Phosphorus-containing active ester and halogen-free composition thereof, and copper-clad laminate

A technology of active ester and resin composition, applied in the fields of laminates and printed circuit boards, prepregs, phosphorus-containing active esters and their halogen-free resin compositions, can solve the problems of poor dielectric properties, high water absorption, influence Sheet metal performance and other issues, to achieve the effect of meeting halogen-free flame retardant, reducing dielectric loss factor, and improving the electrical properties of the system

Active Publication Date: 2018-07-06
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practical applications, it is found that DOPO compounds have a large water absorption rate, poor dielectric properties and poor heat and humidity resistance of the board.
The additive type is mainly phosphazene and phosphonate compounds, and the flame retardant efficiency of the additive type f

Method used

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  • Phosphorus-containing active ester and halogen-free composition thereof, and copper-clad laminate
  • Phosphorus-containing active ester and halogen-free composition thereof, and copper-clad laminate
  • Phosphorus-containing active ester and halogen-free composition thereof, and copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0057] Add 160g (0.5mol) 10-(2,5-dihydroxyphenyl)-10-hydrogen-9-oxa-10- Phosphaphenanthrene-10-oxide (ODOPB) and 360g hydroxyl-containing phenoxy cyclotriphosphazene (wherein the dihydroxy content is greater than 60%) and 816g methyl isobutyl ketone (MIBK), nitrogen replacement under reduced pressure in the system , to dissolve it. Then, 182.7g (0.9mol) of terephthaloyl chloride was put into the reaction for 2 hours, and the temperature in the system was controlled below 60°C; then, 114g (1.2mol) of phenol was added to the system, and the reaction was continued for 1 hour; 189 g of 20% aqueous sodium hydroxide solution are added; stirring is continued for 1 hour under these conditions. After the reaction was completed, the water layer was removed by static liquid separation. Add water into the MIBK phase in which the reactants are dissolved, stir and mix, then separate the liquids at rest, and remove the water layer. The above operations were repeated until the pH of the aq...

Synthetic example 2

[0059] Add 185g of 10-(2,5-dihydroxynaphthyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene-10 to a flask equipped with a thermometer, dropping funnel, condenser, fractionating tube, and stirrer -Oxide and 360g of hydroxyl-containing phenoxy cyclotriphosphazene (wherein the dihydroxyl content is greater than 60%) and 816g of methyl isobutyl ketone (MIBK), nitrogen replacement under reduced pressure in the system to make it dissolve. Then, 182.7g (0.9mol) of terephthaloyl chloride was put into the reaction for 2 hours, and the temperature in the system was controlled below 60°C; then, 114g (1.2mol) of phenol was added to the system, and the reaction was continued for 1 hour; 189 g of 20% aqueous sodium hydroxide solution are added; stirring is continued for 1 hour under these conditions. After the reaction was completed, the water layer was removed by static liquid separation. Add water into the MIBK phase in which the reactants are dissolved, stir and mix, then separate the liquid...

Synthetic example 3

[0061] The product of DOPO and phenylbenzoquinone through addition reaction or recrystallized in ethoxyethanol to obtain 10-(2,5-dihydroxybiphenyl)-10-hydrogen-9-oxa-10-phosphorus Heterophenanthrene-10-oxide.

[0062] Add 190g of 10-(2,5-dihydroxybiphenyl)-10-hydrogen-9-oxa-10-phosphaphenanthrene- 10-oxide, 360g of hydroxyl-containing phenoxycyclotriphosphazene (wherein the dihydroxyl content is greater than 60%) and 816g of methyl isobutyl ketone (MIBK), the system is replaced by nitrogen under reduced pressure to dissolve. Then, 182.7g (0.9mol) of terephthaloyl chloride was put into the reaction for 2 hours, and the temperature in the system was controlled below 60°C; then, 114g (1.2mol) of phenol was added to the system, and the reaction was continued for 1 hour; 189 g of 20% aqueous sodium hydroxide solution are added dropwise; stirring is continued under these conditions for 1 hour. After the reaction was completed, the water layer was removed by static liquid separatio...

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PUM

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Abstract

The invention provides a phosphorus-containing active ester and a halogen-free resin composition thereof, and a prepreg and a laminated board using the halogen-free resin composition. The halogen-freeresin composition comprises (A) thermosetting resin, and (B) phosphorus-containing active ester resin. The prepreg and the laminated board prepared by using the halogen-free resin composition have low dielectric loss factors and can achieve halogen-free flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminates, and in particular relates to a phosphorus-containing active ester and a halogen-free resin composition thereof, as well as prepregs, laminates and printed circuit boards using the same. Background technique [0002] With the development of electronic components in the direction of small, light, thin, high performance, and multifunctional, it brings high frequency and high speed signal transmission. This requires that the dielectric constant and dielectric loss of electronic materials are relatively low, which are related to the structure of the material, and low dielectric constant and low dielectric loss resins generally have in structure: large free volume, low polarizability , Low water absorption, low dielectric constant structure and so on. In addition, on July 1, 2006, the EU's two environmental protection directives "Directive on Waste Electrical and Electronic Equipment" an...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/5399C08K7/14C08J5/24C07F9/6593B32B17/04B32B17/12B32B15/20B32B15/14H05K1/03
CPCH05K1/0366H05K1/0373C07F9/65815C08K5/5399C08K7/14B32B5/02B32B5/26B32B15/14B32B15/20C08J2363/00B32B2457/08B32B2260/046B32B2260/023B32B2307/3065B32B2262/101B32B2307/20C08J5/244C08J5/249C08L63/00B32B17/04C08G59/40C08G63/692H05K1/03
Inventor 徐浩晟曾宪平何烈相关迟记陈广兵
Owner GUANGDONG SHENGYI SCI TECH
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