Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Spherical circuit transfer printing technology

A circuit, spherical technology, applied in the transfer method, printed circuit components, three-dimensional rigid printed circuit boards, etc., can solve the problem of unable to produce spherical circuit boards

Active Publication Date: 2017-01-11
苏州昌利橡塑科技有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing circuit board production process, especially the printed circuit board production process, cannot produce spherical circuit boards

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Spherical circuit transfer printing technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The present invention will be described in further detail below by means of specific embodiments:

[0030] The reference signs in the drawings of the description include: lower frame 1, upper frame 2, support 3, friction wheel 301, base 4, printing mechanism 5, electric thermal sensor 501, pure copper wire 502, mold 6, concave Groove 601, cover plate 602, injection hole 603, circular hole 604, powder spraying mechanism 7, electromagnet 8, thimble 801, magnetic brush 9, blind hole 10.

[0031] The present invention will be described in further detail below by means of specific embodiments:

[0032] The present invention can be implemented with a spherical circuit transfer printing machine, which includes a frame, the frame includes a lower frame 1 and an upper frame 2, the upper frame 2 is located above the lower frame 1, and the lower frame 1 rotates Four supports 3 are connected, and each support 3 is connected with a first servo motor, and each support 3 is connected...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of circuit board production technology, and discloses a spherical circuit transfer printing technology. The technology comprises the following steps: 1, installing a spherical substrate; 2, enabling the spherical substrate to be magnetized, and spraying iron powder to the surface of the substrate through a power spraying mechanism; 3, rotating the substrate to a zero position, and moving a printing mechanism to a part exactly above the substrate; 4, enabling the printing mechanism to draw the surface of the substrate through melt fine copper during the rotating of the substrate, and forming a spherical circuit; 5, rotating the substrate to the zero position, and limiting the rotation of the substrate; 6, moving the printing mechanism, moving the die with a hemispherical groove to a part exactly above the substrate, moving the die downwards, enabling a part, provided with the circuit, of the substrate to be placed in the groove, and sealing the mouth of the groove; 7, injecting a liquid substrate material into the groove of the die, and taking out a circuit board after the substrate material of the circuit board is solidified. The invention aims at providing the spherical circuit transfer printing technology, so as to product the spherical circuit board.

Description

technical field [0001] The invention relates to the field of circuit board production technology, in particular to a technology for producing spherical circuit boards. Background technique [0002] The circuit board is an insulating board with connected conductors, on which electronic components are fixed and connected to form a circuit. The current production of circuit boards generally adopts copper foil coating on the substrate, the substrate and copper foil are bonded through the glue layer, and then photolithography, corrosion, post-processing processes, etc. are performed. Most of the circuit boards produced are planar circuit boards, and even the flexible printed circuit board (FPCB) is also a plane that can be bent into an arc. [0003] For some special devices, such as making spherical LED lighting devices and spherical displays, it is necessary to print spherical circuits on the spherical base surface. The existing circuit board production process, especially the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/12H05K1/02
CPCH05K1/0284H05K3/12H05K2203/0531
Inventor 王辉
Owner 苏州昌利橡塑科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com