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A high-temperature hot stamping film for making conductive circuits, its manufacturing method and application

A conductive circuit and manufacturing method technology, applied in transfer printing, conductive pattern formation, photolithography/patterning, etc., can solve the problems of stretching and deformation of the film, the inability to obtain metal coatings, etc., and achieve the effect of low cost and simple structure

Active Publication Date: 2018-11-06
WUHAN WEDO INFORMATION & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Both of these methods make the temperature of the film surface rise due to heat radiation in the evaporation chamber, resulting in stretching deformation of the film.
Therefore, the conventional aluminum plating process cannot obtain a metal coating that meets the conductive requirements

Method used

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  • A high-temperature hot stamping film for making conductive circuits, its manufacturing method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Coating silicone oil separation layer 1.5g / m2 on 25 micron PET 2 , The measured peeling value is 19.2g / inch. Aluminum is evaporated on a vacuum aluminum plating machine. ×10 -5 Torr's High Vacuum Metallized Aluminum. The conductive square resistance of the conductive layer was measured to be 42 milliohms, and the hot melt adhesive was coated with 1.5g / m 2 , The fixed peeling value of hot stamping film is 3.4g / inch. For a line with a width of 1.6mm hot stamped on coated paper, the burr is 0.08mm.

Embodiment 2

[0036] Coating water-wax separation layer 3g / m on 20 micron PEN 2 , The measured peeling value was 15.2g / inch. Copper was evaporated on a vacuum aluminum plating machine. ×10 -5 Copper metallization under Torr's high vacuum. The conductive square resistance of the conductive layer was measured to be 35 milliohms, and the hot melt adhesive was coated with 2.8g / m 2 , the fixed peeling value is 3.4g / inch. The line burr with a width of 1.0mm on the hot stamping of the PCB is 0.12mm.

Embodiment 3

[0038] Coating water-wax separation layer 2.5g / m on 22 micron PEN 2 , The peeling value was measured to be 17.5g / inch. Copper was evaporated on a vacuum aluminum plating machine. ×10 -5 Copper metallization under Torr's high vacuum. The conductive square resistance of the conductive layer was measured to be 35 milliohms, and the hot melt adhesive was coated with 2.8g / m 2 , the fixed peeling value is 3.4g / inch. The line burr with a width of 1.0mm on the hot stamping of the PCB is 0.12mm.

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Abstract

The invention relates to the technical field of hot stamping, in particular to a high-temperature hot stamping film for making conductive circuits, a manufacturing method and application thereof. The high-temperature hot stamping film includes a base layer, a release layer, a conductive layer and a hot-melt adhesive layer in sequence, and the required conductive lines can be hot-stamped at a temperature of 160-180°C by using ironing heads of different shapes. The conductive circuit hot stamping special film of the present invention has a simple structure and low cost, and can be used to prepare various irregular conductive circuits, such as RFID antennas, connecting wires on PCB boards, and the like.

Description

technical field [0001] The invention relates to the technical field of hot stamping, in particular to a high-temperature hot stamping film for making conductive circuits, a manufacturing method and application thereof. Background technique [0002] Hot stamping technology, also known as hot stamping technology, is a mature technology widely used in printing technology. It uses hot stamping equipment and hot stamping dies with patterns to heat and pressurize. It will be used for decorative and aesthetic hot stamping. A film (commonly called anodized aluminum) material is transferred to the printing surface. The hot stamping film (anodized aluminum) used for printing hot stamping consists of a substrate, a release layer, an imaging layer, a reflective layer, and a hot melt adhesive layer. The reflective layer is obtained by vacuum aluminum plating, with a thickness of 200-300 angstroms, a square resistance of more than 200 milliohms, and poor electrical conductivity. Therefo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/12
CPCH05K3/12H05K2203/0531
Inventor 陈建军李中军曹珏陈亮
Owner WUHAN WEDO INFORMATION & TECH
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