508results about How to "Avoid position deviation" patented technology

A wafer holder that prevents positional deviation of the wafer mounted on the wafer-mounting surface of a chuck top and enables better thermal uniformity of the wafer, as well as a heater unit including the wafer holder and a wafer prober mounting these are provided. The wafer holder has a chuck top mounting and fixing the wafer and a supporter supporting the chuck top, and the chuck top has water absorption of at least 0.01% and preferably at least 0.1%. Preferable material of the chuck top is a composite of metal and ceramics, and particularly, a composite of aluminum and silicon carbide, or a composite of silicon and silicon carbide.

A resin sheet that is unlikely to be affected by heat and allows prevention of the occurrence of a crack is provided. A glass fiber cloth-like material is dipped into an epoxy resin solution and subjected to curing, thereby obtaining an epoxy resin-based sheet including the glass fiber cloth-like material. The resin sheet has a haze value of 10% or lower, and preferably, has a light transmittance of 88% or higher, an in-plane retardation of not more than 2 nm, a retardation in a thickness direction of 40 nm, and a surface roughness of not more than 2 μm.

A semiconductor package device, a semiconductor package structure, and fabrication methods thereof are provided, which mainly includes disposing a plurality of semiconductor chips on a wafer formed with TSVs (Through Silicon Vias) and electrically connecting the semiconductor chips to the TSVs; encapsulating the semiconductor chips with an encapsulant; and disposing a hard component on the encapsulant. The hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier, thereby overcoming the drawbacks of the prior art, namely difficulty in mounting of solder bumps, and difficulty in cutting of the wafer.

The invention discloses a method and a system for automatically placing an aged lamp tube onto a production line based on visual positioning. The method comprises the following steps that when an aged lamp holder on the production line reaches the specified placing area, enabling a manipulator to put the grabbed lamp tube onto the aged lamp holder in the specified placing area; before the lamp tube is placed, shooting an image of the specified area at the set initial position; comparing and computing the real-time shot image and a calibrating image, and correcting the position and pose of the manipulator according to the comparison and computation result. The method has the advantages that during placing each time, the position and pose of the manipulator are corrected based on the visual positioning in real time; the defect of position deviation of the aged lamp holder caused by the movement of the production line is overcome, so that the problem of damage to pins or a main body of the lamp tube is solved, and the investment of human cost is saved.

A heat exchanger and a manufacture method thereof are provided. Before a tank body and a core plate of a header tank of the heat exchanger are fastened to each other, a gel seal material or a liquid seal material is applied to at least one of a seal surface of the core plate and that of the tank body and hardened. Thus, a seal member which adheres to the seal surface due to the tackiness of the seal member is formed. The core plate and the tank body are fastened to each other in such a state that the part between the seal surface of the core plate and that of the tank body are sealed by the seal member having been hardened. Accordingly, the seal member can be restricted of twisting and position-deviating when the core plate and the tank body are fastened to each other.

The invention provides a wall surface ceramic tile pasting device and belongs to the technical field of decoration equipment. The wall surface ceramic tile pasting device solves the problems that existing ceramic tile pasting is laborsome, and the construction quality is poor. The wall surface ceramic tile pasting device comprises a base which is fixedly connected with two pairs of supporting shafts. The supporting shafts are slidably connected with a lifting plate which is connected with a mobile plate. A swing rack is hinged to the mobile plate and slidably connected with a positioning disc which is provided with a positioning structure. The base is provided with a vertical screw. The lifting plate is provided with a longitudinal screw. The swing rack is provided with a transverse screw. By adoption of the wall surface ceramic tile pasting device, wall surface ceramic tile pasting is more effortless, and the construction quality is higher.

A semiconductor package is provided, including: an insulating layer; a semiconductor element embedded in the insulating layer; an adhesive body embedded in the insulating layer, wherein a portion of the semiconductor element is embedded in the adhesive body; a patterned metal layer embedded in the adhesive body and electrically connected to the semiconductor element; and a redistribution structure formed on the insulating layer and electrically connected to the patterned metal layer. By embedding the semiconductor element in the adhesive body, the present invention can securely fix the semiconductor element at a predetermined position without any positional deviation, thereby improving the product yield.

An image forming device includes a main body casing, a cover configured to be openable and closable with respect to the main body casing, a sensing unit configured to sense an opening-closing operation of the cover, a forming unit configured to form an image on a sheet, a detecting unit configured to perform a detecting operation to detect a deviation of an image forming position of the image to be formed by the forming unit, an accepting unit configured to accept a print request, and a control unit configured to control the detecting unit to perform the detecting operation in response to the print request being accepted when the sensing unit senses an opening-closing operation of the cover after execution of a previous detecting operation, and thereafter to control the forming unit to form the image in the image forming position corrected to cancel the deviation detected in the detecting operation.

The invention provides a method for carrying out the calibration detection of a CT detector module, comprising the following steps: (1) the CT detector respectively detects and records scanning signals before and after the movement of a CT collimator; (2) the differences of the scanning signals are normalized, and a measurement value of the CT detector module is obtained by averaging and filtering; (3) the measurement value of the CT detector module is compared with a threshold, if the measurement value is outside the range of the threshold, the position of the CT detector module is re-adjusted and the calibration detection is carried out again; if the measurement value is in the range of the threshold or equal to the threshold, the calibration of the CT detector module is in line with the requirements. The adoption of the method of the invention can detect whether the position of the detector module after the replacement is consistent with the positions of other detector modules or not, thereby avoiding the position deviation of the detector after the replacement and further preventing the occurrence of artifacts on an obtained CT image.

The apparatus for measuring a shape of a tire comprising a scanning part 6 provided with an optical sensor 11 that can measure the distance to the tire tread and a driving part in which the optical sensor 11 can scan in the tire width direction, the supporting portions of the scanning part 1a and 1b that support scanning part 6, a contact plate 2 provided at one end of the supporting portions of the scanning part 1a and 1b, and a contact plate 3 provided at the other end of the supporting portions of the scanning part 1a and 1b and movable in the scanning direction, wherein the scanning part 6 is detachable to the supporting portions of the scanning part 1a and 1b.

A sheet processing apparatus including a first sheet stacking portion for stacking sheets thereon, a second sheet stacking portion provided downstream of the first sheet stacking portion with respect to a sheet conveying direction, a sheet holding device for holding the sheets stacked on the first sheet stacking portion, and a holding device moving device for moving the sheet holding device between a holding position for holding the sheets and a discharging position provided downstream of the holding position in the sheet conveying direction, wherein the discharging position has a predetermined distance upstream from a stop position in which the sheet holding device moved to a downstream side with respect to the sheet conveying direction by the holding device moving device is stopped to an upstream side.

Disclosed are a single rotor-type axial gap motor with low magnetic loss and high output, and a pump device using the axial gap motor. A first contact surface (231) is provided on the lateral surface in one circumferential direction of a yoke strip (23), and a second contact surface (232) is provided on the lateral surface in the other circumferential direction of the yoke strip (23), wherein the first contact surface (231) and the second contact surface (232) are aligned with each other. Defining As1 and As2 as the surface areas (As) of the first and second contact surfaces (231, 232), and Ap1 and Ap2 as the projected surface areas (Ap) of the lateral surfaces of the aforementioned yoke strip seen from the circumferential direction, it holds that As>Ap.

A long hole of a seat plate member is fittingly inserted to a fitting head portion provided on an upper surface of a flat plate portion of a clip in an upright posture, so as to attach the clip to the cutaway groove portion with the seat plate member in contact with a flat plate portion, and the fitting head portion is fitted to a long hole formed in an attachment receiving member. As the fitting head portion is fitted to the long hole, the boss portion moves within the cutaway groove portion to bring the seat plate member into contact with the attachment receiving member and to elastically lock a pair of elastic locking pieces with the periphery of each longer side portion of the long hole.

A thermal analysis apparatus possesses a support base, a heating furnace which is approximately like a cylinder, and whose inside can be raised in its temperature, till a predetermined heating temperature, a heating furnace fixation part fixing the heating furnace to the support base, a furnace tube which is approximately like the cylinder, inserted through the heating furnace while having an interstice, and has been fixed in its base end part to the support base by a fixation member, a fixation means which makes the furnace tube capable of expanding or contracting in an axial direction, and positioning-fixes it in a radial direction, a sample holding means which holds a sample in an inside of a heating part of the furnace tube, that is a range capable of being heated by the heating furnace, and a temperature measurement means measuring a temperature change of the sample.

A pattern forming method includes: a modification treatment step of, in accordance with a pattern to be formed on a pattern forming surface of a base body, applying a light beam having a width smaller than a diameter of each of dots to constitute the pattern, onto a treatment target region including at least outer edges on both sides in a width direction of a region where the pattern is to be formed in the pattern forming surface, thereby carrying out modification treatment on the treatment target region; and a droplet deposition step of ejecting and depositing droplets of a functional liquid by an inkjet method onto the region where the pattern is to be formed including the treatment target region where the modification treatment has been carried out.

The invention provides a backlight module. The backlight module comprises a back panel, a light guide panel, a fluorescent device, a cover, a reflector and a positioning part, wherein the back panel is provided with a bottom plate and a side wall connected to the bottom plate; the light guide panel is configured on the bottom plate, and is provided with an emergent roof and an incident side surface adjacent to the emergent roof; the fluorescent device is configured on the bottom plate and positioned between the incident side surface and the side wall, and comprises a heat radiating block and a fluorescent part, the heat radiating block is fixed on the bottom plate and a fluorescent part is configured on the heat radiating block and is suitable for emitting light towards the incident side surface; the cover is provided with a roof and a side part connected to the roof which is configured on the emergent roof and the fluorescent device and covers partial emergent roof; the side part and the side wall are arranged oppositely; the reflector is configured between the roof and the emergent roof and between the roof and the heat radiating block; a positioning part is fixed on the roof, and is inserted into the heat radiating block through the reflector; and the positioning part of the backlight module plays a role in positioning the reflector so as to prevent the reflector from displacing or falling.

This invention provides a mounting method for reliably connecting mounting components electrically. Specifically, an anisotropically conductive adhesive can be composed of crushable microcapsules and a second liquid in which the microcapsules are dispersed. Each microcapsule encloses a first liquid and a conductive particle. The first liquid can react with the second liquid at normal temperatures to cure the second liquid. This anisotropically conductive adhesive can be applied on a flexible printed circuit (FPC). Then, a drive IC is mounted and pressed on the FPC to crush the microcapsules between electrode pads provided on the drive IC and electrode pads provided on the FPC, thereby bonding the electrode pads. Subsequently, the anisotropically conductive adhesive is heated to plasticize a capsule wall of each microcapsule, thereby bonding the drive IC and the FPC.