the anisotropic conductive sheet (10) in which the conductive members (24) are scattered in the nonconductive matrix, and the flexible good conductive layer (25) is contacted to the conductive members (24).

An electrically connecting structure includes a glass plate, a feeding part formed on the glass plate, a terminal having a base part opposing the glass plate, an adhesive adhering the glass plate and the terminal, and a conductive rubber arranged between the feeding part and the base part. The adhesive is a thermosetting adhesive that once softens when heated and thereafter cures, and is arranged to surround a periphery of the conductive rubber. The feeding part and the base part have electrical continuity via the conductive rubber.