61results about How to "Good electrical connection" patented technology

To improve the fabrication yield of semiconductor devices. A semiconductor device where a desired number of semiconductor chips are laminated in the thickness direction thereof is fabricated by repeating, an arbitrary number of times such as one time or two or more times, a step of bonding and mounting another support substrate laminate on first bumps exposed by separating and removing one support substrate from a support substrate laminate composite where second bumps of two support substrate laminates including plural semiconductor wafers mounted on support substrates have been made to face each other and are electrically connected.

A DIN rail terminal block essentially includes a plastic main body, a resilient plate, and a terminal. The resilient plate and the terminal are coupled together by multiple fastening structures and are simultaneously secured in position to the plastic main body, wherein the multiple fastening structures prevent the resilient plate and the terminal from shifting leftward, rightward, upward, or downward with respect to each other. With the terminal configured for ground connection, and the resilient plate configured for pressing tightly against a DIN rail, the terminal block is stably positioned, provides good electrical connection, and allows easy operation.

A conductive connecting member 1 is contacted with an electrochemical cell for electrical conduction. The cell has a solid electrolyte film, a first electrode provided on a first face of the solid electrolyte film and contacting a first gas and the first gas, and a second electrode provided on a second face of the solid electrolyte film and contacting a second gas. The conductive connecting member 1 has a plate-like main part 2 and a tongue piece 3 protruding from the main part 2. One end of the tongue piece 3 is connected with the main part 2.

A probe device including a circuit board for inspection having a great number of inspection electrodes, a probe card having a circuit board for connection having a great number of terminal electrodes and a contact member, an anisotropically conductive connector arranged between the circuit board for inspection and the circuit board for connection and electrically connecting the respective inspection electrodes to the respective terminal electrodes, and a parallelism adjusting mechanism for adjusting a parallelism of the circuit board for inspection and the circuit board for connection to the wafer. The parallelism adjusting mechanism includes a location-varying mechanism, which relatively displaces the circuit board for inspection or the circuit board for connection in the thickness-wise direction of the anisotropically conductive connector. A wafer inspection apparatus can include the probe device.

The invention provides a transistor forming method. The method includes providing a substrate; forming a source electrode, a leak electrode and a grid electrode on the substrate; covering the substrate, the source electrode, the leak electrode and the grid electrode with a medium layer; forming a first contact hole in the medium layer by photoetching, connecting the first contact hole with the source and leak electrodes, arranging a contact layer on the surfaces of the source and leak electrodes, covering the inner wall of the first contact hole and the surface of the contact layer with protection layers, forming an organic resist layer on the medium layer, forming a second contact hole by photoetching, and exposing the grid electrode through the second contact hole; removing the protection layer of the bottom of the first contact hole; forming conducting plugs in the first and second contact holes. The contact layer can be protected effectively through the protection layer covering the surface of the contact layer, the fine appearance of the contact layer can be maintained after the photoetching and cleaning processes of the second contact hole and the organic resist layer removing process, and the performance of a transistor is improved.

A coaxial cable adaptor comprises a body, a conductor disposed inside the body and insulation linings disposed between the body and the conducting tubular conductor. A plurality conducting plates separated by gaps is disposed at two ends of the tubular conductor respectively, and an accommodating groove is formed between the conducting plates at each of the two ends for inserting coaxial cable cores. Middle section areas of the conducting plates are depressed toward the accommodating groove, and an arch flange is protrudingly formed on the middle section area of each of the conducting plates facing towards the accommodating groove. Thereby, the coaxial cable cores inserted in the accommodating groove can be clamped tightly by the tubular conductor through the elasticity of the arch flanges of the conducting plates in order to allow stable transmittance of high frequency signals.

A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a connection component having a support structure and a plurality of elongated posts extending substantially parallel to one another from a first surface of the support structure with the microelectronic component so that the support structure overlies the surface of the component with the posts extending away from the component and electrically connecting the posts to the contacts of the microelectronic component.

The present invention provides a ribbon microphone comprising a diaphragm made of an aluminum foil, in which the aluminum foil offers a corrosion resistance and in which a favorable electrically connected state can be maintained in the junction between the aluminum foil and backplates for a long time. A gold deposited film 12 is formed on opposite surfaces of a diaphragm 10 consisting of a ribbon-like aluminum foil 11. Preferably, a gold deposited film 21 is also formed on inner surfaces of electrode plates 20a and 20b attached to each end 10a (10b) of the diaphragm 10.

The invention relates to a density conversion device for a PCB test machine. The invention is characterized in that the conversion device comprises a conversion dial arranged at the upper layer and a winding wire arranged at the lower layer, wherein the conversion dial is provided with a spring return mechanism to ensure good electrical connection between a contact point and a probe of the test fixture, and thus, the gap between the contact point and the probe of the test fixture caused by mutual extrusion or relative position change can be eliminated in time by the self-reset function of the spring return mechanism; and one end of the winding wire arranged at the lower layer of the conversion device is connected with a lead wire of the conversion dial, and the other end is in contact with a probe of the test machine needle bed to enable a spring below the probe to be in a compressing state so as to ensure good electrical contact between the probe of the test machine needle bed and the lead wire. The conversion device greatly improves the reliability of test after density conversion by the cooperation of the conversion dial and the winding wire, therefore, the test for a high-density PCB without changing the original configuration of the test machine is feasible.

Disclosed herein are a sheet-like probe for wafer inspection, by which a good electrically connected state to a wafer can be surely achieved even when the pitch of electrodes to be inspected in the wafer is extremely small, and applications thereof.

The sheet-like probe for wafer inspection of the invention has an insulating sheet, in which a plurality of through-holes each extending in a thickness-wise direction of the insulating sheet have been formed in accordance with a pattern corresponding to a pattern of electrodes to be inspected in all or part of integrated circuits formed on a wafer, and electrode structures arranged in the respective through-holes in the insulating sheet so as to protrude from both surfaces of the insulating sheet. Each of the electrode structures is formed by linking a front-surface electrode part exposed to a front surface of the insulating sheet and having a diameter greater than a front surface-side opening diameter of the through-hole in the insulating sheet to a back-surface electrode part exposed to a back surface of the insulating sheet and having a diameter greater than a back surface-side opening diameter of the through-hole in the insulating sheet through a short circuit part inserted through into the through-hole in the insulating sheet, and is movable in the thickness-wise direction of the insulating sheet.

A backboard connector is composed of an insulative main body with insertion slot, a row of low-speed signal terminals, and an inserted module with two rows of high-speed signal terminals whose one end is proejcted from the module for contacting with a subboard. When the said inserted module is rotated to the first position, the connector is opened to allow the sub-board to be inserted. At the second position, the connector is closed to clamp the sub-board between inserted module and low-speed signal termials. The main body has a driver of inserted module.

An anode holder is used to hold an anode in a plating tank. The anode holder includes a bar having a conductive portion connected to a power source, a conductive anode shaft attached to the bar, and an anode connected to the conductive anode shaft. The conductive anode shaft includes an external thread portion provided at an end of the conductive anode shaft, an O-ring, and a step portion provided between the O-ring and the external thread portion. The step portion has a diameter larger than a diameter of the external thread portion but smaller than a diameter of the O-ring. The anode includes an internal thread hole to which the external thread portion of the conductive anode shaft is screwed. The anode also includes a receiving portion for receiving the step portion of the conductive anode shaft in a state such that the O-ring of the conductive anode shaft is brought into contact with an inner surface of the receiving portion.

The invention relates to a method for forming a three-dimensional memory and the three-dimensional memory. The memory comprises a substrate; a first stack and a second stack of stacks on the substrate, wherein the first stack and the second stack respectively comprises spaced gate layers; a plurality of first channel holes in the first stack; a plurality of first channel layers arranged in the plurality of first channel holes; a plurality of second channel holes arranged in the second stack; a plurality of second channel layers arranged in the plurality of second channel holes, wherein each second channel layer corresponds to each first channel layer; and a conductive pattern layer arranged between the first stack and the second stack, wherein the conductive pattern layer comprises a plurality of mutually isolated intermediate conductive parts, each intermediate conductive part is connected with a corresponding first channel layer and a corresponding second channel layer, each intermediate conductive part projects outward from the first channel hole in a radial direction of the first channel hole.

Provided are a probe member, a probe card and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small. The probe member of the invention has a sheet-like probe, which is composed of a frame plate made of a metal, in which an opening has been formed, and a plurality of contact films arranged on and supported by a front surface of the frame plate so as to close the opening, wherein the contact film is obtained by arranging, in a flexible insulating film, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, and is arranged on a back surface of the sheet-like probe. The opening of the frame plate in the sheet-like probe has a size capable of receiving the external shape in a plane direction in the frame plate of the anisotropically conductive connector.

The invention discloses a probe card for integrated circuit detection, which comprises a probe holder and a detection circuit board. The probe card is provided with a gear stopping part in its formation. The lower end of the gear stopping part abuts against an elastic bag casing. The elastic bag casing is filled with gas. The elastic bag casing is provided with an air outlet in its formation. The air outlet is articulated with a sealing door. The side wall of the probe hole at one side of the sealing door is provided with an air ventilation groove. The side wall of the air ventilation groove is provided with an air pushing piston block. The air pushing piston block divides the air ventilation groove into an air ventilation area and a restoration area. The restoration area is provided therein with a restoration spring. One end of the restoration spring presses and leans against the air pushing piston block while the other end presses and leans against the inner side wall of the end part of the air ventilation groove. The probe hole is inserted by and connected with a vertically standing conducting strip. The upper end of the conducting strip is flexibly connected with the upper end and the lower end of the gear stopping part and is connected to the detection circuit board. The probe card of the invention has a simple structure and is convenient to manufacture and assemble. The probe card can also avoid the contact failure caused by the machinery fatigue of the spring mounted in a traditional probe card in the prior art.

Disclosed herein are a probe member for wafer inspection, a probe card for wafer inspection and a wafer inspection apparatus, by which a good electrically connected state can be surely achieved, positional deviation by temperature change can be prevented, and the good electrically connected state can be stably retained even when a wafer has a diameter of 8 inches or greater, and the pitch of electrodes to be inspected is extremely small.

The probe member of the invention has a sheet-like probe, which is composed of a frame plate made of a metal, in which a plurality of openings have been formed, and a plurality of contact films arranged on and supported by a front surface of the frame plate so as to close the respective openings, wherein each of the contact films is obtained by arranging, in a flexible insulating film, a plurality of electrode structures, and an anisotropically conductive connector, which is composed of a frame plate, in which a plurality of openings have been formed, and a plurality of elastic anisotropically conductive films arranged on and supported by the frame plate so as to close the respective openings, and is arranged on a back surface of the sheet-like probe, wherein each of the openings of the frame plate in the sheet-like probe has a size capable of receiving the external shape in a plane direction in the elastic anisotropically conductive film.

An electric skateboard with a hinge mechanism includes a first load plate, a second load plate, a hinge mechanism and an electric wire. A first wheel set is installed in the first load plate, and the first load plate includes a first accommodating space. A second wheel set is installed in the second load plate, and the second load plate includes a second accommodating space. A hinge mechanism includes a bridge base and two shaft sleeves pivotally connected at two sides of the bridge base. The bridge base and the two shaft sleeves together form a wiring slot. The two shaft sleeves are fixed to the first load plate and the second load plate respectively, so that the first load plate and the second load plate are foldable toward each other. The electric wire is inserted through the wiring slot.

The invention discloses an array substrate, a display panel and methods of manufacturing the same, and a display device. The array substrate comprises: a pixel region and a wiring region located outside the wiring region; a gate line and a data line each arranged within both the pixel and wiring regions; a passivation layer arranged to cover the gate and data lines and provided therein with trenches respectively exposing and being wider than the gate and data lines within the wiring region; first and second signal line partially arranged within the trenches respectively and contacting exposed portions of the gate and data lines to transmit signals to the gate and gate lines respectively, the first and second signal line each having widths equal to those of the trenches respectively. With the invention, good electrical connections between the signal line and the gate and data lines are enabled.

A waterproofing structure for a connector includes a first housing having a first terminal reception chamber for receiving a terminal and a second housing having a second terminal reception chamber for receiving a terminal. An opening end of the first terminal reception chamber is opposed to an opening end of the second terminal reception chamber, so that a gap with which circumferential edges of the opening ends are opposed to each other is configured to be sealed. An annular member made of resin is provided at the circumferential edge of the opening end of the first terminal reception chamber, the annular member having an inner circumferential surface widened toward the second housing. The circumferential edge of the opening end of the second terminal reception chamber abuts against the inner circumferential surface of the annular member.

In a method for manufacturing a substrate, connections are provided through metal columns of bumps press-fitted into an insulating resin layer between metal foils contact-bonded to a thermosetting insulating resin layer. Bumps of a conductive paste containing metal fillers are formed on a metal foil which is to be contact-bonded to an insulating resin layer, the bumps are heated to bound the metal fillers to each other, and form a metallic bond between the bumps and the metal foil, the metal columns are press-fitted into the insulating resin layer to contact-bond the metal foil to the insulating resin layer, and join the tips of the metal columns to a metal foil, the metal columns are then reheated to form a metallic bond between the metal columns and the metal foil.