55 results about "Elastic anisotropy" patented technology

A support for a bearing comprises a resilient ring having unevenly spaced inner and outer bumpers. The unevenly spaced bumpers provide anisotropy to the rotor to preclude non-synchronous vibration. The inner bumpers can be ground to provide a vertical offset of the rotor centerline to accommodate the deflection due to the rotor weight. A tangential groove in the outer bumper allows oil passage during ring deflection so that oil can be squeezed out under dynamic load, providing additional viscous damping to the rotor.

Anisotropic nanocomposite hydrogel materials are created using a process in which a hydrogel-forming material is crosslinked in the presence of nanoscale cellulose and subsequently thermally cycled under an applied tensile strain. Such materials are capable of exhibiting high mechanical and viscoelastic anisotropy, increased stiffness when subjected to large strain, and are suitable for a broad range of soft tissue replacement applications. In addition controlled release of bioactive agents properties can be designed into medical devices fabricated from such nanocomposite materials.

Disclosed herein are an anisotropically conductive connector that conductivity of all conductive parts for connection is good, and insulating property between adjacent conductive parts for connection is surely achieved even when the pitch of electrodes as objects of connection is small, and good conductivity is retained over a long period of time even when it is used repeatedly under a high-temperature environment, and applications thereof. The above anisotropically conductive connector is a connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed, wherein supposing that the shortest width of each of the conductive parts for connection is W, and the number average particle diameter of the conductive particles is Dn, a value of a ratio W / Dn of the shortest width of the conductive part for connection to the number average particle diameter of the conductive particles falls within a range of 3 to 8, and a coefficient of variation of particle diameter of the conductive particles is at most 50%.

Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used repeatedly over many times or repeatedly used under a high-temperature environment, and applications thereof. The anisotropically conductive connector is an anisotropically conductive connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection extending in a thickness-wise direction of the film have been formed.

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1 / (Sw·ρ)]×[N / (1−N)], wherein Sw is a BET specific surface area (m2 / kg) of the core particles, ρ is a specific gravity (kg / m3) of the high-conductive metal, and N is (mass of the high-conductive metal / total mass of the conductive particles).

The invention discloses a method for establishing an FDTD (Finite Difference Time Domain) ultrasonic detection simulation model of a coarse crystal material based on an EBSD (Electron Back-Scattered Diffraction) spectrum and belongs to the technical field of ultrasonic nondestructive detection. The method comprises the following steps: obtaining a crystal orientation spectrum of the coarse crystal material by directly using the EBSD technology, selecting a threshold value for defining crystal grains in the spectrum according to an actual crystal grain structure in a macroscopic metallograph, packing the crystal grains with color corresponding to a principal orientation, and carrying out grey processing to obtain an image consisting of square pixel points, wherein the orientations of the crystal grains are represented by eulerian angles phi1, phi and phi2 corresponding to gray values and can be used for quantitatively calculating elastic anisotropic stiffness matrixes of the crystal grains. Compared with a previous model, the model has the advantages of being capable of accurately describing the structures and the orientations of the crystal grains, realizing high operation efficiency and the like; a model basis is provided for realizing purposes of defect quantification and location and quality determination in ultrasonic detection of the coarse crystal material. The method also can be used for establishing the ultrasonic simulation models of other elastic anisotropic polycrystalline materials such as austenitic welding lines and two-phase titanium alloys; the method has bright popularization and application prospects.

An elastic anisotropic metal matrix thermal barrier coating thickness ultrasonic measurement method belongs to the technical field of ultrasonic nondestructive testing. The elastic anisotropic metal matrix thermal barrier coating thickness ultrasonic measurement method achieves measurement of samples to be tested and reference samples through an ultrasonic pulse echo method C-scan thickness measuring system composed of an ultrasonic C-scan device, a water penetration focusing probe, a digital oscilloscope and a computer and comprises, for elastic anisotropic metal matrix thermal barrier coating sample ultrasonic echo signals, extracting all the delta gamma & gt: 0 in the elastic anisotropic metal matrix thermal barrier coating sample ultrasonic echo signals through a defined correction factor delta gamma, computing the normalization power spectrum Gm (f) of the elastic anisotropic metal matrix thermal barrier coating sample ultrasonic echo signals, reading the resonant frequency fn in the effective frequency band of the Gm (f), and substituting a known thermal barrier coating longitudinal wave velocity c into a sound pressure reflection factor power spectrum resonant frequency expression to achieve elastic anisotropic metal matrix thermal barrier coating thickness measurement. The elastic anisotropic metal matrix thermal barrier coating thickness ultrasonic measurement method effectively overcomes the problem that ultrasonic waveform distortion and dominant frequency migration due to elastic anisotropy of a matrix results in large errors of thermal barrier coating thickness measurement results.

Disclosed are an anisotropically conductive connector device, by which a good electrically connected state can be surely achieved even when the pitch of electrodes to be inspected is extremely small, and the good electrically connected state is stably retained even when used under a high-temperature environment, and an inspection apparatus for circuit devices, having this anisotropically conductive connector device. This anisotropically conductive connector device has an elastic anisotropically conductive film, in which a plurality of conductive path-forming parts each extending in a thickness-wise direction of the film are arranged mutually insulated by an insulating part, and a sheet-like connector composed of an insulating sheet, in which a plurality of through-holes each extending in a thickness-wise direction have been formed, and a plurality of electrode structures arranged in the respective through-holes in the insulating sheet so as to protrude from both surfaces of the insulating sheet. Each of the electrode structures is positioned on each of the conductive path-forming parts, the insulating sheet is integrally fixed to the insulating part, and each of the electrode structures is obtained by forming electrode parts having a diameter greater than the diameter of the through-hole on both ends of a body part inserted into the through-hole in the insulating sheet and is movable in the thickness-wise direction of the sheet.

An anisotropically conductive connector suitable for use in a wafer inspection apparatus, and a wafer inspection apparatus comprising the anisotropically conductive connector, which anisotropically conductive connector comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film, which plate is formed of a metallic material having a coefficient of linear thermal expansion of 3×10−6 to 2×10−5K−1, the conductive parts for connection are obtained by filling conductive particles having a number average particle diameter of 20 to 80 μm and exhibiting magnetism in an elastic polymeric substance at a high density, the conductive particles have, on a surface of which, a coating layer composed of a noble metal and having a thickness of at least 20 nm, each of the conductive parts for connection has a durometer hardness of 10 to 35, and an electric resistance between the conductive parts for connection is at least 10 MΩ.

The invention relates to an elastic multi-link linear guide independent suspension which comprises a wheel, a frame, a spring shock absorber system and a steering knuckle, wherein the steering knuckle is connected with the wheel through a hub unit, and the spring shock absorber system is respectively connected with the steering knuckle and the frame through a bulb pair. The suspension also comprises four strip plate shaped elastic anisotropic members, wherein longitudinal axial lines of the first member at the upper side of the suspension and the first member at the lower side of the suspension are in a vertical plane, longitudinal axial lines of the second member at the upper side of the suspension and the second member at the lower side of the suspension are in the same vertical plane, and the two vertical planes are not parallel. The elastic multi-link linear guide independent suspension has the advantages of being capable of restraining the wheel to ensure that the wheel is always in the same straight line during bobbling, effectively reducing the abrasion of a tyre, and being capable of effectively improving control stability, the running smoothness and the riding comfort of the vehicle, and also has the remarkable advantages of simple structure, strong designability, convenience for assembly and regulation and the like.

Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a wafer can be conducted with ease even when the wafer has a large area of 8 inches or greater in diameter, and the pitch of electrodes to be inspected is small, and good conductivity is retained even upon repeated use, and applications thereof. The anisotropically conductive connector has a frame plate, in which a plurality of anisotropically conductive film-arranging holes have been formed correspondingly to electrode regions in all or part of integrated circuits on a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes. The elastic anisotropically conductive films each have a plurality of conductive parts for connection extending in a thickness-wise direction thereof and containing conductive particles, and an insulating part mutually insulating them. The conductive particles are obtained by coating core particles exhibiting magnetism with a high-conductive metal, a proportion of the high-conductive metal to the core particles is at least 15% by mass, and the following t is at least 50 nm: t=[1 / (Sw·ρ)]×[N / (1−N)], wherein Sw is a BET specific surface area (m2 / kg) of the core particles, ρ is a specific gravity (kg / m3) of the high-conductive metal, and N is (mass of the high-conductive metal / total mass of the conductive particles).

A method of determining the elastoplastic behavior of components, in particular of gas turbine plants, at high temperatures. First of all, the linear-elastic behavior is determined and the inelastic behavior is taken into account on the basis of the linear-elastic results by using the Neuber rule, the anisotropic characteristics of the components, as occur in particular through the use of single-crystalline materials, are taken into account in a simple manner by using a modified anistropic Neuber rule in the form σ*2=σep2⁡(1+A⁢ C⁢αER⁢(A⁢ ⁢σep2σ02)n-1)where A=inelastic anisotropic correction term, A=⁢12[F⁡(Dyy-Dzz)2+G⁡(Dzz-Dxx)2+⁢H⁢(Dxx-Dyy)2+2⁢L⁢ ⁢Dyz2+2⁢ ⁢MDz⁢ ⁢x2+2⁢ ⁢NDx⁢ ⁢y2] where F, G, H, L, M and N are the Hill constants, C=elastic anisotropic correction term, C=D•E−1•Dσ*=determined linear stress, σep=estimated inelastic stress, D=direction vector of the elastic and inelastic stresses E−1=inverse stiffness matrix, ER=reference stiffness, σ0=reference stress, and σα, n=material constants.

Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved, and applications thereof. The anisotropically conductive connector of the invention comprises elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film have been formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.

An anisotropically conductive connector, and applications thereof, by which good conductivity is retained over a long period of time even when it is used in electrical inspection of a plurality of integrated circuits formed on a wafer repeatedly over a great number of times, and thus high durability and long service life are achieved. The anisotropically conductive connector includes elastic anisotropically conductive films, in each of which a plurality of conductive parts for connection containing conductive particles and extending in a thickness-wise direction of the film are formed. The conductive particles contained in the conductive parts for connection in the anisotropically conductive connector are obtained by laminating surfaces of core particles exhibiting magnetism with a coating layer formed of a high-conductive metal, and the coating layer is a coating layer having a high hardness.

An anisotropically conductive connector device and an inspection apparatus for circuit devices including the anisotropically conductive connector device. The anisotropically conductive connector device includes an elastic anisotropically conductive film, including plural conductive path-forming parts each extending in a thickness-wise direction of the film and arranged mutually insulated by an insulating part, a sheet-like connector including an insulating sheet, including a plurality of through-holes each extending in a thickness-wise direction, and plural electrode structures arranged in the respective through-holes in the insulating sheet to protrude from both surfaces of the insulating sheet. The electrode structures are positioned on respective conductive path-forming parts, the insulating sheet is integrally fixed to the insulating part, and the electrode structures include electrode parts that are movable in the thickness-wise direction of the sheet.

The invention discloses a sound ray tracing method of a fiber reinforced plastic composite material laminated plate, and belongs to the technical field of composite material ultrasonic inspection. The method comprises the following steps: taking a single ply as a unit to partition a computational domain, and utilizing an elastic stiffness matrix and the rotation transformation of the elastic stiffness matrix to quantitatively descript the elastic characteristic space distribution of FRP (Fiber Reinforced Plastic) composite materials; combining with a Christoffel equation to solve to independently obtain the function relational expressions, which are about a propagation direction angle, of quasi-longitudinal wave group speed values corresponding to different fiber orientation lays; and carrying out computational domain meshing, utilizing a Dijkstra shortest path search algorithm to search nodes through which ultrasonic wave passes when the ultrasonic wave is transmitted to a target point from a source point, and calculating corresponding sonic time. The method can realize the quick and accurate calculation of an ultrasonic wave propagation path and sonic time in the FRP composite material which has a multilayer structure, elastic anisotropy and different fiber laying sequences, and support is provided for researching ultrasonic wave propagation behaviors, optimizing a detection parameter and improving ultrasonic imaging quality and accuracy.

Disclosed herein are a wafer inspection apparatus, which is small in size, is prevented from shortening the service life of its circuit board for inspection, capable of collectively performing inspection as to a great number of electrodes to be inspected, has good electrical properties and capable of performing electrical inspection of high functional integrated circuits, and an anisotropically conductive connector suitable for use in this wafer inspection apparatus. The anisotropically conductive connector of the invention comprises an elastic anisotropically conductive film composed of a plurality of conductive parts for connection each extending in a thickness-wise direction of the film and arranged in a state separated from each other and an insulating part formed among these conductive parts for connection, and a frame plate for supporting this film. The frame plate is formed of a metallic material having a coefficient of linear thermal expansion of 3 x 10 -6 to 2 x 10 -5 K -1 , the conductive parts for connection are obtained by filling conductive particles having a number average particle diameter of 20 to 80 m and exhibiting magnetism in an elastic polymeric substance at a high density, the conductive particles have, on a surface of which, a coating layer composed of a noble metal and having a thickness of at least 20 nm, each of the conductive parts for connection has a durometer hardness of 10 to 35, and an electric resistance between the conductive parts for connection is at least 10 M CR .

An anisotropically conductive connector, by which expected electrical inspection can be conducted even to a circuit device having a clock frequency of, for example, at least 1 GHz, and an electrical inspection apparatus for circuit devices, which is equipped with this connector. The anisotropically conductive connector includes an elastic anisotropically conductive film having a plurality of conductive parts for connection arranged in accordance with a pattern corresponding to electrodes to be connected and extending in a thickness-wise direction of the film and an insulating part mutually insulating these conductive parts for connection, wherein conductive parts for high-frequency shielding extending in the thickness-wise direction are formed in the elastic anisotropically conductive film. The electrical inspection apparatus for circuit devices includes the above anisotropically conductive connector.

The invention relates to an inter-salt shale oil reservoir rock physical mechanism and earthquake prediction method. The method defines the rock physical mechanism of an inter-salt shale oil reservoirsystem, establishes an anisotropic rock physical model, and on the basis, a borehole rock physical inversion and earthquake prediction method is developed for the laminated structure, horizontal seamand other physical parameters of the shale oil reservoir. The rock physical model considers the ratio of illite to montmorillonite in a clay mixture, and the problem of a high abnormal value of the shale longitudinal and transverse wave velocity ratio Vp / Vs is explained through the clay intergranular soft matter property, the method is applied to actual data of an inter-salt shale oil reservoir to predict the physical characteristics of a microscopic structure related to clay and cracks in shale and the elastic anisotropy of a clay mixture, a solid matrix and the whole shale; the method is used for quantitative interpretation of a seismic elastic inversion result and predicting the spatial distribution of reservoir stratification, cracks and other physical properties and anisotropy parameters. The spatial distribution of the key physical parameters of the shale oil reservoir can be used for identifying and predicting a favorable reservoir.

A method and apparatus for an improved magnetic read sensor having synthetic or AP pinned layers with high resistance and high magnetoelastic anisotropy is disclosed. A pinned layer includes a cobalt-iron ternary alloy, where a third constituent of the cobalt-iron ternary alloy layer is selected for increasing the resistance and magnetoelastic anisotropy of the cobalt-iron ternary alloy layer.

Provided are a probe member, a probe card and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small. The probe member of the invention has a sheet-like probe, which is composed of a frame plate made of a metal, in which an opening has been formed, and a plurality of contact films arranged on and supported by a front surface of the frame plate so as to close the opening, wherein the contact film is obtained by arranging, in a flexible insulating film, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, and is arranged on a back surface of the sheet-like probe. The opening of the frame plate in the sheet-like probe has a size capable of receiving the external shape in a plane direction in the frame plate of the anisotropically conductive connector.

A method includes activating a stress-effecting layer of a thin film structure, having the stress effecting layer adjacent to a magnetic layer, to induce a magneto-elastic anisotropy in the magnetic layer.

Disclosed herein are a probe member for wafer inspection, a probe card for wafer inspection and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small.The probe member of the invention has a sheet-like probe, which is composed of a frame plate made of a metal, in which a plurality of openings have been formed, and a plurality of contact films arranged on and supported by a front surface of the frame plate so as to close the respective openings, wherein each of the contact films is obtained by arranging, in a flexible insulating film, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, and is arranged on a back surface of the sheet-like probe, wherein each of the openings of the frame plate in the sheet-like probe has a size capable of receiving the external shape in a plane direction in the elastic anisotropically conductive film.

A wafer inspection-use anisotropic conductive connector capable of positively ensuring a required electrical connection even if the electrodes to be inspected of the wafer are disposed at small pitches and high density, and being produced at low costs, and a production method and applications therefore. The connector comprises a frame plate formed with a plurality of openings corresponding to electrode areas where the electrodes to be inspected of the wafer are disposed, and a plurality of elastic, anisotropic conductive films so disposed as to close the respective openings, wherein the elastic, anisotropic conductive films comprise a plurality of connecting conductive units disposed in conjunction with the electrodes to be inspected, extending in the thickness direction, and being mutually insulated by insulating units, and can be obtained by laser-processing a conductive elastomer layer supported on a releasing type support plate to form a plurality of connecting conductive units, allowing the respective connecting conductive units to impregnate into a liquid insulating unit-use material layer formed so as to close the openings of the frame plate, and hardening the insulating unit-use material layer.