The invention relates to the technical field of
laser precision
machining, and discloses a nanoscale high-definition
laser plate roller technology which comprises the following steps that the surface of a plate roller workpiece is coated with
dielectric machining liquid, and a liquid film
machining interface is formed; starting a non-contact ultrasonic traveling wave generator array, stabilizing the flow of the liquid film, and maintaining the thickness of the liquid film to be uniform; a
laser is started, light beams of the laser penetrate through the uniform liquid film, and
ablation machining is conducted on the plate roller workpiece; during
processing, starting an electrostatic auxiliary
chip removal
system, applying direct-current
high voltage between the workpiece and a
processing liquid system, and actively capturing ablative particles; and meanwhile, an online
light scattering turbidity sensor is started, downstream
turbidity changes are monitored,
turbidity signals are fed back to a laser
control system in a
closed loop mode, and the position of a laser focus is adjusted in real time. According to the invention, an electrostatic auxiliary
chip removal
system is utilized, and a high-
voltage direct-
current electric field is applied, so that active and directional capture and removal of ablated particles are realized, the
processing cleanliness is improved, and a plate roller surface almost free of redeposition
pollution is obtained.