421results about How to "Bonded firmly" patented technology

Methods and devices for providing a minimally-invasive placement of a mechanical structure for reducing the volume of a hollow body organ. Anchors may be secured within the hollow body organ and then cinched together using a tensioning member to form a stricture within the hollow body organ. In another embodiment a tensioning member may be threaded along the hollow body organ and then cinched to reduce the volume. The strictures may be placed anywhere within the hollow body organ, and more than one stricture may be formed within the hollow body organ.

An arrangement of building elements capable of a snap-fastening interconnection comprises an element, especially the tongue, consisting of a different material from the other building elements. An MDF/HDF panel, is initially milled along the longitudinal and/or transverse sides, and the resulting groove is then provided and/or foam-filled with extrudates. Finally, the free ends of the extrudates are milled to form the profile of the tongue. Alternatively, or additionally, a groove may also be milled into the extrudates.

A thermoplastic elastomer composition which, when used for the inner tube and/or outer cover of a hose, can improve the hose flexibility at an ordinary temperature and low temperature, oil resistance, and cold resistance and can reduce the production costs since it does not require a vulcanization step and a hose having said properties using this elastomer composition for its inner tube and/or outer cover and a process and apparatus for the production thereof.

The present invention discloses a disposable scrubbing product for use in household cleaning or personal care applications. In one embodiment, the present invention is directed to a cleaning tool including a handle and a rigid base to which the scrubbing product of the present invention may be attached to form a convenient cleaning tool. The scrubbing product of the invention is a multi-layer laminate product and generally includes at least two distinct layers, an abrasive layer and an absorbent fibrous layer such as a tissue layer made from papermaking fibers. The abrasive layer is formed primarily of polymeric fibers in a disordered or random distribution as is typical of fibers deposited in meltblown or spunbond processes so as to form an open, porous structure. In one embodiment, an anchoring agent, such as synthetic fibers, are incorporated into the tissue layer that form a bond with the abrasive layer when forming a laminate in accordance with the present invention.

A capillary has a face surface 13 formed at the tip end thereof so that the face surface 13 inclines toward the center thereof so as to have a tapered shape, and has a through hole 11 formed therethrough so as to permit wire to be placed therethrough so that the through hole 11 has an opening 12 at the center of the face surface 13. The inclination angle θ of the face surface 13 relative to the plane perpendicular to the axis of the capillary and including the opening 12 of the through hole 11 is in the range from 4° to 15°, and the height h of the face surface 13 along the axis of the capillary is equal to or greater than the thickness of the wire 2.

The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

A structural reinforcement for a hollow section at least part of at least one of whose surfaces is the internal surface of an external panel comprising a rigid reinforcing member having a shape that substantially conforms to the cross section to be reinforced. An expandable adhesive material is provided over a portion of the surface of the rigid reinforcing member and the shape of the rigid reinforcing member and the amount and location of the expandable adhesive is such that upon foaming the foam contacts and bonds to the internal surfaces of the hollow section other than the interior surface of the external panel. In this way deformation of the external body panel during the foaming and/or cooling of the foamed expandable material is reduced or prevented.

An adhesively mountable image using a reusable adhesive surface is provided. The image carrier is removable from the adhesive carrier, and a subsequent image carrier may be releasably bound to the same adhesive carrier. Kits for this system are also provided.

An adhesive film prevents static charge on peeling generated when removed from an adherend and also improves adhesion between a base material and an adhesive layer, where an under coat layer containing an organometallic is formed on the base material and then an adhesive layer is formed on the base material. Alternatively, an adhesive film showing high adhesion with a glass substrate, and including an antistatic layer, which prevents static charge on peeling generated when the surface protective film is removed, and improves adhesion between a base material and an adhesive layer, where the adhesive film includes a base material, an adhesive layer made of a water dispersible adhesive including, and an antistatic layer, containing a water soluble or water dispersible conductive material, interposed between them, and the adhesive film is stuck onto an image display device.

The invention aims to provide a thermosetting flux suitable for solder bonding of a semiconductor element and an electronic part and making solder bonding with a high bonding strength and a high heat resistant strength at a high temperature possible and a paste containing the flux and a non-lead type solder paste and with respect to the thermosetting flux, an epoxy resin, a hardening agent, and at least one of rosin derivatives having functional groups reactive on the epoxy resin and selected from maleic acid-modified rosin, a fumaric acid-modified rosin, and acrylic acid-modified rosin are used. The flux can be used in form of a solder paste while being mixed and kneaded with the non-lead type solder alloy powder.

A compound punching film and preparation thereof, said punching film consisting of a layer of plastic film and one or two side compound non-woven fabrics. On plastic film is of evenly spread tiny mesh, density thereof is 170-500 mesh/ C sqm ,perforating rate is 10-35%. Said whole compound film is perforated of evenly big mesh , aperture thereof greater than that of tiny mesh two times, the shape of big mesh is of funnel, thereof protruding to one side and on the surface of awl is of tiny mesh. Said invention combines PE film technique and punching one, making compound of a layer of non-woven fabric and cast film with the help of high melting temp. of cast film, also making use of mesh cage through vacuum suction nozzle punching tiny mesh, thereafter punching big mesh by pressure roller machine, thus to prepare new compound punching film with good permeability, softness and strong third dimension.

A method for manufacturing an electronic device includes the steps of forming a first resist pattern on a primary surface of a SAW element, the first resist pattern having openings at positions corresponding to those at which bumps and a sealing frame are to be formed, sequentially forming metals over the first resist pattern, the metals being formed into adhesion layers, barrier metal layers, and solder layers, removing the first resist pattern on the SAW element such that the bumps and the sealing frame are simultaneously formed. When the bumps and the sealing frame of the SAW element are bonded to bond electrodes of the bond substrate, the solder layers are melted and alloyed by heating.

Fibrous products containing a durable softening agent are disclosed. The softening agent generally comprises a polysiloxane containing a plurality of first functional groups. In order to improve the wet retention of the softening agent on cellulosic fibers, the softening agent is reacted with a retention agent. The retention agent generally comprises a cationic polymer having a second functional group. In one embodiment, for instance, the softening agent contains epoxy groups or anhydride groups, while the retention agent contains amine groups. Products that may be made according to the present invention include tissue products, wipes and other absorbent articles.

The invention discloses a bracket for a camera die set and the camera die set. The bracket comprises a bracket body; the bracket body comprises a first surface and a second surface which are oppositely arranged; a first concave groove and an annular boss are arranged on the first surface, wherein the annular boss is arranged around the outer side of the first concave groove; a second concave groove is formed in the second surface; through holes which pass through the first concave groove and the second concave groove are formed in the bracket body. According to the bracket for the camera die set, when a lens driving assembly is adhered on the part of the first surface, positioned at the outer side of the annular boss through an adhesive, excessive adhesive is difficult to flow to the first concave groove and a lens, so that the adhering firmness of the bracket and the lens driving assembly can be ensured, the adhesive can be prevented from adhering to a light filter and glass, and as a result, the light filtering performance of the light filter and the light transmission performance of the glass can be ensured, and the good imaging effect of the camera die set can be ensured; in addition, the lens is difficult to be adhered and fixed through excessive adhesive, and the focus of the lens can be normally adjusted.

An acoustical building panel and method of manufacturing it are disclosed. Embodiments of the panel include a porous nonwoven scrim, a coating deposited on the scrim, a base mat, and an adhesive deposited on either the base mat or the scrim in a discrete form such as in droplets. Embodiments of the method of manufacture include steps of perforating the base mat, applying the adhesive to the base mat in the discrete form, laminating the scrim onto the base mat, and applying the coating to the scrim surface.

In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.

A partially crosslinked adhesive-supported porous film for battery separator, which in producing a battery, can effectively produce a battery as an electrode/separator laminate in which an electrode and a separator are temporarily bonded to each other without causing mutual slip movement between the electrode and the separator and which after producing a battery, functions itself as a separator having a small heat shrinkage factor even at high temperatures, and a process of producing a battery using such a partially crosslinked adhesive-supported porous film. The partially crosslinked adhesive-supported porous film for battery separator, includes a porous film substrate having supported thereon a partially crosslinked adhesive that is partially crosslinked by preparing a reactive polymer having a functional group in the molecule and capable of being crosslinked upon reaction with a polyfunctional compound having reactivity with the functional group and then reacting the reactive polymer with a polyfunctional compound.

In a method of bonding objects to be bonded together in a solid phase at low temperature after subjecting bonding surfaces of the objects to be bonded to a hydrophilic treatment using a plasma, the objects to be bonded are conventionally handled in the atmospheric air for bonding, so that adhesion of organic substances in the atmospheric air leads to a reduction in bonding strength. Therefore, diffusion bonding needs to be performed at a temperature of as high as 1100° C. in the conventional art. According to the present invention, firm bond can be achieved at low temperature. In a method for bonding objects to be bonded together in a solid phase after subjecting bonding surfaces of the objects to be bonded to a hydrophilic treatment using a plasma, a chemical treatment step of subjecting both the objects to be bonded to the hydrophilic treatment using the plasma without exposure to the atmospheric air is performed after a physical treatment step of subjecting both the objects to be bonded to a physical treatment using an energy wave, such as an atom beam, an ion beam or a plasma, thereby bonding both the objects to be bonded together. Therefore, satisfactory bonding can be achieved without adhesion of organic substances or the like, thereby making it possible to achieve firm bond at a low temperature of 500° C. or less.

The present invention relates to an electrically heatable media line (1), comprising a fluid line (2) and at least one fluid connector (4) connected to a line end (2a). The fluid line (2) and the fluid connector (4) respectively have electric heating means (6, 10), wherein the fluid line (2) and/or the fluid connector (4) including electric connections (16) of the heating means (6, 10) are/is enclosed by a plastic molding compound.

Aiming at adjusting the height of bump electrodes connected to lands on a substrate, a semiconductor device 100 has a first interconnect substrate 103 and a second interconnect substrate 101. On one surface of these substrates, first lands 111 and second lands 113 are provided. The plane geometry of the second lands 113 is a polygon characterized by the inscribed circle thereof having an area smaller than the area of the inscribed circle of the first land.

In a nitride semiconductor laser bar including a group III-V nitride semiconductor layer, on the front-side cavity end face, a separation layer of aluminum nitride is laid, and further on the separation layer, an end face coating film of aluminum oxide is laid. Likewise, on the rear-side cavity end face, a separation layer of aluminum nitride is laid, and further on the separation layer, an end face coating film of an aluminum oxide/TiO₂ multilayer film is laid.

Melded footwear and process for manufacture of footwear. This enhanced shoe can be formed and assembled with a limited number of steps and without the need for much stitching. The shoe has a durable polyurethane shell, which is an integrated upper and outsole. The shoe contains a textile upper portion which is attached by direct injection molded. Molding the textile to the outsole eliminates the need for the use of adhesives. A locking plug element is provided that serves the dual function of providing cushioning around the heel and locking certain elements together.

A method for manufacturing a dual interface card includes at least the following step:

• • collocating multiple card support sheets one onto the other, some of these sheets showing holes, in order to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess
  • depositing a conductive adhesive onto the contact pads
  • positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive
  • executing one single lamination step of the sheets with the module in order to:
    • laminate the multiple layers together in order to form the card body
    • embed the dual interface module in the recess and
    • achieve the curing of the isotropic conductive adhesive and the permanent electrical contact between the antenna and the dual interface module.

In the preparation of a semiconductor device comprising a semiconductor member, the semiconductor member is subjected to plasma treatment and then primer treatment, prior to the encapsulation thereof with an encapsulant. The semiconductor device, typically LED package, is highly reliable in that a firm bond is established between the semiconductor member and the encapsulant resin.

A ceramic joint body including a ceramic substrate and a ceramic body such as a cylindrical body firmly bonded to each other and excellent in corrosion resistance in the ceramic substrate for use for a semiconductor product producing/examining the step. The ceramic bonded body includes a ceramic substrate in which a conductor is provided, and a ceramic body bonded to a bottom face of the ceramic substrate. The ceramic bonded body has a region, where no conductor is formed, in at least a part of a region above a bonding interface between the ceramic substrate and the ceramic body.