Dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate and thermosetting resin composition and application thereof

A polyphenylene ether alkyl phosphate and resin composition technology, which is applied in the field of dihydroxy low molecular weight polyphenylene ether alkyl phosphate and its thermosetting resin composition, can solve the problem of Tg influence, poor dielectric properties of cured products, etc. problems, achieve low water absorption, improve aging resistance, and good heat and humidity resistance

Pending Publication Date: 2021-12-17
LANZHOU RUIPU TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the phenolic hydroxyl compound reacts with the epoxy resin, a more polar hydroxyl group will be generated, resulting in poor dielectric properties of the cured product and affecting Tg.

Method used

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  • Dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate and thermosetting resin composition and application thereof
  • Dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate and thermosetting resin composition and application thereof
  • Dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate and thermosetting resin composition and application thereof

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Embodiment Construction

[0038] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention and the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of the present invention.

[0039] Raw materials:

[0040] Flame retardant: OL3001 from FRX Company of the United States;

[0041] Cross-linking agent: Sabic SA-90, self-made cross-linking agent SA90-P1, SA90-P2;

[0042] Epoxy resin: NC-3000-H Mitsubishi Chemical; Abbreviation: EPOXY 1

[0043] Epoxy resin: HP-6000, DIC Corporation; Abbreviation: EPOXY 2

[0044] Catalyst 1 (curing accelerator): 2-ethyl-4 methylimidazole;

[0045] Catalyst 2 (curing accelerator): DBU.

[0046] 1. The preparation m...

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Abstract

The invention relates to dihydroxyl low-molecular-weight polyphenyl ether alkyl phosphate and a thermosetting resin composition and an application thereof, a phosphate group is introduced into polyphenyl ether, so that the dihydroxyl low-molecular-weight polyphenyl ether alkyl phosphate can be used as a curing agent of epoxy resin, and a phosphate group with a flame-retardant effect is also introduced; meanwhile, a large number of hydroxyl groups generated by the epoxy resin are eliminated, and the aging resistance of the material is improved; the dihydroxy low-molecular-weight polyphenyl ether alkyl phosphate is used as a curing agent and a flame retardant in the resin composition, so that the glass transition temperature and the heat resistance of a prepreg prepared from the resin composition and a laminated board for a printed circuit can be remarkably improved; and the product has excellent dielectric property, low water absorption rate, heat and humidity resistance and good process processing performance; and a cured laminated board can realize halogen-free flame retardance, and reaches UL94V-0.

Description

technical field [0001] The invention belongs to the technical field of macromolecular materials, and in particular relates to dihydroxyl low molecular weight polyphenylene ether alkyl phosphate and its thermosetting resin composition and application. Background technique [0002] As communication products move towards high speed and high frequency, substrate materials with excellent comprehensive properties such as high glass transition temperature, low dielectric constant and low dielectric loss, low moisture absorption rate and good processing type are more and more favored by domestic and foreign manufacturers. favor. In recent years, the application of 5G sheet materials, polyphenylene ether PPO materials have received great attention, especially the introduction of low molecular weight PPO commercial products, making the application more extensive. However, the raw materials of epoxy resin system are easy to obtain, cheap and have good processing type, so in terms of q...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/48C08G59/40C08L71/12C08L63/00C08K7/14C08J5/24B32B27/04B32B17/02B32B17/12
CPCC08G65/485C08G59/4071C08L71/12C08J5/24B32B5/02B32B5/26C08J2363/00C08K7/14B32B2260/021B32B2260/046B32B2307/306B32B2307/3065B32B2307/20B32B2307/726B32B2457/08
Inventor 周玉来马泽林董小霞尉瑞刘晓龙
Owner LANZHOU RUIPU TECH CO LTD
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