Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

a technology of thermosetting resin and resin varnish, which is applied in the direction of resistive material coating, synthetic resin layered products, elastomeric polymer dielectrics, etc., can solve the problems of large loss, unsatisfactory workability of fluororesin, dimensional stability, and adhesion to metal plating, and achieve excellent heat resistance, excellent high frequency properties, and excellent moisture absorption.

Inactive Publication Date: 2013-02-14
FUJIMOTO DAISUKE +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0066]By the process for producing a resin varnish of the present invention, there can be provided a resin varnish, a prepreg, and a metal-clad laminate, which are advantageous not only in that, when used in a printed circuit board, they exhibit excellent high frequency properties and excellent moisture absorption dependency of them, excellent heat resistance (particularly, excellent heat resistance after moisture absorption), and low thermal expansion properties, but also in that they have metallic foil peeling strength satisfactorily improved. Therefore, the present invention is advantageously used in the application of a member or part for printed circuit board for use in various electric or electronic devices, e.g., mobile communication devices using high frequency signals having, for example, a frequency of 1 GHz or more and devices for their base stations, network-associated electronic devices, such as a server and a router, and large-size computers.

Problems solved by technology

That is, the electric signal having a higher frequency has properties such that the output is likely to weaken in a shorter transmission distance to cause large loss.
However, the fluororesin generally has a high melt temperature, a high melt viscosity, and relatively low flowability, and therefore has a problem in that high-temperature and high-pressure conditions must be employed in the pressing for the fluororesin.
In addition, the fluororesin also has a problem in that, when applied to the use of high-multilayer printed circuit board for use in the above-mentioned communication devices, network-associated electronic devices, large-size computers, and others, the fluororesin is unsatisfactory in the workability, dimensional stability, and adhesion to the metal plating.

Method used

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  • Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
  • Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate
  • Process for producing resin varnish containing semi-ipn composite, thermosetting resin and, provided using the same, resin varnish for printed wiring board, prepreg and metal-clad laminate

Examples

Experimental program
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Effect test

preparation example 1

[0133](a) In a one-liter separable flask equipped with a thermometer, a reflux condenser, a vacuum evaporator, and a stirrer were placed 350 parts by weight of toluene and 50 parts by weight of polyphenylene ether (S202A, manufactured by Asahi Kasei Chemicals Corporation; Mn: 16,000) as component (A), and the solid component was dissolved by stirring at a temperature of 90° C. inside the flask. Then, to the resultant solution were added 100 parts by weight of a chemically unmodified butadiene polymer (B-3000, manufactured by NIPPON SODA CO., LTD.; Mn: 3,000; 1,2-vinyl structure: 90%) as component (B), 40 parts by weight of bis(4-maleimidophenyl)methane (BMI-1000, manufactured by DAIWA KASEI CO., LTD.) as component (C), and methyl isobutyl ketone (MIBK) as a solvent in such an amount that the solids content (nonvolatile content) of the resultant solution became 30% by weight, and stirring was continued and dissolution or uniform dispersion of the components was confirmed. Then, the t...

preparation example 2

[0135](a) A polyphenylene ether-modified butadiene prepolymer was obtained in substantially the same manner as in Preparation Example 1 except that, instead of the bis(4-maleimidophenyl)methane used in item (a) of Preparation Example 1, 30 parts by weight of polyphenylmethanemaleimide (BMI-2000, manufactured by DAIWA KASEI CO., LTD.) was used. A conversion rate of BMI-2000 in the polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography. As a result, it was found that the conversion rate was 35%.

[0136](b) Subsequently, into 50 parts by weight of MIBK as component (F) were mixed 110 parts by weight of spherical silica (SO-25R, manufactured by Admatechs Co., Ltd.; average particle size: 0.5 μm) as component (D), 2.4 parts by weight of p-styryltrimethoxysilane (KBM-1403, manufactured by Shin-Etsu Chemical Co., Ltd.), and 120 parts by weight (30 parts by weight in terms of the solids) of a solution of a saturated thermoplastic elastomer {hy...

preparation example 3

[0137](a) A polyphenylene ether-modified butadiene prepolymer was obtained in substantially the same manner as in Preparation Example 1 except that, instead of the bis(4-maleimidophenyl)methane used in item (a) of Preparation Example 1, 35 parts by weight of 2,2-bis[4-(4-maleimidophenoxy)phenyl]propane (BMI-4000, manufactured by DAIWA KASEI CO., LTD.) was used. A conversion rate of BMI-4000 in the polyphenylene ether-modified butadiene prepolymer solution was measured by gel permeation chromatography. As a result, it was found that the conversion rate was 25%.

[0138](b) Subsequently, a resin varnish (solids content: about 40% by weight) in Preparation Example 3 was prepared in substantially the same manner as in Preparation Example 1 except that, instead of KBM-1003 used as a surface treatment agent as component (D) in item (b) of Preparation Example 1, N-phenyl-3-aminopropyltrimethoxysilane (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.) was used, and that, instead of H1043 ...

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Abstract

A thermosetting resin varnish that includes a thermosetting resin composition of an uncured semi-IPN composite having compatibilized with one another (A) a polyphenylene ether, (B) a butadiene polymer which contains in the molecule thereof 40% or more of a 1,2-butadiene unit having a 1,2-vinyl group in the side chain thereof, and which is not chemically modified, and (C) a crosslinking agent; (D) an inorganic filler; and (E) a saturated thermoplastic elastomer. Also, a resin varnish for a printed circuit board, a prepreg, and a metal-clad laminate, using the thermosetting resin varnish.

Description

[0001]This application is a Divisional application of prior application Ser. No. 12 / 596,165, filed Oct. 16, 2009, the contents of which are incorporated herein by reference in their entirety. No. 12 / 596,165 is a National Stage application filed under 35 USC 371, of International (PCT) Application No. PCT / JP2008 / 058010, filed Apr. 25, 2008.FIELD OF THE INVENTION[0002]The present invention relates to a process for producing a resin varnish containing a thermosetting resin of semi-IPN composite and, a resin varnish for printed circuit board, a prepreg, and a metal-clad laminate obtained by using the same. More particularly, the present invention concerns a process for producing a novel resin varnish for printed circuit board usable in an electronic device having an operating frequency of more than 1 GHz and, a resin varnish for printed circuit board, a prepreg, and a metal-clad laminate obtained by using the process.BACKGROUND INVENTION[0003]Mobile communication devices including cell ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C09D109/00B32B15/08H05K3/00
CPCB32B5/28B32B15/14H05K2201/0209H05K2201/0158H05K2201/0133H05K1/0353H05K1/024C08L71/12C08L47/00C08L21/00C08L15/00C08L9/00C08K3/0033C08J2387/00C08J5/24B32B27/04C08J3/246C08L2666/14C08L71/00B32B2260/021B32B2260/046B32B2262/101B32B2264/10B32B2274/00B32B2307/306B32B2307/3065B32B2307/726B32B2457/08C08K3/013Y10T428/31696C08J5/244C08J5/249C08F299/00B32B15/08
Inventor FUJIMOTO, DAISUKEMIZUNO, YASUYUKIDANJOUBARA, KAZUTOSHIMURAI, HIKARI
Owner FUJIMOTO DAISUKE
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