Density conversion method and density conversion device for PCB test machine

Abstract

The invention relates to a density conversion device for a PCB test machine. The invention is characterized in that the conversion device comprises a conversion dial arranged at the upper layer and a winding wire arranged at the lower layer, wherein the conversion dial is provided with a spring return mechanism to ensure good electrical connection between a contact point and a probe of the test fixture, and thus, the gap between the contact point and the probe of the test fixture caused by mutual extrusion or relative position change can be eliminated in time by the self-reset function of the spring return mechanism; and one end of the winding wire arranged at the lower layer of the conversion device is connected with a lead wire of the conversion dial, and the other end is in contact with a probe of the test machine needle bed to enable a spring below the probe to be in a compressing state so as to ensure good electrical contact between the probe of the test machine needle bed and the lead wire. The conversion device greatly improves the reliability of test after density conversion by the cooperation of the conversion dial and the winding wire, therefore, the test for a high-density PCB without changing the original configuration of the test machine is feasible.

Description

【Technical field】 [0001] The invention relates to the field of printed circuit board (Printed Circuit Board; PCB) testing, in particular to a density conversion method for a PCB testing machine and a device thereof. 【Background technique】 [0002] In the PCB testing industry, there is a standard universal test point specification - four density (that is, 400 test contact points are evenly arranged in 1 square inch), and each test point must be connected to the same test circuit, while the existing PCB board test equipment is to directly solder the test circuit pins to the test contact points through the connection for testing. However, the integration of circuit boards is getting higher and higher, and the solder joints are getting smaller and denser. Compared with Under the circumstances, the development of PCB board testing machines often lags behind. In addition, the price of PCB board testing machines is very high, and the companies that use them often cannot afford to u...

AI Technical Summary

Problems solved by technology

[0002] In the PCB testing industry, there is a standard universal test point specification - four density (that is, 400 test contact points are evenly arranged in 1 square inch), and each test point must be connected to the same test circuit, while the existing PCB board testing equipment is to directly solder the test circuit pins to the test contact points through the connection for testing. However, the integration of the circuit board is getting higher and higher, and the solder joints are getting smaller and denser. Under the circumstances, the development of PCB board testing machines often lags behind. In addition, the price of PCB board testing machines is very high, and the companies that use them often cannot afford to update the corresponding testing machines. Lost in the fierce market tide

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