High-reliability halogen-free copper-clad plate for IC packaging and preparation method thereof

A copper-clad laminate and reliability technology, applied in 5G copper-clad laminate and its production field, can solve the problems of reduced insulation resistance between leads, electromagnetic waves cannot be shielded, poor moisture resistance, etc., achieve low dielectric constant, improve CAF resistance performance , Low hygroscopicity effect

Pending Publication Date: 2020-09-01
江苏联鑫电子工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to reduce the lead spacing, it is necessary to solve various problems such as the reduction of the insulation resistance between the leads and the increase of the step capacitance caused by the reduction of the lead spacing. This proposes high heat resistance and good dimensional stability for IC packaging copper clad laminates. , Low thermal expansion coefficient requirements;
[0006] (3) At present, the main packaging method of IC packaging copper clad laminates is non-airtight or semi-hermetic packaging, so its moisture resistance is poor and it is susceptible to ion pollution; at the same time, the thermal stability is not good, and it cannot shield electromagnetic waves. IC packaging copper clad laminates are required to have high insulation reliability, high resistance to ion migration, etc.
[0007] At present, there is a lack of a copper clad laminate substrate that can be applied to 5G technology and can meet the above requirements at the same time, which has become a research hotspot in the field of current copper clad laminate research technology

Method used

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  • High-reliability halogen-free copper-clad plate for IC packaging and preparation method thereof

Examples

Experimental program
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Effect test

preparation example Construction

[0060] The above-mentioned resin glue is used to prepare the copper clad laminate, and the preparation method mainly includes the following steps:

[0061] S1, after weighing each component according to the composition of the above-mentioned resin glue, stir at 30-40°C for 4-6 hours;

[0062] S2, coating the resin glue solution prepared in step S1 on both sides of the glass fiber cloth, drying at 200-250° C. for 2-4 minutes, and the prepared glass fiber cloth impregnated sheet is a prepreg ;

[0063] S3, according to the required thickness and shape of the final copper-clad laminate, take 1-8 sheets of the prepreg prepared in step S2 and stack them together and then cut them, and finally cover both sides with a layer of copper foil as the top copper foil After layering and bottom copper foil layering, hot press at -700~-730mmHg, 200~220°C for 180~200min, and cool naturally to room temperature to obtain the desired copper clad laminate.

preparation specific Embodiment 1

[0065] S1, after weighing each component according to the composition of resin glue A, stir at 30°C for 4 hours;

[0066] S2, coating the resin glue solution A prepared in step S1 on both sides of the glass fiber cloth, drying at 200° C. for 2 minutes, and the prepared glass fiber cloth impregnated tablet is a prepreg;

[0067] S3, according to the required thickness and shape structure of the final copper-clad laminate, take 6 pieces of the prepreg prepared in step S2 and stack them together and then cut them, and finally cover both sides with a layer of 25 μm thick copper foil as the top copper foil After the layer and the bottom copper foil layer, hot press at -700mmHg, 200°C for 180min, and naturally cool to room temperature to obtain the required copper clad laminate.

preparation specific Embodiment 2

[0069] S1, after weighing each component according to the composition of resin glue B, stir at 35°C for 5 hours;

[0070] S2, coating the resin glue B prepared in step S1 on both sides of the glass fiber cloth, drying at 210° C. for 3 minutes, and the prepared glass fiber cloth impregnated tablet is a prepreg;

[0071] S3, according to the required thickness and shape structure of the final copper-clad laminate, take 6 pieces of the prepreg prepared in step S2 and stack them together and then cut them, and finally cover both sides with a layer of 25 μm thick copper foil as the top copper foil After the layer and the bottom copper foil layer, hot press at -710mmHg, 210°C for 190min, and naturally cool to room temperature to obtain the required copper clad laminate.

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Abstract

The invention discloses a high-reliability halogen-free copper-clad plate for IC packaging and a preparation method thereof, and belongs to the technical field of 5G copper-clad plates and productionthereof. The copper-clad plate comprises a bottom copper foil layer, a top copper foil layer and an insulating medium layer which is positioned between the bottom copper foil layer and the top copperfoil layer and is formed by superposing 1-8 prepregs. Each prepreg is obtained by dipping glass fiber cloth in a resin glue solution and then drying the glass fiber cloth. The resin glue solution comprises dipentadiene phenol epoxy resin, maleimide resin, a curing agent, a phosphate flame retardant and a silicon dioxide filler. According to the resin glue solution, low-viscosity dipentadiene phenolepoxy resin and various maleimide resin compounds are used as a main resin system, epoxy resin and styrene maleic anhydride resin are compounded to be used as a curing agent, and angular silicon dioxide and spherical silicon dioxide are used as fillers. The prepared copper-clad plate has the characteristics of high frequency, high speed, high heat resistance, low thermal expansion coefficient, good dimensional stability and the like.

Description

technical field [0001] The invention relates to a copper-clad laminate and a preparation method thereof, in particular to a high-reliability halogen-free copper-clad laminate for IC packaging and a preparation method thereof, belonging to the technical field of 5G copper-clad laminates and their production. Background technique [0002] The IC carrier board is mainly used to carry IC (Integrated Circuit), and there are lines inside it to conduct the signal between the chip and the circuit board. In addition to the function of carrying, the IC carrier board also has protection circuits and dedicated lines. , Design heat dissipation channels, establish modular standards for components and other additional functions. [0003] With the development of IC packaging technology, the number of I / Os increases, the wiring density increases, and the number of substrate layers increases. IC packaging substrates present a development trend of "four highs and one low", that is, high-densit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/14B32B15/20B32B17/02B32B27/04B32B27/06B32B27/28B32B37/06B32B37/08B32B37/10C08J5/24C08L79/08C08L63/00C08L63/04C08L35/06C08K13/04C08K7/14C08K5/521C08K7/00C08K3/36C08K7/18
CPCB32B5/02B32B15/14B32B15/20B32B37/06B32B37/08B32B37/10C08J5/24B32B2262/101B32B2260/021B32B2260/046B32B2379/08C08J2379/08C08J2479/08C08J2463/00C08J2463/04C08J2435/06C08K13/04C08K7/14C08K5/521C08K7/00C08K3/36C08K7/18
Inventor 汪小琦
Owner 江苏联鑫电子工业有限公司
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