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Halogen-free resin composition and prepreg and laminated board made of same

A technology of resin composition and prepreg, which is applied in the direction of synthetic resin layered products, lamination, lamination devices, etc., can solve the problems that cannot meet the application requirements, reduce heat resistance, moisture resistance thermal expansion coefficient and mechanical properties, etc., and achieve Excellent moisture and heat resistance and heat resistance, low thermal expansion coefficient, low heat resistance, and excellent moisture and heat resistance

Active Publication Date: 2011-09-07
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these flame-retardant resins based on epoxy resin or phenolic resin greatly reduce the heat resistance, moisture resistance, thermal expansion coefficient and mechanical properties of the system, and cannot meet the requirements of high-density interconnection and integrated circuit packaging. Application Requirements in Performance Areas

Method used

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  • Halogen-free resin composition and prepreg and laminated board made of same
  • Halogen-free resin composition and prepreg and laminated board made of same
  • Halogen-free resin composition and prepreg and laminated board made of same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Take bismaleimide resin powder solid 25g, add appropriate amount of DMF to dissolve. After the bismaleimide resin powder is dissolved until clear and transparent, add 20g of bisphenol A cyanate resin (CY-10, Wuqiao Chemical) and 20g of phosphorous cyanate resin (structure such as structural formula 1, R= A1), 35g dicyclopentadiene type epoxy resin (XD-1000, Nippon Kayaku), 0.05g stannous octoate, 50g spherical silica (average particle size 0.7um), 50g boehmite and appropriate amount of butanone The solvent was stirred and mixed to obtain a glue solution with a solid content of 60%.

[0050] The glue is dipped and coated on E glass fiber cloth (2116, the unit weight is 104g / m 2 ) and baked in an oven at 170°C for 5 minutes to obtain a prepreg with a resin content of 50%.

[0051]The prepared prepreg with a resin content of 50% was put on top and bottom of a piece of copper foil, and pressed in a vacuum hot press to obtain a copper-clad laminate; the specific pressing p...

Embodiment 2

[0054] Take 20g of bismaleimide resin powder solid, add an appropriate amount of DMF to dissolve; after the bismaleimide resin powder is dissolved until clear and transparent, add 20g of bisphenol A cyanate resin (CY-10, Wuqiao Chemical ), 15g of phosphorus-containing cyanate resin (structure such as structural formula 3, R=C2), 45g of biphenyl type epoxy resin (NC-3000, Nippon Kayaku), 0.05g of stannous octoate, 0.2g of 2-ethyl- 4-Methylimidazole, 80g spherical silica (average particle size 0.7um), 20g aluminum hydroxide and an appropriate amount of butanone solvent were stirred and mixed to obtain a glue with a solid content of 60%.

[0055] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0056] The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0058] Take 15g of the solid bismaleimide resin powder, add an appropriate amount of DMF to dissolve it; after the bismaleimide resin powder is dissolved until clear and transparent, add 15g of bisphenol A cyanate resin (CY-10, Wuqiao Chemical ), 15g phosphorous cyanate resin (structure such as structural formula 1, R=A1), 55g naphthalene ring epoxy resin (NC-7300, Nippon Kayaku), 0.05g stannous octoate, 0.5g 2-methylimidazole , 60g of spherical silica (average particle size 0.7um), 40g of boehmite and an appropriate amount of butanone solvent were stirred and mixed to obtain a glue with a solid content of 60%.

[0059] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0060] The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a halogen-free resin composition, which comprises the following components in part by weight based on the solid weight: (a) 5 to 35 parts of bismaleimide resin, (b) 10 to 60 parts of composite cyanate resin, (c) halogen-free epoxy resin, and (d) 0.0005 to 1 part of accelerator. The resin composition, a prepreg and a laminated board obtained by the invention are halogen-free and flame-retardant, have high damp heat resistance and heat resistance and a low heat expansion coefficient, and are suitable for the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a halogen-free resin composition and a prepreg and a laminate prepared by using the composition. The resin composition can be applied to the fields of integrated circuit packaging, high-frequency high-speed and high-density interconnection, and the like. Background technique [0002] BT (bismaleimide-triazine compound) resin-based copper clad laminate has high Tg, excellent dielectric properties, low thermal expansion rate, and good mechanical properties. It is widely used in high-density interconnection multilayer PCBs, high-frequency and high-speed And high-end fields such as packaging substrates. However, the flame retardancy of BT resin itself is insufficient. In order to ensure that the substrate made of it meets the flame retardant standard UL 94V-O level, it is often necessary to add additional flame retardants to the resin system, such as bromine and phosphorus...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/08C08L79/04C08K13/04C08K7/14B32B17/02B32B27/04B32B27/18B32B15/08B32B37/06B32B37/10H05K1/03
Inventor 马建谌香秀黄荣辉崔春梅肖升高
Owner SHENGYI TECH SUZHOU
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