121results about How to "Low dielectric loss tangent" patented technology

Examples of the present invention include high electric energy density polymer film capacitors with high dielectric constant, low dielectric dissipation tangent, and low leakage current in a broad temperature range. More particularly, examples include a polymer film capacitor in which the dielectric layer comprise a copolymer of a first monomer (such as tetrafluoroethylene) and a second polar monomer. The second monomer component may be selected from vinylidene fluoride, trifluoroethylene or their mixtures, and optionally other monomers may be included to adjust the mechanical performance. The capacitors can be made by winding metallized films, plain films with metal foils, or hybrid construction where the films comprise the new compositions. The capacitors can be used in DC bus capacitors and energy storage capacitors in pulsed power systems.

The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

An epoxy resin curing agent having a number average molecular weight of 500 to 3,000, represented by the formula (1), and a cured product thereof.

The present invention relates to a resin composition for GHz-band electronic components, the composition comprising nanoscale carbon tubes and at least one member selected from the group consisting of thermoplastic resins, curable resins, and composite resins of thermoplastic resins and curable resins; wherein the nanoscale carbon tubes are present in an amount of 0.0001 to 0.4 wt. % based on the resin; and an electronic component obtainable from the resin composition, or the like.

To provide a thermosetting resin composition having excellent film-forming properties, which can form a cured product having low elastic modulus and having low dielectric constant and low dielectric loss tangent in a high frequency range; and a thermosetting resin composition comprising (A) a vinyl compound represented by the general formula (1), and (B) a rubber and/or a thermoplastic elastomer.

A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y). The polyimide resin is obtained by reacting a prepolymer (A) having an isocyanate group at the end, which is obtained by reacting a polyisocyanate compound (a1) with a polyol compound (a2) having a linear hydrocarbon structure in which a number-average molecular weight of a linear hydrocarbon structure is from 300 to 6,000, with an anhydride (B) of polycarboxylic acid having three or more carboxyl groups in an organic solvent.

Disclosed is a method for producing a curing agent having an acidic substituent and an unsaturated maleimide group, wherein a maleimide compound (a) having at least two N-substituted maleimide groups in a molecule and an amine compound (b) having an acidic substituent represented by the general formula (I) below are reacted in an organic solvent. Also disclosed is a thermosetting resin composition containing a curing agent (A) obtained by the above-described method, and a compound (B) which is cured with the curing agent. A cured product of such a thermosetting resin composition has a glass transition temperature of not less than 200 DEG C. Further disclosed are a prepreg using such a thermosetting resin composition, and a laminate. The curing agent produced by this method enables to obtain a thermosetting resin composition having good solubility in an organic solvent, while being excellent in adhesion to metal foils, heat resistance, moisture resistance, flame retardance, copper cladding heat resistance, low dielectric characteristics and low dielectric loss tangent property. Consequently, the curing agent enables to obtain a prepreg or a laminate having excellent properties useful for printed wiring boards for electronic devices.

To provide a prepreg that achieves a low dielectric loss tangent, despite the use of a polar solvent.

A prepreg produced by impregnating or coating a base material with a varnish comprising an inorganic filler, a polar solvent, and a resin composition principally comprising polyphenylene ether, and subjecting the base material treated to a drying step, wherein the polar solvent content of the prepreg is 3 mass % or less, and a dielectric loss tangent at 10 GHz of a laminated board produced using this prepreg is 0.001-0.007.

To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

A resin composition constituting dielectric resin films of a film capacitor includes a first atom group including at least one functional group selected from among a methylene group, an aromatic ring and an ether group and having a relatively small molar polarizability, and a second atom group including at least one functional group selected from among a hydroxyl group, an amino group and a carbonyl group and having a relatively large molar polarizability. The resin composition satisfies the condition that a value calculated from the formula (sum of absorption band intensities of first atom group)/(sum of absorption band intensities of second atom group) is 1.0 or more. Herein, as absorption band intensities of the functional groups, peak intensities detected in specific wavenumber ranges are employed.

The present invention relates to a coupling agent containing diphenylsulfone amino-silane and the related preparation method, which is technically characterized in that 4,4-diphenylsulfone and gamma-chloropropthyl type silane are taken as raw materials and dimethyl formamide is used as the solvent. Preparation steps are as follows: the solvent dimethyl formamide and the raw materials 4,4-diphenylsulfone are sequentially added to three flasks to be stirred until dissolved, then nitrogen gas is input to the flasks; when the flasks are slowly heated to 100 or 150 DEG C, a certain amount of gamma-chloropropthyl type silane are dropped into the flasks, after that, the liquid in the flasks is reflowed to 5 - 15 h at the right temperature; then, the coupling agent can be produced after decompression distillation and the removal of the solvent. The introduction of diphenylsulfone reduces the polarity of active amido, so that the coupling agent is provided with a low dielectric loss angle tangent value. When the coupling agent is used for glass fiber-reinforced epoxy resin or cyanate ester resin and other thermosetting resin composite materials, the dielectric performance of such composite materials can be increased, therefore, the coupling agent is widely applied to wave-transparent composite material field, such as antennas and radomes.

The invention provides a method for producing a curing agent having an acidic substituent and an unsaturated maleimido group, including reacting, in an organic solvent, a maleimide compound (a) having at least two N-substituted maleimido groups in a molecule thereof with an amine compound (b) having an acidic substituent (represented by formula (I)); a thermosetting resin composition containing the curing agent (A) produced through the method and a compound (B) which is cured with the curing agent, wherein a cured product of the composition has a glass transition temperature of 200° C. or higher; and a prepreg and a laminated sheet produced therefrom. The curing agent produced through the method of the present invention has good solubility in an organic solvent and can provide a thermosetting resin composition exhibiting excellent adhesion-to-metal foil property, heat resistance, moisture resistance, flame retardancy, and copper cladding heat resistance, and low dielectric properties and low dielectric loss tangent. Therefore, the thermosetting resin composition can produce a prepreg or laminated sheet exhibiting excellent performance suitable for a printed wiring board for electronic devices and similar devices.

Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN.