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High-temperature hot stamping film for manufacturing conductive wires, manufacturing method and application for high temperature hot stamping film

A technology of conductive circuit and manufacturing method, which is applied in the direction of transfer printing, conductive pattern formation, photolithography/patterning, etc., can solve the problems of inability to obtain metal coating, film stretching deformation, etc., and achieve the effect of simple structure and low cost

Active Publication Date: 2016-02-10
WUHAN WEDO INFORMATION & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Both of these methods make the temperature of the film surface rise due to heat radiation in the evaporation chamber, resulting in stretching deformation of the film.
Therefore, the conventional aluminum plating process cannot obtain a metal coating that meets the conductive requirements

Method used

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  • High-temperature hot stamping film for manufacturing conductive wires, manufacturing method and application for high temperature hot stamping film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Coating silicone oil separation layer 1.5g / m2 on 25 micron PET 2 , The measured peeling value is 19.2g / inch. Aluminum is evaporated on a vacuum aluminum plating machine. ×10 -5 Torr's High Vacuum Metallized Aluminum. The conductive square resistance of the conductive layer was measured to be 42 milliohms, and the hot melt adhesive was coated with 1.5g / m 2 , The fixed peeling value of hot stamping film is 3.4g / inch. For a line with a width of 1.6mm hot stamped on coated paper, the burr is 0.08mm.

Embodiment 2

[0036] Coating water-wax separation layer 3g / m on 20 micron PEN 2 , The measured peeling value was 15.2g / inch. Copper was evaporated on a vacuum aluminum plating machine. ×10 -5 Copper metallization under Torr's high vacuum. The conductive square resistance of the conductive layer was measured to be 35 milliohms, and the hot melt adhesive was coated with 2.8g / m 2 , the fixed peeling value is 3.4g / inch. The line burr with a width of 1.0mm on the hot stamping of the PCB is 0.12mm.

Embodiment 3

[0038] Coating water-wax separation layer 2.5g / m on 22 micron PEN 2 , The peeling value was measured to be 17.5g / inch. Copper was evaporated on a vacuum aluminum plating machine. ×10 -5 Copper metallization under Torr's high vacuum. The conductive square resistance of the conductive layer was measured to be 35 milliohms, and the hot melt adhesive was coated with 2.8g / m 2 , the fixed peeling value is 3.4g / inch. The line burr with a width of 1.0mm on the hot stamping of the PCB is 0.12mm.

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Abstract

The invention relates to the technical field of hot stamping, and in particular to a high-temperature hot stamping film for manufacturing conductive wires, a manufacturing method and an application for the high temperature hot stamping film. The high-temperature hot stamping film comprises a base layer, a release layer, a conductive layer and a hot glue-melting layer in sequence; and required conductive wires can be manufactured by hot stamping heads of different shapes at the temperature of 160-180 DEG C. The special hot stamping film for the conductive wires is simple in structure, low in cost, and can be used for preparing various kinds of irregular conductive wires, such as rfid antenna, connection wires on pcb and the like.

Description

technical field [0001] The invention relates to the technical field of hot stamping, in particular to a high-temperature hot stamping film for making conductive circuits, a manufacturing method and application thereof. Background technique [0002] Hot stamping technology, also known as hot stamping technology, is a mature technology widely used in printing technology. It uses hot stamping equipment and hot stamping dies with patterns to heat and pressurize. It will be used for decorative and aesthetic hot stamping. A film (commonly called anodized aluminum) material is transferred to the printing surface. The hot stamping film (anodized aluminum) used for printing hot stamping consists of a substrate, a release layer, an imaging layer, a reflective layer, and a hot melt adhesive layer. The reflective layer is obtained by vacuum aluminum plating, with a thickness of 200-300 angstroms, a square resistance of more than 200 milliohms, and poor electrical conductivity. Therefo...

Claims

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Application Information

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IPC IPC(8): H05K3/12
CPCH05K3/12H05K2203/0531
Inventor 陈建军李中军曹珏陈亮
Owner WUHAN WEDO INFORMATION & TECH
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