A method of making precise alignment and decal bonding of a pattern of solder preforms to a surface comprising
cutting and placing a length of a solder ribbon onto a
semiconductor release tape forming a solder ribbon and
semiconductor release tape combination, placing the solder ribbon and
semiconductor release tape combination on a vacuum chuck on X-Y stage pair in a
laser micromachining
system, adjusting the working distance,
laser-
cutting an outline, peeling off the solder ribbon, allowing the desired solder shape to remain, creating indexing holes, providing a
target surface on an alignment fixture with indexing pins, aligning the indexing holes, placing the semiconductor release tape with the desired solder shape on the
target surface, pressing the desired solder shape onto the
target surface, removing the release tape, and making a pattern of the desired solder shape with precise alignment and decal bonding on the target surface.