Density conversion method and density conversion device for PCB test machine

A conversion device and density conversion technology, applied in the direction of measuring devices, coupling devices, electronic circuit testing, etc., can solve the problems of enterprise failure, small solder joints, dense density, etc., and achieve the effect of eliminating gaps and good electrical connections

Active Publication Date: 2009-11-11
SHENZHEN MASONE ELECTRONICS
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Problems solved by technology

[0002] In the PCB testing industry, there is a standard universal test point specification - four density (that is, 400 test contact points are evenly arranged in 1 square inch), and each test point must be connected to the same test circuit, while the existing PCB board testing equipment is to directly solder the test circuit pins to the test contact points through the connection for testing. However,

Method used

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  • Density conversion method and density conversion device for PCB test machine
  • Density conversion method and density conversion device for PCB test machine
  • Density conversion method and density conversion device for PCB test machine

Examples

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Example Embodiment

[0018] A method of density conversion for PCB testing machine, by setting a conversion device between the test fixture and the needle bed of the test machine, the device includes a two-layer structure, the upper layer is the conversion needle disk, the lower layer is the needle row; the upper end of the conversion needle disk corresponds to the test The fixture probe is provided with a mesh contact, the lower end is provided with a lead corresponding to the upper contact, and there is an electrical connection between the contact and the lead, and a reset connection is provided under the contact to ensure a good electrical connection between the contact and the test fixture probe The other end of the lead wire is connected to the lower-layer pin header. The lower-layer pin header is used to connect the lead wire with the needle bed probe of the testing machine and ensure a good electrical connection therebetween.

[0019] A conversion device suitable for the above-mentioned density...

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Abstract

The invention relates to a density conversion device for a PCB test machine. The invention is characterized in that the conversion device comprises a conversion dial arranged at the upper layer and a winding wire arranged at the lower layer, wherein the conversion dial is provided with a spring return mechanism to ensure good electrical connection between a contact point and a probe of the test fixture, and thus, the gap between the contact point and the probe of the test fixture caused by mutual extrusion or relative position change can be eliminated in time by the self-reset function of the spring return mechanism; and one end of the winding wire arranged at the lower layer of the conversion device is connected with a lead wire of the conversion dial, and the other end is in contact with a probe of the test machine needle bed to enable a spring below the probe to be in a compressing state so as to ensure good electrical contact between the probe of the test machine needle bed and the lead wire. The conversion device greatly improves the reliability of test after density conversion by the cooperation of the conversion dial and the winding wire, therefore, the test for a high-density PCB without changing the original configuration of the test machine is feasible.

Description

【Technical field】 [0001] The invention relates to the field of printed circuit board (Printed Circuit Board; PCB) testing, in particular to a density conversion method for a PCB testing machine and a device thereof. 【Background technique】 [0002] In the PCB testing industry, there is a standard universal test point specification - four density (that is, 400 test contact points are evenly arranged in 1 square inch), and each test point must be connected to the same test circuit, while the existing PCB board test equipment is to directly solder the test circuit pins to the test contact points through the connection for testing. However, the integration of circuit boards is getting higher and higher, and the solder joints are getting smaller and denser. Compared with Under the circumstances, the development of PCB board testing machines often lags behind. In addition, the price of PCB board testing machines is very high, and the companies that use them often cannot afford to u...

Claims

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Application Information

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IPC IPC(8): G01R1/02G01R1/073G01R31/28H01R31/06
Inventor 武勇潘海胡泉金
Owner SHENZHEN MASONE ELECTRONICS
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