A knowledge based, computer-aided
system and method is disclosed for simulating any set of linear or nonlinear simultaneous parametric dependencies. The preferred embodiment creates a model and provides an estimate of the material properties of materials comprising thin films disposed on
semiconductor materials. However the
system and method are suitable for creating a model and providing an estimate of the physical properties of materials undergoing other material fabrication processes that are dependent on several parameters. The method is suitable for implementation on exisitng
general purpose computers. The method involves the general steps of entering parameter values for the material being subjected to the fabrication process, interrelating the user provided parameter values with a
database of stored parameter values, calculating numerical solutions for the interrelated parameter and property values according to an
Estimation Routine, and providing an output of numerical and
graphical data relating to the desired physical properties. The
system is capable of being implemented to include a dual hierarchical feedback and feed-foreward loop where a
control system uses the
Estimation Routine to determine what additional
data acquisition is required. Such a
feedback loop could also be employed in conjunction with this method to yield an optimized value for the material properties in question.