Resin composition and prepreg and laminate manufactured by using same

Abstract

The invention discloses a resin composition, which comprises the following components with solids by weight: (a) 10-90 parts of cyanate ester modified polyphenylene oxide resin; (b) 10-90 parts of allyl modified bismaleimide resin; (c) 0-30 parts of epoxy resin; (d) 0-30 parts of cyanate ester resin; (e) 10-50 parts of phosphonium flame retardant; (f) 0-5 parts of curing accelerator; and (g) 0-90 parts of inorganic filler, wherein the number-average molecular weight of the cyanate ester modified polyphenylene oxide resin is 3000-7000g / mol; and the cyanate ester modified polyphenylene oxide resin is prepared by reacting 100 parts of polyphenyl ether resin and 40-250 parts of cyanate ester resin at the temperature of 90-160 DEG C for 30-120 min. The invention provides the resin composition with favorable heat resistance, and low dielectric constant and dielectric loss tangent value, and solves the problem that in the prior art, the bismaleimide resin and the polyphenyl ether resin are difficultly combined and blended.

Description

technical field [0001] The invention belongs to the technical field of electronic materials, and relates to a resin composition and a prepreg and a laminate made of the resin composition, which can be applied to the fields of integrated circuit packaging, high-frequency, high-speed and high-density interconnection, and the like. Background technique [0002] With the rapid development of electronic science and technology, the information processing of electronic products such as mobile communications, servers, and large computers continues to develop in the direction of "high-frequency signal transmission and high-speed digitalization", which requires the production of printed circuit boards. The material not only has a low dielectric constant (ε), but also has a low dielectric loss tangent (tanδ) to meet the requirements of low loss and high-speed information processing. At the same time, the application of "lead-free" and "high-density interconnection" technologies require...

AI Technical Summary

Problems solved by technology

However, it has been found in practical applications that if the allyl-modified bismaleimide resin and polyphenylene ether resin (including low molecular weight polyphenylene ether resin) are simply mixed or dissolved in organic solvents such as butanone, There will be obvious phase separation between the two, and the allyl-modified bismaleimide resin will precipitate out of the solution, and it will not be possible to form a homogeneous resin or a transparent and clear solution

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