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30results about How to "Alter its performance" patented technology

Method for manufacturing precision electroplated solder bumps

A method for fabrication of a solder bump, comprising applying preferably an insulating film, followed by applying a multilayer underbump metallization, a layer of a photoresist, and a thin layer of titanium on a substrate containing, preferably, III-V semiconductor circuits. The multilayer UBM pad, preferably comprising a 0.02 to 0.05 micrometer thick layer of titanium, a 0.5 to 1.0 micrometer thick layer of nickel and a 0.1 to 0.2 thick layer of gold. The protective film with the thickness of preferably 0.5 to 40 micrometer comprises a photoresist. After the solder has been electroplated, the protective film is removed, preferably by dry etching or with a solvent. The titanium film serves a dual function of being a membrane for electroplating of the solder and of being a non-wettable dam for wetting back of the plated solder. The titanium film with the thickness of 200 to 1,000 Angstroms is preferably deposited by evaporation. After the solder has been electroplated, much of the titanium film is removed, preferably by wet etching or dry etching, leaving only a band of titanium that surrounds the disk of solder. A multilayer solder bump structure for III-V semiconductor circuits manufactured using this method, comprising, preferably, an insulating film, a multilayer underbump metallization layer, and remnants of the thin titanium film.
Owner:HRL LAB

Precision electroplated solder bumps and method for manufacturing thereof

A method for fabrication of a solder bump, comprising applying preferably an insulating film, followed by applying a multilayer underbump metallization, a layer of a photoresist, and a thin layer of titanium on a substrate containing, preferably, III-V semiconductor circuits. The multilayer UBM pad, preferably comprising a 0.02 to 0.05 micrometer thick layer of titanium, a 0.5 to 1.0 micrometer thick layer of nickel and a 0.1 to 0.2 thick layer of gold. The protective film with the thickness of preferably 0.5 to 40 micrometer comprises a photoresist. After the solder has been electroplated, the protective film is removed, preferably by dry etching or with a solvent. The titanium film serves a dual function of being a membrane for electroplating of the solder and of being a non-wettable dam for wetting back of the plated solder. The titanium film with the thickness of 200 to 1,000 Angstroms is preferably deposited by evaporation. After the solder has been electroplated, much of the titanium film is removed, preferably by wet etching or dry etching, leaving only a band of titanium that surrounds the disk of solder. A multilayer solder bump structure for III-V semiconductor circuits manufactured using this method, comprising, preferably, an insulating film, a multilayer underbump metallization layer, and remnants of the thin titanium film.
Owner:HRL LAB

Integrated marine performance system

A system for improving the performance of a powered boat that includes both methods and apparatuses that provide a powered boat ways to stabilize, control, and optimize the powered boat's performance when the powered boat is in powered motion. The system provides capabilities of enhancing the powered boat's performance by responding to both aerodynamic and hydrodynamic effects upon the powered boat when the powered boat is in motion. Some embodiments of the system are capable of altering its way of responding to aerodynamic effects while the powered boat is in powered motion, other embodiments are capable of altering the powered boat's response to hydrodynamic effects while the powered boat is in powered motion, and still other embodiments are capable of altering the powered boat's response to both aerodynamic and hydrodynamic effects while the powered boat is in powered motion. Certain embodiments of the system are capable of utilizing aerodynamic elements that operate on the air stream flowing within a tunnel formed within a multihull of a powered boat, while other embodiments are capable of mitigating the effects of water impacts upon the roof of a tunnel formed within a multihull powered boat. Still other embodiments are capable of responding to aerodynamic effects by interacting with portions of the air stream that passes above the boat while mitigating the potential for negative effects due to cross-winds impacting the structure which rises above a deck of the powered boat.
Owner:SCISM RANDY MARK +1

Integrated marine performance system

A system for improving the performance of a powered boat that includes both methods and apparatuses that provide a powered boat means to stabilize, control, and optimize the powered boat's performance when the powered boat is in powered motion. The system provides capabilities of enhancing the powered boat's performance by responding to both aerodynamic and hydrodynamic effects upon the powered boat when the powered boat is in motion. Some embodiments of the system are capable of altering its means of response to aerodynamic effects while the powered boat is in powered motion, other embodiments are capable of altering the powered boat's response to hydrodynamic effects while the powered boat is in powered motion, and still other embodiments are capable of altering the powered boat's response to both aerodynamic and hydrodynamic effects while the powered boat is in powered motion. Certain embodiments of the system are capable of utilizing aerodynamic elements that operate on the air stream flowing within a tunnel formed within a multihull of a powered boat, while other embodiments are capable of mitigating the effects of water impacts upon the roof of a tunnel formed within a multihull powered boat. Still other embodiments are capable of responding to aerodynamic effects by interacting with portions of the air stream that passes above the boat while mitigating the potential for negative effects due to cross-winds impacting the structure which rises above a deck of the powered boat.
Owner:SCISM RANDY MARK +1
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