Resin composition for high-frequency high-speed substrate as well as prepreg and laminated board made of resin composition

Abstract

The invention discloses a resin composition for a high-frequency high-speed substrate. Measured according to solid weights, the resin composition comprises the following components: 10-50 parts of cyanate ester resin (a), 10-40 parts of anhydride compounds (b), 5-50 parts of benzoxazine resin (c), 5-50 parts of epoxy resin (d), 5-50 parts of flame retardant (e), 0-5 parts of curing accelerator (f) and 0-80 parts of inorganic filler (g). The resin composition disclosed by the invention has high moisture and heat resistance, high glass transition temperature as well as lower dielectric constant and dielectric loss tangent value, and can be well applied to the fields such as high-frequency, high-speed and high-density interconnection and the like; and a laminated board made of the resin composition has excellent moisture and heat resistance and good bonding power.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition used for high-frequency and high-speed substrates, a prepreg and a laminate made using the resin composition, which are used in the field of high-frequency and high-speed communication printed circuit boards. Background technique [0002] With the rapid development of information technology today, multi-functional and diversified electronic products are becoming an indispensable part of people's lives. The information carrying capacity of electronic products is gradually increasing, and the speed of information processing is also accelerating. It is required that the electronic signal has a high transmission rate in the printed circuit board and its loaded components, and the substrate material of the copper clad laminate is required to have a low dielectric constant; at the same time, in order to achieve high-fidelity signals under high-speed transm...

AI Technical Summary

Problems solved by technology

Polyphenylene ether and polytetrafluoroethylene resins have low dielectric constant and dielectric loss tangent, and have good application prospects in high-speed, high-frequency and communication fields. However, their low adhesion often leads to Insufficient adhesion between substrate and copper foil, resulting in partial functional failure of printed circuit boards

Compared with polyphenylene ethers and polytetrafluoroethylene resin compositions, acid anhydride cured epoxy resin compositions also have better adhesion while having a lower dielectric constant; however, such resins The dielectric loss tangent of the composition is slightly higher, usually between 0.010 and 0.015 at 1 GHz, and it is difficult to apply it in the high-frequency and high-speed field (the dielectric loss tangent in the high-frequency and high-speed application field is often lower than 0.010 , preferably between 0.002~0.007)

Chinese invention patent application CN101684191A discloses a halogen-free high-frequency resin composition and prepregs and laminates made of it. The high-frequency resin composition mainly includes benzoxazine, epoxy resin and acid anhydride; however, Experiments have proved that the laminated board prepared by this composition has poor moisture and heat resistance and a dielectric constant of 4.0, which cannot be well applied to high-frequency, high-speed and high-density interconnection fields.

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