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Modified polyphenylene ether resin, thermosetting resin composition and application thereof

A technology of polyphenylene ether resin and resin composition, applied in the field of polymers, can solve the problems of poor compatibility between PPO and epoxy resin, poor processability, harsh curing conditions, etc., to avoid a significant decrease in Tg and improve compatibility. Poor properties and the effect of improving cross-linking density

Active Publication Date: 2019-07-09
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problems of poor compatibility between PPO and epoxy resin, low density of functional groups capable of effective crosslinking reactions, harsh curing conditions, phase separation of cured products, low bonding force with metals, and poor processability, the purpose of the present invention One of them is to provide a modified polyphenylene ether resin, which is obtained by modifying low molecular weight double-terminated hydroxyl polyphenylene ether

Method used

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  • Modified polyphenylene ether resin, thermosetting resin composition and application thereof
  • Modified polyphenylene ether resin, thermosetting resin composition and application thereof
  • Modified polyphenylene ether resin, thermosetting resin composition and application thereof

Examples

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Embodiment

[0069] (1) Synthesis of modified polyphenylene ether resin of formula (I) structure

[0070] Put 1mol (425g) RPE-HL and 1500g tetrahydrofuran into a flask equipped with a thermometer, dropping funnel, and stirrer, blow in nitrogen, and stir until completely dissolved. Then, drop in 0.7mol (142.1g) isophthaloyl chloride and stir to dissolve, then, control the temperature of the system below 20°C, slowly add (more than 0.5 hours) 1.4mol (141.4g) triethylamine (prepared to 20% Triethylamine / tetrahydrofuran solution was added dropwise). Next, the stirring reaction was continued for 2.0 to 3.0 hours below 20°C. Next, 0.4 mol (37.6 g) of phenol was added, and the stirring reaction was continued for 2.0 hours below 20°C. Stand still after the reaction is complete, filter to remove the triethylamine hydrochloride solid, carry out vacuum distillation and concentration in the solution, then add methanol to separate out the resin product, filter, wash with water until the pH value of t...

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Abstract

The invention relates to a modified polyphenylene ether resin, a thermosetting resin composition and application thereof. The modified polyphenylene ether resin has a resin structure obtained by reacting a low-molecular-weight dihydroxy-terminated polyphenylene ether represented by formula (1-1) with a diacyl halide or dicarboxylic acid containing a structural unit represented by formula (1-2), amonofunctional aromatic phenol or a monofunctional aromatic acyl halide or a monofunctional aromatic carboxylic acid. The thermosetting resin composition contains, as essential components, an epoxy resin and the modified polyphenylene ether resin. The invention also provides application of the thermosetting resin composition in prepregs, circuit boards and laminated films. The prepreg, the circuitsubstrate and the laminated film prepared from the thermosetting resin composition provided by the invention have the advantages of low dielectric constant, low tangent of dielectric loss angle highglass transition temperature, excellent heat resistance, excellent wet heat resistance, low hygroscopicity and good binding force with metal.

Description

technical field [0001] The technical field of macromolecules of the present invention specifically relates to a modified polyphenylene ether resin, a thermosetting resin composition and its application, especially to a modified polyphenylene ether resin containing an active ester group in the main chain and a thermosetting resin composition thereof , and cured products, prepregs, circuit substrates and laminated films made of the thermosetting resin composition. Background technique [0002] In recent years, with the development of electronic information technology, the miniaturization and high density of electronic equipment installation, the large capacity and high frequency of information, the dielectric properties, heat resistance, heat and humidity resistance and mechanical properties of circuit boards have been greatly affected. , Dimensional stability, water absorption, chemical resistance and other comprehensive properties put forward higher requirements. [0003] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G65/44C08G65/48C08L63/00C08L71/12B32B15/08B32B27/04B32B37/06B32B27/28
CPCB32B15/08B32B27/06B32B27/285B32B37/06B32B2260/046C08G65/44C08G65/48C08L63/00C08L71/12
Inventor 林伟范华勇许永静
Owner GUANGDONG SHENGYI SCI TECH
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