Thermosetting resin composition and prepreg, metal foil-clad laminate and printed circuit board using same

A resin composition, thermosetting technology, applied in printed circuits, circuit substrate materials, metal layered products, etc., can solve the problems of high thermal expansion coefficient, low crosslinking density, low glass transition temperature, etc.

Active Publication Date: 2020-10-27
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the cross-linking density of the double-end group multifunctional active ester resin and epoxy resin reaction is not high, and the PPO main chain in the middle is a thermoplastic segment, the coefficient of thermal expansion (CTE) is high, and the glass transition temperature of the final cured product or plate Low, high coefficient of thermal expansion (CTE)

Method used

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  • Thermosetting resin composition and prepreg, metal foil-clad laminate and printed circuit board using same
  • Thermosetting resin composition and prepreg, metal foil-clad laminate and printed circuit board using same
  • Thermosetting resin composition and prepreg, metal foil-clad laminate and printed circuit board using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-16

[0110] Embodiments 1-16 provide a thermosetting resin composition glue, a prepreg and a copper-clad laminate using it, and the preparation method is as follows:

[0111] (1) Preparation of thermosetting resin composition glue:

[0112] Component (B) phosphorus-containing curing agent, (C) co-curing agent and (D) phenoxyphosphazene compound SPB-100 are prepared into solutions with solid content of 60%, 50% and 25% respectively with MEK solvent, Add it to a 1000mL beaker in turn, then add (A) halogen-free epoxy resin and (F) filler in turn, add an appropriate amount of (E) curing accelerator 4-dimethylaminopyridine, and adjust the gelation time (GT) to 200- 300s, add MEK solvent to control the solid content to 65%, continue to stir for 2 hours to mature, and obtain the thermosetting resin composition glue;

[0113] Wherein, the kind and consumption (in parts by weight) of each component are as shown in Table 1 and Table 2.

[0114] (2) Preparation of prepreg:

[0115] Prepare...

Embodiment 10

[0153] In embodiment 10, use ester curing agent with formula I structure and phosphorus-containing bisphenol OL3001 composite curing 78 parts of dicyclopentadiene novolac epoxy resin HP-7200H, due to the amount of dicyclopentadiene novolac epoxy resin HP-7200H Exceeding the preferred dosage range will lead to incomplete reaction, lower Tg of the final plate, higher CTE and water absorption, poor dielectric properties and unsatisfactory heat resistance.

Embodiment 11

[0154] In Example 11, 38 parts of dicyclopentadiene novolac epoxy resin HP-7200H were compositely cured with an ester curing agent having a structure of formula I and phosphorus-containing bisphenol OL3001. The plate had a higher Tg and a lower CTE, but due to Insufficient epoxy resin, excessive curing agent, the final board has high water absorption, poor dielectric properties and unsatisfactory heat resistance.

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Abstract

Provided in the present invention are a thermosetting resin composition, a prepreg using same, a metal foil-cladded laminate, and a printed circuit board. The thermosetting resin composition comprises an epoxy resin, a phosphorous-containing bisphenol, and an ester curing agent having the structure of formula I. The present invention employs the ester curing agent having the structure of formula I and the phosphorous-containing bisphenol for co-curing of the epoxy resin, uses the phosphorous-containing bisphenol as a primary curing agent, provides a cured substance with great dielectric performance, high temperature resistance, and adhesion, also implements halogen-free flame retardation, combined with the ester curing agent of the structure of formula I, produces no polar groups such as a secondary hydroxyl, and significantly increases the glass transition temperature of the cured substance while ensuring great dielectric performance, and, with the cured substance containing a large amount of hydrophobic groups, significantly reduces the water absorption rate of the cured substance, thus increasing the stability of the dielectric constant and of the dielectric loss factor of the cured substance. The laminate manufactured and the metal foil-cladded laminate have great heat resistance, moisture resistance, peel strength, dielectric performance, and flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a thermosetting resin composition and a prepreg using the same, a metal foil-clad laminate and a printed circuit board. Background technique [0002] With the high-speed and multi-functionalization of electronic product information processing, the application frequency continues to increase, and the dielectric constant (Dk) and dielectric loss value (Df) are required to be lower and lower. Therefore, reducing Dk / Df has become the pursuit of the substrate industry. hotspot. At the same time, under the global trend of strengthening "green" and "environmental protection", the development of halogen-free flame-retardant copper-clad laminates has become a hot spot in the industry, and various copper-clad laminate manufacturers have launched their own halogen-free flame-retardant copper-clad laminates. foil laminate. [0003] In order to achieve low Dk / Df a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/62C08G59/42C08J5/24B32B15/092B32B27/06B32B27/08B32B27/18B32B27/38H05K1/03
CPCB32B15/092B32B27/06B32B27/08B32B27/18B32B27/38B32B2457/08C08G59/4284C08G59/62C08J5/24C08J2363/00H05K1/0353
Inventor 游江林伟黄天辉
Owner GUANGDONG SHENGYI SCI TECH
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