Thermosetting epoxy resin composition and use thereof

A technology of epoxy resin and composition, applied in conductive materials, conductive materials, printed circuits, etc., can solve the problems of high hygroscopicity, poor dielectric properties, small molecular weight, etc., and achieve low water absorption, good heat resistance, The effect of high molecular weight

Active Publication Date: 2014-04-30
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional FR-4 materials mostly use dicyandiamide as a curing agent. This curing agent has good process operability due to its tertiary reactive amine, but because of its weak carbon-nitrogen bond, it is easy to crack at high temperature, resulting in curing The heat-resistant decomposition temperature of the substance is low, which cannot meet the heat-resistant requirements of the lead-free process
In this context, with the large-scale implementation of lead-free technology in 2006, the industry began to use phenolic resin as the curing agent for epoxy resin. Phenolic resin has a high-density benzene ring heat-resistant structure, so it is different from epoxy resin The heat resistance of the system is very excellent, but at the same time the dielectric properties of the cured product tend to deteriorate
[0003] In addition, as consumer electronic products have stricter environmental protection requirements, the halogen-free requirements for laminate materials are becoming more and more common. In order to achieve the same flame-retardant effect as the halogen system, the current main technical route is phosphorus resistance flame retardant, including phosphorus-containing epoxy resin, phosphorus-containing phenolic, and nitrogen-containing flame retardants and inorganic fillers to achieve halogen-free flame retardant, but the above halogen-free flame retardants in the high-frequency and high-speed application field, participate in the system Curing reaction, and the dielectric properties are poor due to the structural characteristics of the material itself, which cannot meet the dielectric performance requirements
Traditional phosphate esters do not participate in the system and have a relatively regular structure and good dielectric properties. However, traditional phosphate ester compounds have disadvantages such as small molecular weight, low melting point, and high hygroscopicity, so they cannot be used on copper clad layers. platen to be applied

Method used

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  • Thermosetting epoxy resin composition and use thereof
  • Thermosetting epoxy resin composition and use thereof
  • Thermosetting epoxy resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0087] Take a container, add 100 parts by weight of naphthol type novolac epoxy resin NC-7300L (Nippon Kayaku Corporation, EEW is 214g / eq), and then add 105 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC , solid content 65%) and stir well, then add flame retardant phosphonate-carbonate copolymer FRX HM1100 (FRX Polymers company, phosphorus content is 10.8%) 15 parts by weight, then add 0.075 parts by weight of curing accelerator DMAP, And the solvent toluene, continue to stir evenly to form a glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Use several prepregs prepared by stacking each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper clad laminate. The curing temperature is 150-250 ° C. The curing pressure is 25-60kg / cm 2 , The curing time is 90min.

Embodiment 2

[0089] Take a container, add 100 parts by weight of naphthol type novolac epoxy resin NC-7000L (Nippon Kayaku Corporation, EEW is 232g / eq), and then add 95 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC , solid content 65%) and stir evenly, then add 65 parts by weight of flame retardant phosphonate oligomer compound OL5000 (FRX Polymers company, phosphorus content is 10.8%), then add 0.075 parts by weight of curing accelerator DMAP, and solvent Toluene, continue to stir evenly to form a glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Use several prepregs prepared by stacking each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper clad laminate. The curing temperature is 150-250 ° C. The curing pressure is 25-60kg / cm 2 , The curing time is 90min.

Embodiment 3

[0091] Take a container, add 100 parts by weight of naphthol type novolak epoxy resin HP-5000 (Japan DIC company, EEW is 250g / eq), and then add 90 parts by weight of active ester curing agent HPC-8000-65T (Japan DIC company, solid content 65%) and stir evenly, then add 55 parts by weight of flame retardant polyphosphonate compound FRX OL3001 (FRX Polymers company, phosphorus content is 10.0%), then add 0.075 parts by weight of curing accelerator DMAP, and solvent toluene, Continue to stir evenly to form a glue. Use glass fiber cloth (type 2116, thickness 0.08mm) to impregnate the above glue solution, and control it to an appropriate thickness, then dry to remove the solvent to obtain a prepreg. Use several prepregs prepared by stacking each other, press a piece of copper foil on each side of it, and cure it in a hot press to obtain a copper clad laminate. The curing temperature is 150-250 ° C. The curing pressure is 25-60kg / cm 2 , The curing time is 90min.

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Abstract

The invention relates to a thermosetting epoxy resin composition which comprises epoxy resin, an active ester curing agent, and polyphosphonate or / and phosphonate-carbonate copolymer. The prepreg prepared by the epoxy resin composition and a copper foil coated laminated board have excellent dielectric property and heat and humidity resistance, and the flame retardance can reach level UL94V-0.

Description

technical field [0001] The invention relates to a thermosetting epoxy resin composition, in particular to a halogen-free epoxy resin composition and prepregs, copper-clad laminates and high-frequency circuit substrates made by using the composition. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and 3-6GHz will become the mainstream. In addition to maintaining higher requirements for the heat resistance of laminate materials, the pursuit of lower and lower Permittivity and dielectric loss values. The existing traditional FR-4 is difficult to meet the high-frequency and high-speed development needs of electronic products. At the same time, the substrate material no longer plays the role of mechanical support in the traditional sense, but will become the designer of PCB and terminal manufacturers together with electronic components. An important way to...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L69/00C08L85/02C08K9/06C08K9/04C08K3/36C08K5/5333C08G59/42H05K1/03
CPCH05K1/0326H05K1/0373H05K2201/0209C08L63/00Y10T428/31529C08L71/126C08L85/02H01B1/026
Inventor 曾宪平任娜娜
Owner GUANGDONG SHENGYI SCI TECH
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