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Thermosetting resin composition, prepreg and laminated board

A technology of resin composition and prepreg, which is applied in the field of laminates and thermosetting resin compositions, can solve the problems of limiting the application of high-performance printed circuit board substrates, high brittleness of the resin matrix, and insufficient dielectric properties, etc., to achieve good halogen-free Effects of flame retardant properties, low water absorption, and excellent adhesion

Active Publication Date: 2011-07-06
SHENGYI TECH SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compared with high-performance resins such as bismaleimide and cyanate ester, epoxy resin has poor heat resistance, low modulus, and insufficient dielectric properties, which restrict its application in high-performance printed circuit board substrates.
[0004] Modified bismaleimide resin, especially allyl modified bismaleimide resin, has the advantages of high modulus, high heat resistance, low thermal expansion coefficient and good toughness, but its water absorption is relatively low. High, poor dielectric properties, applied to high-performance printed circuit board substrates need to be modified
[0005] Cyanate resin has excellent dielectric properties, heat resistance and low water absorption, but the resin matrix is ​​brittle, which limits its application in high-performance printed circuit board substrates

Method used

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  • Thermosetting resin composition, prepreg and laminated board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] According to the method in the synthesis example, react at 140°C for 30 minutes to prepare 70 g of prepolymer of 4,4'-diphenylmethane bismaleimide resin:diallyl bisphenol A=100:60, add appropriate amount of acetone dissolve. After the modified double horse resin is completely dissolved, add 10g biphenyl type multifunctional epoxy resin (NC-3000, Nippon Kayaku), 20g bisphenol A type cyanate resin (BA-3000S, Lonza), 10g phosphorus-containing Phenolic resin (XZ92741, Dow Chemical), 0.02g zinc octoate, 100g spherical silica (average particle size 0.7um, SFP-30M, DENKA) and an appropriate amount of butanone solvent, stirred and mixed evenly to obtain a gel with a solid content of 60%. liquid.

[0052] The glue is dipped and coated on E glass fiber cloth (2116, the unit weight is 104g / m 2 ) and baked in an oven at 160°C for 5 minutes to obtain a prepreg with a resin content of 50%.

[0053] The prepared prepreg with a resin content of 50% was placed with a metal copper foi...

Embodiment 2

[0056] According to the method in the synthesis example, react at 140°C for 35 minutes to prepare 30 g of prepolymer of 4,4'-diphenylmethane bismaleimide resin:diallyl bisphenol A=100:70, add appropriate amount of acetone dissolve. After the modified double horse resin is completely dissolved, add 20g biphenyl type multifunctional epoxy resin (NC-3000, Nippon Kayaku), 50g bisphenol A type cyanate resin (BA-3000S, Lonza), 10g phosphorus-containing Phenolic resin (XZ92741, Dow Chemical), 0.05g stannous octoate, 100g spherical silica (average particle size 0.7um, SFP-30M, DENKA) and an appropriate amount of butanone solvent, stirred and mixed evenly to obtain 60% solid content Glue.

[0057] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0058] The properties of the obtained copper-clad laminates are shown in Table 1.

Embodiment 3

[0060] According to the method in the synthesis example, react at 130°C for 45 minutes to prepare 50 g of prepolymer of 4,4'-diphenylisopropylbismaleimide resin:diallyl diphenyl ether=100:75, add Appropriate amount of acetone dissolved. After the modified double horse resin is completely dissolved, add 15g of dicyclopentadiene type epoxy resin (XD-1000, Nippon Kayaku), 35g of dicyclopentadiene type cyanate resin (CY-3, Jiangdu Malt Chemical Co., Ltd. ), 10g phosphazene (SPB-100, Japan Otsuka Chemical Co., Ltd.), 0.05g zinc octanoate, 70g spherical silica (average particle size 0.7um, SFP-30M, DENKA), 30g boehmite (BS100, Kawai lime ) and an appropriate amount of butanone solvent, stir and mix evenly to obtain a glue with a solid content of 60%.

[0061] The preparation methods of the prepreg and the copper-clad laminate are the same as in the first embodiment.

[0062] The properties of the obtained copper-clad laminates are shown in Table 1.

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Abstract

The invention discloses a thermosetting resin composition, which is characterized by comprising the following components in part by weight: 8 to 80 parts of allyl modified bismaleimide resin prepolymer, 15 to 60 parts of cyanate resin and 5 to 40 parts of halogen-free epoxy resin, wherein the allyl modified bismaleimide resin prepolymer is prepared by reacting bismaleimide resin with an allylcompound at the temperature of between 110 and 160DEG C for 20 to 100 minutes, and a weight ratio of the bismaleimide resin to the allylcompound is 100:(30-120). The composition can be used for preparing a prepreg and a laminated board. The composition and the laminated board have excellent humidity resistance, high heat resistance, low water absorption rate, high modulus, lower dielectric constant and dielectric loss, and good processing toughness, and can realize halogen-free flame retardancy.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a thermosetting resin composition and a laminate prepared by using the composition. The resin composition can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] With the rapid development of electronic products in the direction of "high performance, thinner, high reliability and green environmental protection", the basic material of electronic products - printed circuit board substrate, has also been given higher requirements. That is to say, the printed circuit board base material is required to have excellent moisture resistance, high heat resistance, low water absorption, high modulus, low thermal expansion coefficient, good dielectric properties and halogen-free flame retardant properties. [0003] Due to its excellent adhesion, good processability, good ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08L63/00C08L79/04C08L61/06C08K3/36C08K5/098C08K5/5399C08K3/22C08G73/12C08J5/04B32B15/08B32B17/04
Inventor 谌香秀黄荣辉马建肖升高顾嫒娟梁国正
Owner SHENGYI TECH SUZHOU
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