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Thermosetting laser-induced metallization thermal-conduction composite material with stable high dielectric constant

A heat-conducting composite material, laser-induced technology, applied in the field of composite materials, to achieve good high dielectric constant stability, good dimensional stability, low dielectric loss tangent effect

Active Publication Date: 2015-10-14
HEFU NEW MATERIAL TECH WUXI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

There is no relevant information about domestic products on the market

Method used

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  • Thermosetting laser-induced metallization thermal-conduction composite material with stable high dielectric constant
  • Thermosetting laser-induced metallization thermal-conduction composite material with stable high dielectric constant
  • Thermosetting laser-induced metallization thermal-conduction composite material with stable high dielectric constant

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preparation example Construction

[0025] The preparation method of material of the present invention is:

[0026] (1) Pour high-dielectric ceramic fillers, laser-induced additives, and high-thermal conductivity fillers into a high-speed mixer, and stir at high speed for 3-5 minutes;

[0027] (2) Slowly add the surfactant to the high-speed mixer, and continue high-speed mixing and stirring for 10-20 minutes;

[0028] (3) Add the thermosetting matrix resin, initiator, thickener, low shrinkage additive and the powder mixed in the above step (2) into a kneader and stir for 15-20 minutes to prepare a composite material.

Embodiment 1

[0030] A thermosetting laser-induced metallization heat-conducting composite material with stable high dielectric constant, made by mixing the following components: thermosetting matrix resin (epoxy resin, commercially available), initiator (1,2-cyclohexanediamine) , thickener (magnesium oxide), laser-induced additives, high dielectric ceramic filler (barium titanate, particle size 1-3 microns), surfactant (silane coupling agent KH560), high thermal conductivity filler (spherical alumina, 10 microns, commercially available). The material was then injection molded for corresponding testing.

[0031] The laser-induced additive is a composition of a micron-scale tin-containing compound (tin dioxide) and a nano-scale tin-containing compound (tin dioxide), and the weight ratio of the micron-scale tin-containing compound to the nanoscale tin-containing compound is 4:1; The particle size of the micron-scale tin-containing compound is 0.5-30 μm, and the particle size of the nano-scal...

Embodiment 2

[0034] The composition of this example is the same as that of Example 1, except that the weight ratio of the micron-scale tin-containing compound to the nano-scale tin-containing compound is 9:1.

[0035] The specific proportioning and material performance test of the components in this embodiment are shown in Table 1.

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Abstract

The invention discloses a thermosetting laser-induced metallization thermal-conduction composite material with a stable high dielectric constant. The material comprises the following components in percentage by weight, 20-50% of thermosetting matrix resin, 0.1-0.5% of an initiator, 0.05-0.1% of a thickener, 5-10% of a laser induction additive, 15-60% of a high dielectric ceramic filler, 0.01-0.08% of a surfactant, 0-1.5% of a low-shrinkage additive, and 10-45% of a high-thermal-conductivity filler. The total of the components is 100%. Under high frequency, the material provided by the invention has good high dielectric constant stability, low dielectric loss angle tangent, and good laser-induced metallization property. The composite material also has a good linear expansion coefficient, an effectively controlled shrinkage rate, and good dimensional stability.

Description

technical field [0001] The invention relates to a composite material, in particular to a thermosetting laser-induced metallization heat-conducting composite material with a stable high dielectric constant. Background technique [0002] At present, in the PCB board prepared by MID technology, the material aspect is mainly to prepare a high dielectric constant polymer-based composite material by material compounding. Combinations such as ceramic fillers / polymers / conductive fillers are more common types. However, most of these combinations can hardly satisfy stable dielectric constant, good conduction / heat dissipation and ultra-low dielectric loss at the same time. The most common combination, such as barium titanate and epoxy resin, conducts heat very poorly. Even if adding some metal powder such as Ag\Cu can improve the thermal conductivity and dielectric constant, its electrical insulation will start to decline with the addition of the metal powder. At the same time, when...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/08C08L31/04C08K13/04C08K7/00C08K3/22C08K3/24C08K3/38
Inventor 邹湘坪徐贵平王俊龙王帅
Owner HEFU NEW MATERIAL TECH WUXI
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