51results about How to "Prevent be break" patented technology

A method for making thin semiconductor devices is disclosed. Starting from wafer with pre-fabricated front-side devices, the method includes:Thinning wafer central portion from its back-side to produce a thin region while preserving original wafer thickness in the wafer periphery for structural strength.Forming ohmic contact at wafer back-side.Separating and collecting pre-fabricated devices. This further includes:Releasably bonding wafer back-side onto single-sided dicing tape, in turn supported by a dicing frame. Providing a backing plate to match the thinned out wafer central portion. Sandwiching the dicing tape between wafer and backing plate then pressing the dicing tape to bond with the wafer.With a step-profiled chuck to support wafer back-side, the pre-fabricated devices are separated from each other and from the wafer periphery in one dicing operation with dicing depth slightly thicker than the wafer central portion. The separated thin semiconductor devices are then picked up and collected.

An object of the invention is to facilitate attachment of a spacer to a support member in an assembling process of a liquid crystal display device. A display device includes: a display panel, a support member that supports the display panel and a spacer that is interposed between a cut end surface of the display panel and a first surface of the support member, the first surface facing the cut end surface of the display panel. The support member has a recess that opens through the first surface and a second surface, which is connected to the first surface and extends away from the display panel. The spacer includes a spacer position securing portion inserted in the space of the recess of the support member and a buffer portion that is integral with the spacer position securing portion and protrudes from the open end at the first surface of the support member toward the cut end surface of the display panel.

An object of the present invention is to provide a treating method for brittle member capable of stably holding the brittle member when applying predetermined treatments such as transportation and grinding back surface of a brittle member such as a semi-conductor wafer and separating the brittle member without breakage after finishing required treatment to thereby attaining high thickness accuracy of the brittle member.A treating method for brittle member comprising: a step of removably fixing a brittle member on a flexible glass base plate, a step of treating said brittle member, a step of fixing said brittle member side by holding means, and a step of separating said flexible glass base plate from said brittle member by bending said flexible glass base plate.

A technique with which die bonding can be carried out without forming a void in a bond area is provided. A vacuum supply line that connects to a vacuum chuck hole formed in the bottom face of a vacuuming collet and supplies the vacuuming collet with reduced pressure for vacuum chucking a chip is constructed of two systems. That is, the vacuum supply line is so structured that a first pipe and a second pipe connect to the vacuuming collet. The first pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is unstuck from a dicing tape and transported to a mounting position on a wiring substrate. The second pipe supplies the vacuuming collet with a vacuum that provides suction force when a chip is mounted over a wiring substrate. The intensity of the vacuum (suction force) supplied to the vacuuming collet is controlled by opening or closing valves respectively installed in the pipes.

Provided is a package form, with which cleanness of a glass film is ensured and the glass film is prevented from breaking. The package form is effective in minimizing the number of glass film processing steps to be performed before packaging and after unpackaging. As the package form for a glass film, provided is a glass roll (1) formed by winding a glass film (2) into a roll while superposing the glass film (2) on a protective sheet (3), the glass film (2) being formed by an overflow downdraw method and having exposed front and back surfaces.

To improve the fabrication yield of semiconductor devices. A semiconductor device where a desired number of semiconductor chips are laminated in the thickness direction thereof is fabricated by repeating, an arbitrary number of times such as one time or two or more times, a step of bonding and mounting another support substrate laminate on first bumps exposed by separating and removing one support substrate from a support substrate laminate composite where second bumps of two support substrate laminates including plural semiconductor wafers mounted on support substrates have been made to face each other and are electrically connected.

On the surface of a silicon nitride film, there is formed a thermal oxide film, over which a CVD oxide film is then formed to provide a silicon oxide film of two-layered structure films. Moreover, the total thickness of the two-layered structure films is set to a value from 5 nm to 30 nm. Thus, the silicon oxide film is made into the two-layered structure films of the thermal oxide film and the CVD oxide film to thereby achieve the thickness of the silicon oxide film. As a result, it is possible to prevent a Vth from being lowered by a charge trap phenomenon and to prevent the Vth from fluctuating due to the enlargement of the bird's beak length by the silicon oxide film.

Provided are a stack semiconductor package manufactured by multiple molding that can prevent the breakage due to stress concentration at a connecting portion between separate semiconductor packages and a method of manufacturing the same. The stacked semiconductor packages are combined together through sealing resins by molding them multiple times, resulting in uniform stress distribution across substantially the entire interface between the semiconductor packages.

A needle-hub assembly, the improvement comprising a small tissue deflector connected to the needle, wherein the deflector deflects tissues away from the hub to prevent needle penetration to the hub, but permits the needle to bend adjacent to the hub, thereby enhancing the retrievability of the needle from the tissues if the needle were to separate.

A highly reliable capacitor, a semiconductor device having high operating performance and reliability, and a manufacturing method thereof are provided. A capacitor formed of a first conductive film 102, a dielectric 103 made of an insulating material, and a second conductive film 104 is characterized in that a pin hole 106 formed by chance in the dielectric 103 is filled up with an insulating material (filler) 107 made of a resin material. This can prevent short circuit between the first conductive film 102 and the second conductive film 104. The capacitor is used as a storage capacitor provided in a pixel of a semiconductor device.

A telephone includes an upper casing, a lower casing, and a receiver transmitter. The lower casing has a pair of projecting support sections at one end of the bottom, to which a first leg is rotatably mounted. The first leg includes a rotatable and slidable second leg. In a large-angle inclined state of the telephone, first and second engaging sections of the second leg are in engagement with first and second engaged sections of the first leg, respectively. When an excessive load is applied to the telephone in the direction of the arrow, the engaging sections are elastically deformed, being brought out of engagement with the engaged sections. Accordingly, the second leg tilts onto a desk into parallel with the desk. Consequently, the second leg is subjected to no longitudinal load. Thus, even if the second leg is not strong in structure, the second leg can be prevented from breaking.

There are provided a plurality of semiconductor apparatuses judged as good items in electrical and functional inspections while having internal connection terminals disposed on electrode pads of semiconductor chips, resin layers which are disposed on surfaces of the semiconductor chips in which the electrode pads are formed and expose the internal connection terminals, and wiring patterns which are disposed on the resin layers and are connected to the internal connection terminals, a wiring substrate on which the plurality of semiconductor apparatuses are stepwise stacked, the wiring substrate electrically connected to the plurality of semiconductor apparatuses, and a sealing resin with which the plurality of semiconductor apparatuses are sealed.

In a method of manufacturing a semiconductor device including independent gate patterns separated from each other, an active region is defined by forming a field region on a substrate. A gate oxide layer and a polysilicon layer are formed on the substrate. A preliminary gate pattern is formed by partially removing the polysilicon layer along a first direction by a first etching process. A spacer is formed along a side surface of the preliminary gate pattern. A number of separated gate patterns is formed by partially removing the preliminary gate pattern along a second direction crossing the first direction by a second etching process. The gate patterns overlap with the active regions and are separated from each other. Therefore, the overlap margin is increased, and the polysilicon layer is prevented from being over-etched when it is patterned to form the gate pattern.

A fiber optic parametric amplifier that includes a resonating cavity. The resonating cavity includes linear fiber optic gain medium, with negative chromatic dispersion; and a nonlinear fiber optic gain medium with positive chromatic dispersion.

A conductive lead 21 or 22 welded to a positive electrode 11 or a negative electrode 12 protrudes from the upper surface side and the lower surface side of an electrode group 10. The conductive leads 21 and 22 have spiral shape portions 21b and 22b and end portions 21c and 22c for welding, respectively. The end portion 21c for welding of the conductive lead 21 is welded to a lid unit 5, and the end portion 22c for welding of the conductive lead 22 is welded to a can bottom 203 of a battery can 2. The end portion 22c for welding of the conductive lead 22 is positioned corresponding to a hollow portion 15a of an axial core 15.

A wire electric discharge machine capable of maintaining machining-fluid temperature in a machining tank uniformly, even when the state of machining changes, for example between rough machining and finish machining. A first temperature sensor for detecting the machining-fluid temperature in a clean-fluid tank is provided to the clean-fluid tank or a machining-fluid cooling device. A second temperature sensor for detecting the machining-fluid temperature in the machining tank is provided. On the basis of machining conditions, etc., a controller of the wire electric discharge machine selects the second temperature sensor in machining producing much heat such as rough machining, and selects the first temperature sensor in machining producing little heat such as finish machining. The machining-fluid cooling device performs cooling control on the machining fluid in the clean-fluid tank based on the temperature detected by the selected temperature sensor.

A drive circuit for a switching power supply includes a driving element (11, 12) for generating a drive signal (SD), and a transformer (15) for outputting the drive signal input via a capacitive element to a primary winding (15a) thereof (14), to a main switching element (21) from a secondary winding (15b) thereof. The drive circuit (3) is constructed such that breakage of the main switching element (21) can be prevented while permitting an increase in the range of switching control. The drive circuit (3) is characterized by comprising an inductive element (16) having an inductance value smaller than at least a value of an excitation inductance of the primary winding (15a) and allowing series resonance to be produced between the capacitive element (14) and the inductive element (16).

A method for assembling a gas sensor includes fitting through holes of annular mounting parts with an element dummy disposed vertically and whose cross-sectional shape perpendicular is similar to that of a sensor element. The annular mounting parts are a plurality of parts including a ceramic powder compact. A tubular body is fitted with outer peripheries of the annular mounting parts, and then, the element is abuttingly disposed on an upper end of the dummy. Subsequently, the dummy is moved vertically downward to fit the through holes of the annular mounting parts with the element, thereby obtaining a workpiece. The workpiece is vertically inverted, and with the element tip being in contact with a sealing assist jig that has a buffer performance, the upper end of the uppermost annular mounting part is pressed vertically downward to compress the powder compact, thereby sealing an inside of the tubular body.

A rotor of an ultra high speed induction motor includes a stacked body having a plurality of loop type steel sheets stacked to form a cylinder, with a plurality of slots circumferentially formed in a lengthwise direction of the stacked body. Loop type upper, lower end rings are disposed on the upper and lower portions of the stacked body and having a plurality of upper and lower through-holes, respectively, to correspond to the slots. Conductive bars are coated with fusible bonding flux and are inserted into the upper through-holes, the slots, and the lower through-holes such that the conductive bars are integrally bonded into the upper through-holes, the slots, and the lower through-holes, following the fusion and solidification of the fusible bonding flux.

A tiltable-rotatable circular-table device for a machine tool includes a rotary-driving motor which is fixed to a tiltable table and is for rotating a circular table disposed above the tiltable table; a motor cover which is fixed to the main frame and is for housing the rotary-driving motor; and cables connected with the rotary-driving motor. The tiltable-rotatable circular-table device further includes a cable guide whose one end is fixed to the motor cover and the other end is fixed on a periphery of the rotary-driving motor. The cable guide is housed in the motor cover and is capable of surrounding at least a portion of the periphery of the rotary-driving motor so as to guide the cables in a direction in which the cables extend. The cable guide is bendable mainly in its thickness direction at multiple sections thereof such that the cable guide is capable of surrounding the rotary-driving motor.

The radio frequency (RF) grounding apparatus of the present invention uses a clamp to clamp an RF grounding rod by surface contact to improve the connection stability. The clamp is connected to a flexible conductive sheet to form a grounding path to avoid the arcing generated by the bottom part (e.g., a heater) of a traditional plasma reaction chamber and to avoid breakage of the ceramic surface of the bottom part of the plasma reaction chamber, which would be caused by the RF grounding rod due to thermal expansion. The heater of the plasma reaction chamber, which is equipped with the RF grounding apparatus of the present invention, exhibits an extended lifetime. The top of the RF grounding rod is fixed to an RF mesh, and the RF grounding rod extends downward. The bottom of the RF grounding rod is clamped firmly and electrically by the clamp. The flexible conductive sheet connects the clamp and the grounding base of the plasma reaction chamber to form a grounding path.

An impedance matching apparatus has: a storing portion 70 for previously storing, for plural positions which can be taken by a movable portion of a variable impedance element, allowable power values respectively corresponding to the plural positions of the movable portion; and an abnormality determining portion 80 for determining an allowable power value based on the present positions of the movable portion supplied from position detecting portions 41, 42 and the allowable power values stored in the storing portion 70, for comparing the allowable power value with an input power value, and for determining that it is abnormal when the input power value is larger than the allowable power value. Accordingly, the calculation load during the matching operation can be reduced.

A deburring tool includes a blade having a cutting head portion, an anchor portion, and a retention spring. An arbor is adapted to removably mount the blade such that the head portion of the blade is adapted to be elevated a predetermined distance from the arbor in an unstressed condition of the blade. The blade is sufficiently resiliently yieldable such that the head portion of the blade can move inwardly relative to the arbor during deburring operations. A holder is adapted to mount the arbor and an adjustment member adapted to operatively engage the anchor portion of the blade. The anchor portion of the blade is adapted to move in response to adjustment of the adjustment member in a direction substantially opposite that of the head portion and flex to elevate the head portion relative to the arbor for deburring operations or recess the head portion relative to the arbor.

Problem to be SolvedThe present invention is directed to providing a pallet having a large thickness, having inner ribs not easily broken formed therein, and having high bending strength.SolutionA pallet 10 having a hollow double-walled structure formed by blow molding includes a first wall 13 on which a cargo is placed, a second wall 14 spaced apart from the first wall 13 by a predetermined distance, and inner ribs that connect the first wall 13 and the second wall 14. In the pallet 10, the inner ribs are respectively formed by continuously abutting and integrating end surfaces of first inner ribs 13a and 13b projecting from the first wall 13 toward a hollow portion and end surfaces of second inner ribs 14a and 14b projecting from the second wall 14 toward the hollow portion.

A multi-panel display device includes a first display device including a first display region and a first non-display region surrounding the first display region; a first optical member located on the first display device and including optical fibers; and a first protection film covering an outside of the first optical member.

A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element.

A lens barrel that is capable of decreasing a barrel length under a retracted condition by simplifying a configuration. The lens barrel changes a focal length by moving first and second lens groups in an optical axis direction. A light-amount adjusting member is located between the first and second lens groups. First, second, third holding frames hold the first lens group, the second lens group, and the light-amount adjusting member, respectively. A cam mechanism moves the first, second, and third holding frames in the optical axis direction so that a part of the second lens group is inserted into the aperture of the light-amount adjusting member and concave and convex surfaces of the first and second lens groups are overlapped in the optical axis direction under a retracted condition. The aperture diameter of the light-amount adjusting member is enlarged when shifting to the retracted condition from a shooting condition.