Electronic apparatus and manufacturing method thereof

Abstract

There are provided a plurality of semiconductor apparatuses judged as good items in electrical and functional inspections while having internal connection terminals disposed on electrode pads of semiconductor chips, resin layers which are disposed on surfaces of the semiconductor chips in which the electrode pads are formed and expose the internal connection terminals, and wiring patterns which are disposed on the resin layers and are connected to the internal connection terminals, a wiring substrate on which the plurality of semiconductor apparatuses are stepwise stacked, the wiring substrate electrically connected to the plurality of semiconductor apparatuses, and a sealing resin with which the plurality of semiconductor apparatuses are sealed.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to an electronic apparatus and a manufacturing method thereof, and relates to an electronic apparatus comprising a plurality of semiconductor chips stacked on a wiring substrate and a sealing resin with which the plurality of semiconductor chips are sealed, and a manufacturing method of the electronic apparatus.RELATED ART

[0002] FIG. 1 is a sectional diagram of a related-art electronic apparatus.

[0003] Referring to FIG. 1, a related-art electronic component 200 has a wiring substrate 201, semiconductor chips 202 to 204, a sealing resin 205 and external connection terminals 206.

[0004] The wiring substrate 201 has a core substrate 211, through vias 212, pads 213, 216, and solder resists 214, 217.

[0005] The core substrate 211 is a substrate formed in a plate shape and has through holes 219. The through vias 212 are disposed in the through holes 219. The upper end of the through via 212 is connected to the pad 213 and the lower end of the ...

Images